Abstract: A wafer-level heterogeneous dies integration structure and method are provided. The integration structure includes a wafer substrate, a silicon interposer, heterogeneous dies, and a configuration substrate. A standard integration module is defined by the heterogeneous dies connected to the silicon interposer. The standard integration module is connected to an upper surface of the wafer substrate, and the configuration substrate is connected to a lower surface of the wafer substrate. The wafer substrate is connected to the configuration substrate via Through Silicon Vias on lower surface of the wafer substrate. And the upper surface of the wafer substrate is provided with Re-distributed Layers and a standardized micro bump array to form standard integration zone connected to the standard integration module.

Abstract: A wafer-level heterogeneous dies integration structure and method are provided. The integration structure includes a wafer substrate, a silicon interposer, heterogeneous dies, and a configuration substrate. A standard integration module is defined by the heterogeneous dies connected to the silicon interposer. The standard integration module is connected to an upper surface of the wafer substrate, and the configuration substrate is connected to a lower surface of the wafer substrate. The wafer substrate is connected to the configuration substrate via Through Silicon Vias on lower surface of the wafer substrate. And the upper surface of the wafer substrate is provided with Re-distributed Layers and a standardized micro bump array to form standard integration zone connected to the standard integration module.

Abstract: A system-on-wafer structure and a fabrication method. The structure includes a wafer substrate, an integrated chiplet, a system configuration board and a thermal module. The wafer substrate and the integrated chiplet are bonded through a wafer micro bump array and a chiplet micro bump array. The wafer substrate and the system configuration board are bonded through a copper pillar array on wafer substrate topside and a pad on system configuration board backside. A molding layer is provided between the wafer substrate and the system configuration board, and is configured to mold the wafer substrate, the integrated chiplet and the copper pillar array. Integrated chiplet are electrically connected to each other through a re-distributed layer in wafer substrate. The integrated chiplet is electrically connected to the system configuration board through the re-distributed layer and the copper pillar array. The thermal module is attached to the backside of the wafer substrate.

Abstract: A routing structure and a method of a wafer substrate with standard integration zone for integration on-wafer, which comprises a core voltage network, an interconnection signal network, a clock signal network and a ground network, wherein the core voltage network and the interconnection signal network belong to a top metal layer, the clock signal network is located in a inner metal layer, and the ground network is located in a bottom metal layer. The pins provided on the standard zone include core voltage pins, interconnection signal pins, clock signal pins, ground pins, and complex function pins. The complex function pins are directly connected to the outside of the system by TSV at the bottom of the wafer, and the other pins are connected by their signal networks. The present disclosure solves the yield problem with few metal layers of the wafer substrate for SoW.

Abstract: A system-on-wafer structure and a fabrication method. The structure includes a wafer substrate, an integrated chiplet, a system configuration board and a thermal module. The wafer substrate and the integrated chiplet are bonded through a wafer micro bump array and a chiplet micro bump array. The wafer substrate and the system configuration board are bonded through a copper pillar array on wafer substrate topside and a pad on system configuration board backside. A molding layer is provided between the wafer substrate and the system configuration board, and is configured to mold the wafer substrate, the integrated chiplet and the copper pillar array. Integrated chiplet are electrically connected to each other through a re-distributed layer in wafer substrate. The integrated chiplet is electrically connected to the system configuration board through the re-distributed layer and the copper pillar array. The thermal module is attached to the backside of the wafer substrate.

Abstract: A reactive navy to black dye composition comprises component A and component B. Component A is one or more selected from the group consisting of dye compounds of formula (I) and alkali metal salts thereof, and component B is one or more selected from the group consisting of dye compounds of formula (II) and alkali metal salts thereof, based on component A and component B, component A has a mass percentage of 5% to 50%, and component B has a mass percentage of 50% to 95%. The present invention also provides a reactive navy to black dye product comprising the reactive navy to black dye composition. The reactive navy to black dye composition and dye product thereof with properties such as good fastness to washing, high degree of fixation and good build-up, which is suitable for printing and dyeing of nitrogen-containing and/or hydroxyl-containing fiber materials and blended fabrics thereof.

Abstract: A reactive dye compound and preparation method and application thereof. The reactive dye compound is a compound of the following formula (I) or an alkali metal salt thereof, in formula (I), D1 and D2 are each independently the group of the following formula (a) or (b). The reactive dye compound is capable of applying in printing and dyeing of cellulosic fibers, polyamide fibers or their fabrics. The reactive dye compound of the present invention has a novel structure, good washing fastness and rubbing fastness, and good fiber-bonding stability, and are suitable for dyeing and printing of fibers such as cotton, rayon, silk, viscose, and wool.

Abstract: Provided is an input/output system applied to a network security defense system. A structural encoding unit and an error correction decoding unit are divided. The structure encoding unit is divided into input branch module and an input proxy module; and the error correction decoding unit is divided into an output routing module, an output proxy module, an adjudication branch module, an adjudication proxy module and a voting module. The input branch module is used for duplicating and distributing messages, the arbitration branch module is used for duplicating and distributing data, the voting module is used for performing voting, and the output routing module is used for selecting an output result from processing results of the output proxy module according to a voting result of the voting module.

