Patents by Inventor Jianhu Wei

Jianhu Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250076576
    Abstract: Embodiments of the present disclosure may comprise a system for filling undercuts with an index-matching liquid on a wafer, the system comprising a plurality of edge couplers, each comprising an undercut and a waveguide. Embodiments may also comprise ribs that suspend the waveguide over the undercut. Embodiments may also comprise one or more main buckets and one or more monitor buckets. Embodiments may also comprise a duct that couples together the plurality of edge couplers, the one or more main buckets, and the one or more monitor buckets.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 6, 2025
    Inventors: Yao Sun, Jianhu Wei, Po Dong, Taylor Fryett, Wei Si, Shanshan Zeng, Tony Shi, Linjie Zhou, Yu Li