Patents by Inventor Jian-Ping Shi

Jian-Ping Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HOT MELT ADHESIVE COMPOSITION
    Publication number: 20230323167
    Abstract: The present invention relates to a pressure sensitive hot melt adhesive, particularly to a pressure sensitive hot melt positioning adhesive for use on feminine sanitary pads or adult incontinent products having improved peel values on fabrics made from Lyocell fibers, particularly eucalyptus-based Lyocell fibers.
    Type: Application
    Filed: August 25, 2021
    Publication date: October 12, 2023
    Inventors: Olivier LAFERTE, Laurianne LIBRALESSO, Stéphanie KOMAR, Clement BELLINI, Jian Ping SHI, Danfeng LI
  • Packaging system for customizing software
    Patent number: 8595138
    Abstract: In one embodiment, a system for customizing executable software code is provided. The system can include a scan logic configured to scan the executable software code to determine an execution trigger point in the executable software code. A packager logic can be configured to alter the execution trigger point by embedding, into the executable software code, alternative code configured to cause a customized logic to execute at the execution trigger point.
    Type: Grant
    Filed: September 8, 2010
    Date of Patent: November 26, 2013
    Assignee: Oracle International Corporation
    Inventors: Wenchao Sun, Jian-Ping Shi, Chandra P. Patni
  • PACKAGING SYSTEM FOR CUSTOMIZING SOFTWARE
    Publication number: 20100333078
    Abstract: In one embodiment, a system for customizing executable software code is provided. The system can include a scan logic configured to scan the executable software code to determine an execution trigger point in the executable software code. A packager logic can be configured to alter the execution trigger point by embedding, into the executable software code, alternative code configured to cause a customized logic to execute at the execution trigger point.
    Type: Application
    Filed: September 8, 2010
    Publication date: December 30, 2010
    Inventors: Wenchao SUN, Jian-Ping Shi, Chandra P. Patni
  • Packaging system for customizing software
    Patent number: 7814477
    Abstract: In one embodiment, a system for customizing executable software code is provided. The system can include a scan logic configured to scan the executable software code to determine an execution trigger point in the executable software code. A packager logic can be configured to alter the execution trigger point by embedding, into the executable software code, alternative code configured to cause a customized logic to execute at the execution trigger point.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: October 12, 2010
    Assignee: Oracle International Corp.
    Inventors: Wenchao Sun, Jian-Ping Shi, Chandra P. Patni
  • Packaging system for customizing software
    Publication number: 20040237067
    Abstract: In one embodiment, a system for customizing executable software code is provided. The system can include a scan logic configured to scan the executable software code to determine an execution trigger point in the executable software code. A packager logic can be configured to alter the execution trigger point by embedding, into the executable software code, alternative code configured to cause a customized logic to execute at the execution trigger point.
    Type: Application
    Filed: May 20, 2003
    Publication date: November 25, 2004
    Inventors: Wenchao Sun, Jian-Ping Shi, Chandra P. Patni