Abstract: The present invention provides metabolites of the antiviral drug bictegravir, including compositions and salts thereof, which are useful in the prevention and/or treatment of HIV as well as analytical methods related to the administration of bictegravir.

Abstract: A method of detecting defects includes: obtaining a gray-scale image of a substrate to be detected; obtaining a gray-scale difference g between different regions in the gray-scale image; calculating an estimated value of a film thickness difference d between the different regions in the gray-scale image according to the gray-scale difference g; and determining whether the substrate to be detected is qualified according to the estimated value of the film thickness difference d.

Abstract: A packaged integrated circuit (IC) device includes a first IC die with a first inductor, a first layer of adhesive on a first major surface of the first IC die, an isolation layer over the first layer of adhesive, a second layer of adhesive on the isolation layer, a second IC die on the second layer of adhesive, and a second inductor in the second IC die aligned to communicate with the first inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die.

Abstract: The invention discloses a Selective Laser Melting forming device for multiple metal powder materials. Technical solutions adopted are as follows: a collector container, a build cylinder and a feed container are provided on a lower portion of a process chamber; leveling oil cylinders for the substrate are mounted in the build cylinder; a recoater bracket in the process chamber is slidably mounted on a slide rail; a recoater is fixed on a lower portion of the recoater bracket; a compaction roller is simultaneously mounted on the recoater bracket; a stress sensor is provided under the compaction roller; an electron microscope for collecting the porosity of the spread powder and the product and a melting pool monitoring Charge Coupled Device camera; a laser scanning system, a directional heating laser system and an alarm device are provided on a top portion of the process chamber.

Abstract: The disclosure describes methods for treating or preventing HIV in a patient using a combination of tenofovir alafenamide and dolutegravir, and to compositions containing such compounds.

Abstract: A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.

Abstract: A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads.

Abstract: A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.

Abstract: A method of casting a base of high-power wind turbines with low-temperature nodular graphite iron, using furan resin sand as the mold sand and having no risers or chills in the mold. The mold undergoes microseismic compaction and has no chills risers. The parting face of the mold is perpendicular to the ground. The molten iron in the mold is solidified evenly. Therefore, shrinkage holes and disperse shrinkages base are reduced greatly and the dregs and air are discharged easily for the base. The pouring system designed together with a reasonable pouring rate and time make the filtering system useful for blocking dregs.

Abstract: A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads.

Abstract: A telescoping support member (42) is provided for supporting a central portion (38) of a cable management arm (24) for use with drawer slides (14, 16). The drawer slides (14, 16) each have a cabinet member (18), an intermediate member (20) and a chassis member (22). The cable management arm (24) is secured on one end to one of the chassis members (22) and on an other end to one of the cabinet members (18). The support member (42) has a first end (50) pivotally secured in fixed relation to one of the intermediate members (20) and a second end (52) pivotally secured in fixed relation to one of the cabinet members (18). Extension of the drawer slides (14, 16) extends the cable management arm (24) and the support member (42), with said support member (42) disposed beneath and in sliding engagement with the central portion (38) of the cable management arm (24).

Abstract: A method of casting the base of high-power wind turbines with low-temperature nodular graphite iron, use furan resin sand as the mold sand, and there is no riser or chill in the mold. The mold undergoes microseismic compaction, has no chill and riser, and when parting the parting face is perpendicular to the ground. The molten iron solidifies evenly, which greatly reduces the shrinkage holes and disperse shrinkage, and the dregs and air are easy to be discharged. The pouring system designed for the base, together with reasonable pouring rate and time, makes the system useful in blocking the dregs. All areas of the base need to meet the standards of EN DIN12680 Level 2 or Level 3 of the UT tests.

Abstract: A bearing drawer slide (10) has an inner slide member (16) which is slidably extensible from within an outer slide member (14). Captives bearings (28) have elongate bodies (29) for locating in fixed relation to a rearward end (20) of the inner slide member (16), disposed within the bearing spaces (48) between the inner slide member (16) and the outer slide member (14), with sides (31, 33) of the elongate bodies fitting against bearing races (36, 46) of the outer and inner slide members (14, 16). The captive bearings (28) are moveable with the inner slide member (16) relative to the outer slide member (14), and prevent movement of the rearward end (20) of the inner slide member (16) relative to the outer slide member (14) in directions which are transverse to the directions in which inner slide member (14) extends relative to the outer slide member (16), particularly when the inner slide member (14) is fully retracted within the outer slide member (16).

Abstract: A bearing drawer slide (10) has an inner slide member (16) which is slidably extensible from within an outer slide member (14). Captives bearings (28) have elongate bodies (29) for locating in fixed relation to a rearward end (20) of the inner slide member (16), disposed within the bearing spaces (48) between the inner slide member (16) and the outer slide member (14), with sides (31, 33) of the elongate bodies (29) fitting against bearing races (36, 46) of the outer and inner slide members (14, 16). The captive bearings (28) are moveable with the inner slide member (16) relative to the outer slide member (14), and prevent movement of the rearward end (20) of the inner slide member (16) relative to the outer slide member (14) in directions which are transverse to the directions in which inner slide member (14) extends relative to the outer slide member (16), particularly when the inner slide member (14) is fully retracted within the outer slide member (16).

Abstract: A pixel includes a surface configured to receive incident light and a floor formed by a semiconductor substrate. A photodetector is disposed in the floor. A dielectric structure is disposed between the surface and the floor. A volume of the dielectric structure between the surface and the photodetector provides an optical path configured to transmit a portion of the incident light upon the surface to the photodetector. An embedded optical element is disposed at least partially within the optical path and is configured to partially define the optical path.