Abstract: A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer.

Abstract: A panel display device is provided, which includes: a transparent back panel having a first surface and a second surface, where the first surface is adapted for reflecting incident lights from the outside, and the second surface is adapted for transmitting lights from the outside; a backlight source, disposed at one side of the second surface of the transparent back panel, which is adapted for emitting lights to the transparent back panel; a polarized grating, disposed at one side of the first surface of the transparent back panel, which includes a plurality of grating strips with gaps formed between neighbouring grating strips, where the polarized grating enables the incident lights from the transparent back panel to be polarized and then pass through the gaps; a semiconductor switch array; and a transmission light valve array. The panel display device of the disclosure increase the utilization efficiency of lights.

Abstract: An optical path switch and an optical router are provided. The optical path switch comprises an input optical path (100), two output optical paths (201, 202), and an optical path switching element (300). The optical path switching element selectively routes the beam from the input optical path to one of the output optical paths. The optical path switching element comprises a semiconductor substrate (301), an inter-layer dielectric layer (307) on the surface of the semiconductor substrate, a cavity (302) disposed in the inter-layer dielectric layer, and an elastic light guiding plate (306) disposed in the cavity. One end of the cavity is connected with the input optical path, and the other end is separated into an upper cavity (304) and a lower cavity (305) by an isolating layer (303).

Abstract: A low temperature wafer bonding method and a bonded structure are provided. The method includes: providing a first substrate having a plurality of metal pads and a first dielectric layer close to the metal pads, where the metal pads and the first dielectric layer are on a top surface of the first substrate; providing a second substrate having a plurality of semiconductor pads and a second dielectric layer close to the semiconductor pads, where the semiconductor pads and the second dielectric layer are on a top surface of the second substrate; disposing at least one of the metal pads in direct contact with at least one of the semiconductor pads, and disposing the first dielectric layer in direct contact with the second dielectric layer; and bonding the metal pads with the semiconductor pads, and bonding the first dielectric layer with the second dielectric layer.

Abstract: A light modulator pixel unit and a method for manufacturing the same are provided. The light modulator pixel unit includes top, movable and bottom electrodes. Under control of a control circuit, the movable electrode may shift to first, second and third positions corresponding to modulations of first, second and third monochromatic lights, respectively. When the movable electrode is at a certain position, the incident light corresponding to the position may be divided into two parts, one is reflected by the top electrode, and the other one may bypass the top electrode and be reflected by the movable electrode. The two parts may interfere destructively. The light modulator pixel unit of the present invention can control monochromatic lights of three special wavelengths by time division, and enable color control and gray control. The unit is applicable in the field of projection display and panel system.

Abstract: A micro-electro-mechanical system based device for adjusting aperture and a manufacturing method thereof are disclosed. The system includes: an opaque deformable aperture ring, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable aperture ring and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable aperture ring, and their external edges are connected with the fixed parts. The conductive structs are connected with the fixed parts and remain stationary.

Abstract: A micro-electro-mechanical system based focusing device and manufacturing method thereof are disclosed. The system includes: a deformable lens, multiple groups of conductive deformable crossbeams and conductive structs; and one or more fixed parts. In each group, each conductive deformable crossbeam corresponds to a conductive struct. The conductive deformable crossbeams and the conductive structs are arranged around the deformable lens and spaced from each other. The conductive deformable crossbeams are suspended in the air, their inner edges are connected with an external edge of the deformable lens and their external edges are connected with the fixed parts. The conductive structs are fixedly connected with the fixed parts and remain stationary. Electrostatic force between the conductive deformable crossbeam and the conductive struct causes the deformable lens to be stretched and rotate, thus, surface curvature and focal length are changed.

Abstract: A display device provided with an MEMS light valve, comprising: a substrate, a fixed grating located on the substrate, an MEMS light valve for controlling the opening and closing of the fixed grating; a guide is disposed on the substrate. The MEMS light valve comprises: a movable grating, a movable electrode and fixed electrodes; the moveable grating is located in the guide and is electrically connected to the guide when contacting the guide; one end of the movable electrode is fixedly connected with the movable grating, and the other end is suspended; and the fixed electrodes and the movable electrode form a capacitor. When a potential difference forms between the fixed electrodes and the movable electrode, the movable electrode drives the movable grating to move in the guide, thereby opening and closing the fixed grating. Therefore, the MEMS light valve sensitivity can be enhanced and reliability is improved.

Abstract: A display device provided with an MEMS light valve, comprising: a substrate, a fixed optical grating located on the substrate, an MEMS light valve for controlling the opening and closing of the fixed optical grating, the MEMS light valve comprises a first light valve and a second light valve; the opening and closing of the fixed optical grating is controlled via controlling the movement of the first light valve and the second light valve, and the moving directions of the first light valve and the second light valve are opposite. Also disclosed is a method for forming a display device provided with an MEMS light valve. Thus the sensitivity of the MEMS light valve is improved.

