Abstract: An air shroud includes first and second channels, a center bypass port, and a center deflector. The first channel directs a first airflow over a first heat sink of a first processor. A first hot airflow leaves a first rear portion of the first channel. The second channel directs a second airflow over a second heat sink of a second processor. A second hot airflow leaves a second rear portion of the second channel. The center bypass port directs a third airflow away from a first set of memory modules. The center deflector is in physical communication with the first and second channels. The center deflector directs a first portion of the third airflow to the first rear portion of the first channel, and a second portion of the third airflow to the second rear portion of the second channel.

Abstract: An air shroud includes first and second channels, a center bypass port, and a center deflector. The first channel directs a first airflow over a first heat sink of a first processor. A first hot airflow leaves a first rear portion of the first channel. The second channel directs a second airflow over a second heat sink of a second processor. A second hot airflow leaves a second rear portion of the second channel. The center bypass port directs a third airflow away from a first set of memory modules. The center deflector is in physical communication with the first and second channels. The center deflector directs a first portion of the third airflow to the first rear portion of the first channel, and a second portion of the third airflow to the second rear portion of the second channel.

Abstract: An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.

Abstract: An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.

Abstract: This invention relates to a cooling device which utilizes both thermoelectric and magnetocaloric mechanisms for enhanced cooling applications. Using high thermal conductivity magnetocaloric composites in conjunction with thermoelectric elements acting as thermal switches which are electrically coupled to a magnetization and demagnetization cycle enables the use of larger quantities of magnetocaloric material, and high efficiency solid state cooling can be achieved. Solid state cooling devices are useful for a variety of industrial applications which require cooling, such as, but not limited to cooling of microelectronic devices, cooling on space platforms, etc.

Abstract: This invention relates to a cooling device which utilizes both thermoelectric and magnetocaloric mechanisms for enhanced cooling applications. Using high thermal conductivity magnetocaloric composites in conjunction with thermoelectric elements acting as thermal switches which are electrically coupled to a magnetization and demagnetization cycle enables the use of larger quantities of magnetocaloric material, and high efficiency solid state cooling can be achieved. Solid state cooling devices are useful for a variety of industrial applications which require cooling, such as, but not limited to cooling of microelectronic devices, cooling on space platforms, etc.