Abstract: A method for semiconductor bridge current protection based on vanadium dioxide thick-film thermistor is provided, which relates to the field of semiconductor bridge current protection technologies. A copper, nickel, or gold interdigitated electrode is deposited on an aluminum oxide ceramic substrate. A vanadyl acetylacetonate methanol solution is sprayed onto a surface of the heated interdigitated electrode to obtain a vanadium dioxide thermistor device. This device is connected in parallel with a semiconductor bridge to achieve thermistor-based semiconductor bridge current protection. By adjusting a synthesis method and process, vanadium dioxide with a relatively single valence state can be synthesized, thereby achieving one-step synthesis of M-phase vanadium dioxide directly on the interdigitated electrode.

Abstract: A device and a method for inspecting openings of a powder metallurgy disk body with multiple openings, comprising a workbench, wherein an arch frame is fixedly provided on the workbench, an inspection unit for inspecting depth and width of openings in a powder metallurgy disk body is arranged on the arch frame, a positioning and ejection mechanism for positioning and ejecting the powder metallurgy disk body is also arranged on the workbench; lateral micro switches are fixedly mounted on inner side walls of lower ends of the two rods, spring pieces A of the lateral micro switches are arranged inwardly, and rollers are rotatably mounted on upper ends of the two rods via pins; the bottom surfaces of the two lifting plates are both fixedly provided with arc-shaped protrusions, and the two arc-shaped protrusions respectively abut against top surfaces of the two rollers under elastic force of the springs.

Abstract: A detonator for an explosive material is described. The detonator includes a semiconductor bridge, coupled with the explosive material, including thermal feedback mechanism is provided via one or more thermistors. The mechanism includes a semiconductor bridge with a polysilicon resistor, at least a pair of thermistors and a pair of diodes provided to prevent accident static discharge. The two thermistors are disposed to be substantially close to or sandwich the polysilicon resistor. When the temperature surrounding the polysilicon resistor is getting upwards, the temperature surrounding the thermistors is equally going up. When the temperature reaches a critical point, but below the threshold of the polysilicon resistor, the resistance of the thermistors drops suddenly or drastically, causing the current driving up the temperature of the polysilicon resistor to divert through the VOX temp resistors.

Abstract: Technique for encrypted email transmission using a pair of personal drivers/devices (e.g., USB drivers) are described. Each of the personal devices is loaded with or includes an encryption/decryption (a.k.a., cipher) engine that may be in form of software or hardware. When an email is authored, before it is sent out by a sender (first user), the email is routed to a personal device associated with the sender, where the email is encrypted. What an email application (e.g., Outlook or Gmail) sends out is the encrypted email. While in transit on a public network (e.g., the Internet) via an email server, the content in the email is fully protected through encryption. Upon receiving the email by a designated recipient (receiver), the encrypted email is caused to go through another personal device associated with the recipient, where the encrypted email is decrypted by a corresponding cipher engine therein. The content is then shown in an email application (e.g., Outlook or Gmail).

Abstract: A detonator for an explosive material is described. The detonator includes a semiconductor bridge, coupled with the explosive material, including thermal feedback mechanism is provided via one or more thermistors. An exemplary mechanism includes a semiconductor bridge with a polysilicon resistor and a pair of thermistors. The two thermistors are disposed to be substantially close to or sandwich the polysilicon resistor. When the temperature surrounding the polysilicon resistor is getting upwards, the temperature surrounding the thermistors is equally going up. When the temperature reaches a critical point, but below the threshold of the polysilicon resistor, the resistance of the thermistors drops suddenly or drastically, causing the current driving up the temperature of the polysilicon resistor to divert through the VOX temp resistors. Subsequently the current going through the polysilicon resistor is reduced, causing the temperature to drop downwards.

Abstract: Techniques to provide a storage device such as solid-state drive (SSD) with mechanisms for destroying the stored data therein. To achieve such data destruction, this application provides a destruction mechanism that generates heat high enough to break down some or all of the storing media in the device until the data stored in the device can no longer be usable.

Abstract: A high-power large-aperture fundamental mode vortex optical waveguide coherent VCSEL array is provided, and the coherent VCSEL array is a large-aperture array light-emitting structure, including an N electrode layer, an N-type DBR, an active region, an P-type DBR and a P electrode layer; micro/nanostructures pores with hexagonal lattice arrangement are etched on the surface of light output aperture on the each light-emitting unit mesa of the coherent VCSEL array, the micro/nanostructures pores are filled with highly doped semiconductor transparent materials to form a vortex optical waveguide structure.

