Abstract: A printed circuit board transmits the collected current and voltage signals of different regions in a membrane electrode assembly inside the fuel cell to PCB connectors, and transmits the current and voltage signals to a data collection module by means of mating of a male of the connector, a female and a male of the standard harness. The current and voltage signals of the PCB connectors are identified, and a local current density of the fuel cell represented by each signal is positioned according to the position matching relationship, so that the current density distribution in the entire membrane electrode assembly of the fuel cell is finally obtained. According to the scheme, stable and reliable transmission of current and voltage signals of different regions on the membrane electrode assembly inside the fuel cell to the data collection system is realized.

Abstract: Presented are systems and methods for reference signaling design and configuration. A wireless communication device (e.g., UE) may detect at least one triggering condition for sending power headroom information for at least one downlink (DL) physical channel or signal. The wireless communication device may send the power headroom information responsive to the at least one triggering condition to a wireless communication node.

Abstract: A flexible circuit board, a circuit board assembly, and an electronic device are provided. The flexible circuit board includes at least a flexible dielectric layer and a first connection metal layer. The flexible dielectric layer includes a through hole extending along a thickness direction of the flexible dielectric layer. The through hole includes a middle basic hole and outer auxiliary holes. Two or more outer auxiliary holes are distributed and arranged along a circumferential direction of the middle basic hole. The middle basic hole is in communication with the two or more outer auxiliary holes. The first connection metal layer is arranged on an inner wall of the through hole and is connected to the flexible dielectric layer. The first connection metal layer includes a middle channel extending along a thickness direction.

Abstract: The application discloses a method for optimizing a lithium-potassium anticline structure target area, which includes the following steps: obtaining data of a historical lithium-potassium anticline structure area, and classifying the data of the historical lithium-potassium anticline structure area to generate classified data; carrying out a parameter assignment on the classified data to obtain a parameter data set; constructing a neural network model, inputting the parameter data set into the neural network model for a training, and obtaining a target area optimal neural network model; and based on the target area optimal neural network model, carrying out a target area optimization in a deep lithium-potassium anticline structure area, and obtaining an optimal result.

Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity.

Abstract: A circuit board assembly and an electronic is provided. The circuit board assembly includes at least a frame plate and circuit boards. The frame plate includes a frame body, first soldering portions, and second soldering portions. The frame body has a middle accommodating hole, an inner wall facing the middle accommodating hole, and an outer wall facing away from the middle accommodating hole. The first soldering portions are provided in an intermediate region located on the frame body between the inner wall and the outer wall. At least one of the inner wall and the outer wall is provided with accommodating grooves. The accommodating grooves extend along a thickness direction of the frame plate. The second soldering portions are provided in the accommodating grooves and connected to the frame body. Two circuit boards are respectively provided on two opposite sides of the frame plate along the thickness direction. The circuit board includes pads.

Abstract: This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.

Abstract: Methods, systems, and devices for contention-based transmissions using differential coding techniques in mobile communication technology are described. An exemplary method for wireless communication includes transmitting, by a wireless device, a payload that comprises an identity of the wireless device and at least one of a user plane data or a control plane data, where the payload is modulated using a differential coding technique. Another exemplary method for wireless communication includes receiving, by a network node, a payload that comprises an identity of the wireless device and at least one of a user plane data or a control plane data, where the payload is modulated using a differential coding technique.

Abstract: A circuit board assembly that is applied to an electronic device is provide. The circuit board assembly includes at least printed circuit boards, a flexible circuit board, and a support. Two or more printed circuit boards are spaced apart. The printed circuit boards include first pads. Two neighboring printed circuit boards are connected to the flexible circuit board. The flexible circuit board includes a bending region, straight regions, and second pads. Straight regions are respectively arranged on two opposite sides of the bending region. The straight regions are located between the two printed circuit boards. The bending region and the straight regions form an accommodating space. The second pad is arranged in the straight region. The first pad is connected to the second pad. The support is arranged in the accommodating space. The support includes two stacked support bodies.

Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.

Abstract: A circuit board assembly, a manufacturing method are provided. The circuit board assembly includes a flexible printed circuit board and a printed circuit board, a pad for disposing a welding piece is provided on the printed circuit board, the flexible printed circuit board includes a main body and a welding part disposed on an inner wall of a through hole of the main body, the through hole includes a recessing part and a connection segment connected to a bottom wall of the recessing part, the recessing part is disposed on a side that is of the connection segment and that is away from the pad, and an end that is of the connection segment and that is away from the recessing part faces the pad, so that the welding piece overflows into the recessing part through the connection segment, and welds the welding part to the pad.

