Patents by Inventor Jianjie Yuan

Jianjie Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Digital pressure sensor with rubber cover
    Patent number: 11536623
    Abstract: A digital pressure sensor includes a substrate, a pressure sensing structure configured for measuring a pressure of an object to be measured, a signal processing chip configured for receiving a sensing signal of the pressure sensing structure, and a rubber cover having an opening through which the pressure is sensed. The pressure sensing structure and the signal processing chip are mounted on the substrate. The signal processing chip has an analog-digital conversion module that converts the sensing signal output by the pressure sensing structure into a digital signal and outputs the digital signal. The signal processing chip is electrically connected to the substrate. The substrate and the rubber cover are connected to each other and form a mounting cavity for holding the pressure sensing structure and the signal processing chip.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: December 27, 2022
    Assignees: Measurement Specialties (China) Ltd., Measurement Specialties, Inc.
    Inventors: Yang Zhai, Xu Liang, Jianjie Yuan, John Valentini, Bala Kashi
  • DIGITAL PRESSURE SENSOR
    Publication number: 20210131899
    Abstract: A digital pressure sensor includes a substrate, a pressure sensing structure configured for measuring a pressure of an object to be measured, a signal processing chip configured for receiving a sensing signal of the pressure sensing structure, and a rubber cover having an opening through which the pressure is sensed. The pressure sensing structure and the signal processing chip are mounted on the substrate. The signal processing chip has an analog-digital conversion module that converts the sensing signal output by the pressure sensing structure into a digital signal and outputs the digital signal. The signal processing chip is electrically connected to the substrate. The substrate and the rubber cover are connected to each other and form a mounting cavity for holding the pressure sensing structure and the signal processing chip.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 6, 2021
    Applicants: Measurement Specialties (China ) Ltd., Measurement Specialties, Inc.
    Inventors: Yang Zhai, Xu Liang, Jianjie Yuan, John Valentini, Bala Kashi