Abstract: A method for automatically sensing attack behaviors, the method including: distributing a service request from a network switch to a response module, where the response module includes a main controller configured for data interaction processing and an auxiliary controller configured for interactive data processing; generating, by the main controller and the auxiliary controller in the response module, respective response data according to the service request, respectively; and comparing the respective response data of the main controller with the respective response data of the auxiliary controller; if a result of comparison is inconsistent, indicating the network switch is abnormal, an administrator is informed, and the response data generated by the auxiliary controller is fed back to the network switch; and, if the result of comparison is consistent, the response data generated by the main controller is fed back to the network switch.

Abstract: A method for automatically sensing attack behaviors, the method including: distributing a service request from a network switch to a response module, where the response module includes a main controller configured for data interaction processing and an auxiliary controller configured for interactive data processing; generating, by the main controller and the auxiliary controller in the response module, respective response data according to the service request, respectively; and comparing the respective response data of the main controller with the respective response data of the auxiliary controller; if a result of comparison is inconsistent, indicating the network switch is abnormal, an administrator is informed, and the response data generated by the auxiliary controller is fed back to the network switch; and, if the result of comparison is consistent, the response data generated by the main controller is fed back to the network switch.

Abstract: The present disclosure provides a software-defined interconnection method and apparatus for heterogeneous protocol data, including: determining ports respectively corresponding to multiple network node devices connected with a software-definable network switching device; configuring each of the ports corresponding to a respective network node device according to a protocol type corresponding to the network node device, to obtain the first configuration information, and configure a port rate of the port according to a transmission rate of data of the network node devices, to obtain the second configuration information; receiving a data packet sent by the connected network node device through each of the ports; determining whether protocol conversion needs to be performed according to the protocol type of the destination port of the data packet, wherein if needed, the data packet sent from the port is encapsulated into the protocol type of the destination port, and sent to the destination port.

Abstract: A method and an apparatus for forwarding a heterogeneous protocol message, and a network switching device are provided, the method includes: receiving a network message; parsing the network message to obtain a destination address of the network message; looking up in a preset forwarding table a port corresponding to the destination address and a first protocol corresponding to the port; judging whether the first protocol matches a second protocol of the network message; performing, if not, protocol conversion on the network message in accordance with a preset conversion rule, so that the protocol type of the network message matches the port; forwarding the protocol-converted network message through the port. In the present disclosure, protocol conversion can be performed on messages from different protocol networks, so that the network switching device implements communication between different networks, and has a flexible protocol processing mode and powerful scalability.

Abstract: Disclosed are methods and compositions containing functionalized nanoporous silicon particles, useful in a variety of diagnostic and/or therapeutic regimens for delivery of genetic constructs to one or more cells, tissues, and/or organs of interest. Also provided are methods for introducing into selected host cells one or more selected nucleic acid molecules. The present disclosure is also directed to a method of treating a tumor, comprising the step of administering to an individual one or more of the compositions and formulations thereof as described herein.

Abstract: Embodiments of this application provide a combine antenna and an electronic device. The combined antenna includes a first antenna of an electromagnetic induction type and a second antenna of an electromagnetic radiation type. The first antenna includes a substrate having an electrical conductivity with a body portion of the second antenna connected to the substrate of the first antenna, the substrate serving as a reference ground portion of the second antenna.

Abstract: Disclosed are methods and compositions containing functionalized nanoporous silicon particles, useful in a variety of diagnostic and/or therapeutic regimens for delivery of genetic constructs to one or more cells, tissues, and/or organs of interest. Also provided are methods for introducing into selected host cells one or more selected nucleic acid molecules. The present disclosure is also directed to a method of treating a tumor, comprising the step of administering to an individual one or more of the compositions and formulations thereof as described herein.

Abstract: Embodiments of this application provide a combine antenna and an electronic device. The combined antenna includes a first antenna of an electromagnetic induction type and a second antenna of an electromagnetic radiation type. The first antenna includes a substrate having an electrical conductivity with a body portion of the second antenna connected to the substrate of the first antenna, the substrate serving as a reference ground portion of the second antenna.

Abstract: A built-in straight mobile antenna type dual band antenna assembly includes a circuit board, a first radiator transversely arranged on one end of the circuit board and having a first resonance frequency, and a second radiator longitudinally arranged on one lateral side of the circuit board. The first radiator and the second radiator constitute an L-shaped structure for signal input through a feed end, and are connected to a ground plane on the circuit board through a common grounding lug.

Abstract: A multi-band HAC compatible antenna module having a metal shield arranged around the built-in antenna for resonant coupling with the antenna to lower electromagnetic interference and to improves hearing aids compatibility characteristic. When compared with a reference antenna without metal shield, the multi-band HAC compatible antenna module shows 3 dB˜4 dB HAC improvement in GSM850 and GSM900, and 1 dB HAC improvement in DCS and PCS bands.

Abstract: A built-in straight mobile antenna type dual band antenna assembly includes a circuit board, a first radiator transversely arranged on one end of the circuit board and having a first resonance frequency, and a second radiator longitudinally arranged on one lateral side of the circuit board. The first radiator and the second radiator constitute an L-shaped structure for signal input through a feed end, and are connected to a ground plane on the circuit board through a common grounding lug.

Abstract: A multi-band HAC compatible antenna module having a metal shield arranged around the built-in antenna for resonant coupling with the antenna to lower electromagnetic interference and to improves hearing aids compatibility characteristic. When compared with a reference antenna without metal shield, the multi-band HAC compatible antenna module shows 3 dB˜4 dB HAC improvement in GSM850 and GSM900, and 1 dB HAC improvement in DCS and PCS bands.