Patents by Inventor Jianjun Pan

Jianjun Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PCB heat dissipation assembly and server having same
    Patent number: 12133367
    Abstract: Disclosed are a PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) includes: a PCB board (1), a plurality of chips (11) being arranged on the PCB board (1); at least one heat sink (2), the heat sink (2) being arranged on the plurality of chips (11), and the heat sink (2) including a heat dissipation air duct (21); and an air baffle (3), the air baffle (3) being arranged adjacent to the at least one heat sink (2), the air baffle (3) being located on one side of the at least one heat sink (2), and the air baffle (3) extending along the heat dissipation air duct (21).
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: October 29, 2024
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventors: Xuesong Zhou, Jianjun Pan, Shizhen Liao, Shuhao Zhang, Xudong Wang
  • Case assembly for server and server having same
    Patent number: 12041745
    Abstract: The present application discloses a case assembly for a server and a server having same. The case assembly (100) is divided into a first case body (10) and a second case body (20) in a first direction, both a side of the first case body (10) that faces the second case body (20) and a side of the second case body (20) that faces the first case body (10) are open, and the first case body (10) and the second case body (20) are detachably connected and jointly define an accommodation space.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: July 16, 2024
    Assignee: BITMAIN TECHNOLOGIES INC.
    Inventors: Jianjun Pan, Lei Zhang, Xudong Wang
  • CASE ASSEMBLY FOR SERVER AND SERVER HAVING SAME
    Publication number: 20220304182
    Abstract: The present application discloses a case assembly for a server and a server having same. The case assembly (100) is divided into a first case body (10) and a second case body (20) in a first direction, both a side of the first case body (10) that faces the second case body (20) and a side of the second case body (20) that faces the first case body (10) are open, and the first case body (10) and the second case body (20) are detachably connected and jointly define an accommodation space.
    Type: Application
    Filed: August 22, 2019
    Publication date: September 22, 2022
    Applicant: BITMAIN TECHNOLOGIES INC.
    Inventors: Jianjun Pan, Lei Zhang, Xudong Wang
  • PCB HEAT DISSIPATION ASSEMBLY AND SERVER HAVING SAME
    Publication number: 20220272872
    Abstract: Disclosed are a PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) includes: a PCB board (1), a plurality of chips (11) being arranged on the PCB board (1); at least one heat sink (2), the heat sink (2) being arranged on the plurality of chips (11), and the heat sink (2) including a heat dissipation air duct (21); and an air baffle (3), the air baffle (3) being arranged adjacent to the at least one heat sink (2), the air baffle (3) being located on one side of the at least one heat sink (2), and the air baffle (3) extending along the heat dissipation air duct (21).
    Type: Application
    Filed: October 31, 2019
    Publication date: August 25, 2022
    Applicant: BITMAIN TECHONOLOGIES INC.
    Inventors: Xuesong Zhou, Jianjun Pan, Sheijing Liao, Shuhao Zhang, Xudong Wang