Abstract: A CD158d molecule, a neutralizing antibody thereof, and use thereof are provided. HS3ST3B1 positive tumor-related fibroblasts can mediate the death of killing lymphocytes and a new immune checkpoint molecule CD158d has been discovered. Based on the fact that the CD158d molecule can mediate the death of killing lymphocytes which is mediated by tumor fibroblasts, a neutralizing antibody capable of neutralizing the CD158d molecule has been obtained. Application of the CD158d molecule as a target in screening for or preparing a medicament for inhibiting tumor immune escape, and use of the CD158d neutralizing antibody in preparing a medicament for inhibiting tumor immune escape have been developed.

Abstract: A mounting structure includes base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner side. The outer side includes a plurality of bumps configured to engage the panel. The base wall includes a plurality of tabs. Each tab configured to receive a corresponding fastener to secure the base wall to the panel.

Abstract: Disclosed herein are systems and methods that can avoid fruitless decoding iterations by terminating fruitless decoding iterations at an early stage. A method comprises: iteratively decoding a codeword by a decoder until a number of iterations at which a syndrome weight of the codeword exceeds a predetermined threshold. The method may further comprise: comparing the syndrome weight of the codeword with a decoder syndrome weight threshold for the decoder; in response to that the syndrome weight of the codeword is greater than or no less than the decoder syndrome weight threshold, terminating decoding of the codeword by the decoder.

Abstract: An apparatus comprising an electronic unit is provided. The electronic unit may include a housing having a cover and a base that define an opening for receiving a printed circuit board, and a plurality of electronics positioned thereon that may generate electromagnetic interference (EMI) and be susceptible to water damage. A first gasket dispensed onto the cover is configured to at least partially remove electromagnetic interference generated from the plurality of electronics and to prevent liquid from entering into the opening of the housing. A second gasket dispensed onto the base is configured to prevent liquid from penetrating into the opening of the housing. A connector support fitted between the cover and the base may include a first rib that presses into the second gasket to prevent liquid from penetrating into the housing, and a second rib that bites into the base of the housing to provide EMI contact.

Abstract: An orthosis is provided for immobilizing a cervical spine including: a forehead band; a back plate having a vertebral void, and a torso harness. The back plate is coupled to the forehead band. The torso harness includes a back plate stabilizer that stabilizes a position of the back plate relative to the cervical spine.

Abstract: Disclosed herein are systems and methods that can avoid fruitless decoding iterations by terminating fruitless decoding iterations at an early stage. A method comprises: iteratively decoding a codeword by a decoder until a number of iterations at which a syndrome weight of the codeword exceeds a predetermined threshold. The method may further comprise: comparing the syndrome weight of the codeword with a decoder syndrome weight threshold for the decoder; in response to that the syndrome weight of the codeword is greater than or no less than the decoder syndrome weight threshold, terminating decoding of the codeword by the decoder.

Abstract: An electronics unit including a plurality of electronics positioned therein that generate electromagnetic interference (EMI) and/or thermal energy. The electronics unit may include a housing defining a plurality of openings positioned on a first side thereof, and a plurality of clips attached to the housing. A corresponding clip of the plurality of clips is positioned in a corresponding opening of the plurality of opening for attachment to a vehicle. The plurality of clips enables thermal energy to be transmitted from the plurality of electronics to a first portion of the vehicle, and mitigates the EMI, when the electronics unit is attached to the vehicle.

Abstract: Methods and systems for an electronic package for a vehicle are provided. In one example, the electronic package includes a chassis having a plurality of bent tabs forming a plurality of respective vent openings in the chassis, and a circuit board coupled to the chassis, wherein the bent tabs directly contact the circuit board.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: A display assembly for a vehicle includes a support chassis having a recess, and a display module at least partially received within the recess, the display module having a front side and a back side. A cover lens is attached to the front side of the display module with a bonding material and coupled to the support chassis in a floating mounting arrangement using a flexible adhesive.

Abstract: A mounting structure includes base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner side. The outer side includes a plurality of bumps configured to engage the panel. The base wall includes a plurality of tabs. Each tab configured to receive a corresponding fastener to secure the base wall to the panel.

Abstract: Methods and systems for an electronic package for a vehicle are provided. In one example, the electronic package includes a chassis having a plurality of bent tabs forming a plurality of respective vent openings in the chassis, and a circuit board coupled to the chassis, wherein the bent tabs directly contact the circuit board.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: A display assembly for a vehicle includes a support chassis having a recess, and a display module at least partially received within the recess, the display module having a front side and a back side. A cover lens is attached to the front side of the display module with a bonding material and coupled to the support chassis in a floating mounting arrangement using a flexible adhesive.

Abstract: A network outage and redundancy module which provides improved security, platform independence and continuity in information between financial hardware and enterprise applications.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.

Abstract: A network outage and redundancy module which provides improved security, platform independence and continuity in information between financial hardware and enterprise applications.