Abstract: The present invention relates to a pressure sensor, which may include a first electrode plate, a second electrode plate, a third electrode plate, a fourth electrode plate and a fifth electrode plate, which are successively laminated on a substrate, wherein the first electrode plate, the third electrode plate and the fourth electrode plate are fixed to the substrate, the first electrode plate and the second electrode plate are disposed opposite to each other and have a gap formed therebetween, the second electrode plate is suspended over the first electrode plate to constitute a first capacitor; the second electrode plate and the third electrode plate are disposed opposite to each other and have a gap formed therebetween, to constitute a second capacitor; and the fifth electrode plate is suspended over the fourth electrode plate to constitute a third capacitor, and can move along a direction perpendicular to the substrate.

Abstract: A low temperature wafer bonding method and a bonded structure are provided. The method includes: providing a first substrate having a plurality of metal pads and a first dielectric layer close to the metal pads, where the metal pads and the first dielectric layer are on a top surface of the first substrate; providing a second substrate having a plurality of semiconductor pads and a second dielectric layer close to the semiconductor pads, where the semiconductor pads and the second dielectric layer are on a top surface of the second substrate; disposing at least one of the metal pads in direct contact with at least one of the semiconductor pads, and disposing the first dielectric layer in direct contact with the second dielectric layer; and bonding the metal pads with the semiconductor pads, and bonding the first dielectric layer with the second dielectric layer.

Abstract: A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer.

Abstract: A stacked-gate non-volatile flash memory cell, a memory device including the memory cell, and a manufacturing method thereof are provided. The memory cell includes a semiconductor structure and a movable switch (200), wherein the semiconductor structure includes an extended floating gate structure, and an interlayer dielectric layer (114) with an opening (1204) through which the extended floating gate structure is exposed; meanwhile, the movable switch (200) includes a support component (210) and a conductive interconnection component (220), the support component (210) is located on the periphery of the conductive interconnection component and connected with the interlayer dielectric layer, and the conductive interconnection component is floating over the opening.

Abstract: A micro electro mechanical system (MEMS) device and a method of forming the same are provided. The MEMS device comprises a semiconductor substrate (100); a well region (110) formed in the semiconductor substrate (100); a source region(111), a drain region (112) and a channel region (113) formed in the well region (110); an isolating layer (120,130,140) formed on the surface of the source region (111) and the drain region (112); a gate dielectric layer (150) formed on the surface of the channel region (113); and a gate electrode layer (170) formed above the gate dielectric layer (150), a gap is provided between the gate dielectric layer (150) and the gate electrode layer 170), and the gap width corresponds to the channel region width. The method of forming MEMS device can be compatible with a conventional semiconductor forming process, without redeveloping a new type material and a new fabrication process.

Abstract: A crystal oscillator and manufacturing method thereof are provided.

Abstract: A light modulator pixel unit and the manufacturing method thereof are provided. The pixel unit includes a top electrode formed on a substrate, a movable electrode and a bottom electrode. Under the control of a control circuit, the position of the movable electrode would deflect. When the movable electrode is positioned in a first position, a first light is diffracted on the top electrode; when the movable electrode is positioned in a second position, a second light is diffracted on the top electrode; when the movable electrode is positioned in a third position, a third light is diffracted on the top electrode. The said first light, second light and third light are lights of three primary colors. The light modulator pixel unit of the present invention can modulate lights of three colors and is applicable in the field of micro-display system.

Abstract: An inertia MEMS sensor and a manufacturing method are provided. The inertia MEMS sensor includes a main body and a weight block relatively removable. The main body includes a first main body with a first surface and a second main body vertically connecting with the first surface. A first electrode parallel to the first surface is in the first main body. A second electrode perpendicular to the first surface is in the second main body. The weight block is suspended in a space defined by the first and second main bodies. The weight block includes a third electrode parallel to the first surface, a forth electrode is perpendicular to the first surface, and a weight layer. The third electrode connects with the forth electrode to form a U-shaped groove for accommodating the weight layer, thereby increasing the weight block weight, improving precision and reducing the cost.

Abstract: A micro-electro-mechanical microphone and manufacturing method thereof are provided in the invention. The micro-electro-mechanical microphone comprises: a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely by sensing the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner; the air gap cavity is connected with the back cavity through the air holes of the electrode plate; the back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate.

Abstract: A gyroscope and a manufacturing method are provided. The gyroscope comprises: a substrate with a bottom driving electrode and a bottom measuring electrode, and a dielectric layer with a sealed cavity comprising: a central axis on the substrate; a support ring on the substrate rotatable around the central axis; a mass ring surrounding and having common central axis with the support ring; cantilevers connected with the support ring and the mass ring and suspend the mass ring in the cavity; elastic components among the support ring, the mass ring and two adjacent cantilevers; a top driving electrode overlaying the support ring, the mass ring, the cantilevers and the elastic components; a conductive plug connected with top driving electrode and bottom driving electrode on the elastic components. The mass ring comprises an insulation layer and a weight layer. Stability and performance of the gyroscope may be improved.

Abstract: A Micro-Electro-Mechanical System (MEMS) device and its manufacturing method are provided. Said device comprises a MEMS component and said component comprises a main body (10) and a movable electrode (20). Said main body (10) contains a fixed electrode (110) and a cavity (30) and is covered by a first dielectric layer (400) which seals said cavity (30) into an enclosure. Said movable electrode (20) is connected with said main body (10) flexibly by a fixing piece and overhangs in said enclosure. Vias (405) are formed in said first dielectric layer (400) and filled with a second dielectric layer (500). The patent enables effective packaging for a MEMS device.