Abstract: A high-power large-aperture fundamental mode vortex optical waveguide coherent VCSEL array is provided, and the coherent VCSEL array is a large-aperture array light-emitting structure, including an N electrode layer, an N-type DBR, an active region, an P-type DBR and a P electrode layer; micro/nanostructures pores with hexagonal lattice arrangement are etched on the surface of light output aperture on the each light-emitting unit mesa of the coherent VCSEL array, the micro/nanostructures pores are filled with highly doped semiconductor transparent materials to form a vortex optical waveguide structure.

Abstract: A detonator for an explosive material is described. The detonator includes a semiconductor bridge, coupled with the explosive material, including thermal feedback mechanism is provided via one or more thermistors. An exemplary mechanism includes a semiconductor bridge with a polysilicon resistor and a pair of thermistors. The two thermistors are disposed to be substantially close to or sandwich the polysilicon resistor. When the temperature surrounding the polysilicon resistor is getting upwards, the temperature surrounding the thermistors is equally going up. When the temperature reaches a critical point, but below the threshold of the polysilicon resistor, the resistance of the thermistors drops suddenly or drastically, causing the current driving up the temperature of the polysilicon resistor to divert through the VOX temp resistors. Subsequently the current going through the polysilicon resistor is reduced, causing the temperature to drop downwards.

Abstract: Designs of controllers for flash memory array are described. A controller is designed to form data packs of a predefined size with compressed data segments in different sizes. The data packs are encoded with ECC in two dimensions. When the data packs are read out, the ECC is applied in two dimensions to detect and correct errors that can be corrected by the ECC.

Abstract: Designs of controllers for flash memory array are described. A controller is designed to form data packs of a predefined size with compressed data segments in different sizes. The data packs are encoded with ECC in two dimensions. When the data packs are read out, the ECC is applied in two dimensions, possibly repeated, to detect and correct errors that can be corrected by the ECC.

Abstract: Techniques for Implementation of keeping data integrity in multiple dimensions are described. A single but relatively complicated engine is used to encode a line of original data bits in one dimension once and for all, while a linear array of simple engines are used in another dimension to keep revising sets of redundant data bits for successive lines of original data bits, where the redundant data bits become final when a last line of original data bits is accessed.

Abstract: Designs of integrated modules for securing data are described. According to one aspect of the present invention, a data set is distributed among a plurality of data channels, each of the data channels including an encrypting/decrypting module designed to process a data stream or set. Modules in the data channels work independently from each other. A next data stream is timely provided to a data channel when a current data stream is about to finish, resulting in increased efficiency when encrypting data from a source or decrypting encrypted data for a source.

Abstract: Designs of persistently managing mapping tables are described. To keep the performance of writing data into or reading out data from a storage device, such as flash memory, RAM (Random Access Memory) is often used to manage the mapping tables. To prevent the mapping tables from being damaged for whatever reason (e.g., power failure), MRAM (Magnetic RAM) is employed to keep the mapping tables in magnetic domains while the RAM is only used for updating the content of the mapping tables. Not only is the capacity for RAM is significantly reduced, the mapping tables are securely maintained in MRAM and available to RAM while data is being written into or read out from the storage device.

Abstract: A technique of extending a correction limit defined by an ECC is described. According to one aspect of the present invention, remaining errors that cannot be corrected by the ECCs in a data array is first identified and then formed in form of matrix with defined size. These remaining errors are flipped in value, namely from “1” to “0” or “0’ to “1” if the number of the errors are within a range or additional ECCs are applied to correct the errors in flipped data bits.

Abstract: A microwaveable container comprising a pan and a pan cover, the pan comprising a bottom, a continuous wall, a rim, a first heating layer and a first polymeric layer; the pan cover comprising an upper surface, a lower surface, an outer side edge, a second polymeric layer, and a second heating layer, the first heating layer being attached to the pan bottom, the second heating layer being attached to the pan cover, and wherein the first polymeric layer is attached to the rim, the first heating layer and the pan bottom, the second polymeric layer being attached to the pan cover and the second heating layer; the first and second heating layers independently comprising: a susceptor powder selected from manganese zinc ferrite, nickel zinc ferrite, strontium ferrite or mixtures thereof; and a polymer matrix selected from a silicone rubber, a liquid crystal polymer, a polyphenylene sulfide polymer or mixtures thereof.