Patents by Inventor Jiangyuan Qian

Jiangyuan Qian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8074346
    Abstract: The methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: December 13, 2011
    Assignee: The Regents of the University of California
    Inventors: Jiangyuan Qian, Hung-Pin Chang, Bedri A. Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li
  • Patent number: 7884689
    Abstract: Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature disposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: February 8, 2011
    Assignee: The Regents of the University of California
    Inventors: Bedri A. Cetiner, Mark Bachman, Guann-Pyng Li, Jiangyuan Qian, Hung-Pin Chang, Franco De Flaviis
  • Patent number: 7541898
    Abstract: The systems and methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: June 2, 2009
    Assignee: Regents of the University of California
    Inventors: Jiangyuan Qian, Hung-Pin Chang, Bedri A. Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li
  • Publication number: 20080127482
    Abstract: The systems and methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.
    Type: Application
    Filed: September 4, 2007
    Publication date: June 5, 2008
    Inventors: Jiangyuan Qian, Hung-Pin Chang, Bedri A. Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li
  • Publication number: 20080129426
    Abstract: The systems and methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.
    Type: Application
    Filed: September 4, 2007
    Publication date: June 5, 2008
    Inventors: Jiangyuan Qian, Hung-Pin Chang, Bedri A. Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li
  • Patent number: 7265647
    Abstract: The systems and methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: September 4, 2007
    Assignee: The Regents of the University of California
    Inventors: Jiangyuan Qian, Hung-Pin Chang, Bedri A. Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li
  • Publication number: 20060238951
    Abstract: Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature disposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.
    Type: Application
    Filed: July 3, 2006
    Publication date: October 26, 2006
    Inventors: Bedri Cetiner, Mark Bachman, Guann-Pyng Li, Jiangyuan Qian, Hung-Pin Chang, Franco De Flaviis
  • Patent number: 7084724
    Abstract: Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature deposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: August 1, 2006
    Assignee: The Regents of the University of California
    Inventors: Bedri A. Cetiner, Mark Bachman, Guann-Pyng Li, Jiangyuan Qian, Hung-Pin Chang, Franco De Flaviis
  • Publication number: 20050248423
    Abstract: The systems and methods described herein provide for a radio frequency micro-electromechanical systems switch having two or more resonant frequencies. The switch can be configured as a capacitive shunt switch having a deflectable member coupled between two electrodes over a transmission line. A first insulator can be located between one of the electrodes and the deflectable member to form a capacitive element. The deflectable member can be deflectable between an up-state and a down-state, the down-state capacitively coupling the deflectable member with the transmission line. The degree by which the deflectable member overlaps the first insulator can be adjusted to adjust the capacitance of the capacitive element and the resulting resonant frequency.
    Type: Application
    Filed: March 14, 2005
    Publication date: November 10, 2005
    Inventors: Jiangyuan Qian, Hung-Pin Chang, Bedri Cetiner, Mark Bachman, Franco DeFlaviis, Guann-Pyng Li
  • Publication number: 20050062653
    Abstract: Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature deposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.
    Type: Application
    Filed: December 31, 2003
    Publication date: March 24, 2005
    Inventors: Bedri Cetiner, Mark Bachman, Guann-Pyng Li, Jiangyuan Qian, Hung-Pin Chang, Franco De Flaviis