Abstract: An electronic device, relating to the technical field of antennas. The electronic device includes a frame, a screen, and a circuit board assembly. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator.

Abstract: A method of patterning a thin film is provided. The method includes coating a thin film layer and photoresist on a surface of a substrate; forming a first partially cured zone by performing a first exposing process of the photoresist with a mask, wherein exposing energy applied to the photoresist of the first partially cured zone is less than a photosensitive threshold of the photoresist; forming a cured zone on the first partially cured zone by performing a second exposing process of the photoresist with the mask, wherein a width of the cured zone is less than a width of the first partially cured zone, and exposing energy applied to the photoresist of the cured zone is equal to or greater than the photosensitive threshold of the photoresist; developing the photoresist; etching the thin film layer that is not covered by the photoresist; and removing the photoresist of the cured zone.

Abstract: A position-limiting device includes a base and a position-limiting member rotatably provided on the base, the position-limiting device further includes a positioning member. The base has a hollow portion. The position-limiting member is switchable between a position-limiting state and a non-position-limiting state, when the position-limiting member is in the position-limiting state, the positioning member fixes the position of the position-limiting member; and when the position-limiting member is in the non-position-limiting state, the positioning member releases the position-limiting member, and at least a part of the position-limiting member is received in the hollow portion.

Abstract: A securing system for a freight wagon and a freight wagon are provided. The securing system includes an entrance area floor and non-entrance area floor in the freight wagon, multiple first rolling mechanisms and multiple turn position-limiting mechanisms are provided on the entrance area floor, multiple second rolling mechanisms, multiple turn position-limiting mechanisms, multiple lateral position-limiting mechanisms and multiple end position-limiting mechanisms are provided on the non-entrance area floor. With the technical solutions of the present application, loading, conveying and securing of cargo can be achieved in the shortest time on the basis of ensuring the safety and reliability of the transportation, and compared with the conventional cargo loading, the transport efficiency of the cargo is significantly increased and the cost is reduced efficiently.

Abstract: A position-limiting device includes a base and a position-limiting member rotatably provided on the base, the position-limiting device further includes a positioning member. The base has a hollow portion. The position-limiting member is switchable between a position-limiting state and a non-position-limiting state, when the position-limiting member is in the position-limiting state, the positioning member fixes the position of the position-limiting member; and when the position-limiting member is in the non-position-limiting state, the positioning member releases the position-limiting member, and at least a part of the position-limiting member is received in the hollow portion.

Abstract: A securing system for a freight wagon and a freight wagon are provided. The securing system includes an entrance area floor and non-entrance area floor in the freight wagon, multiple first rolling mechanisms and multiple turn position-limiting mechanisms are provided on the entrance area floor, multiple second rolling mechanisms, multiple turn position-limiting mechanisms, multiple lateral position-limiting mechanisms and multiple end position-limiting mechanisms are provided on the non-entrance area floor. With the technical solutions of the present application, loading, conveying and securing of cargo can be achieved in the shortest time on the basis of ensuring the safety and reliability of the transportation, and compared with the conventional cargo loading, the transport efficiency of the cargo is significantly increased and the cost is reduced efficiently.

Abstract: A method of patterning a thin film is provided. The method includes coating a thin film layer and photoresist on a surface of a substrate; forming a first partially cured zone by performing a first exposing process of the photoresist with a mask, wherein exposing energy applied to the photoresist of the first partially cured zone is less than a photosensitive threshold of the photoresist; forming a cured zone on the first partially cured zone by performing a second exposing process of the photoresist with the mask, wherein a width of the cured zone is less than a width of the first partially cured zone, and exposing energy applied to the photoresist of the cured zone is equal to or greater than the photosensitive threshold of the photoresist; developing the photoresist; etching the thin film layer that is not covered by the photoresist; and removing the photoresist of the cured zone.

Abstract: A chip detecting system is disclosed. The system includes a ball grid array (BGA) chip and a circuit board, the BGA chip includes at least two functional pins being located at a corner of the BGA chip, the at least two functional pins are electrically connected to each other, the circuit board is provided with at least two solder pads and at least two testing pads, the at least two functional pins are electrically connected to the at least two solder pads by using solder balls separately, the solder pads are electrically connected to the testing pads separately, and the at least two testing pads are configured to electrically connect to a detector, so as to detect whether a crack exists between the at least two functional pins and the circuit board.

Abstract: A chip detecting system is disclosed. The system includes a ball grid array (BGA) chip and a circuit board, the BGA chip includes at least two functional pins being located at a corner of the BGA chip, the at least two functional pins are electrically connected to each other, the circuit board is provided with at least two solder pads and at least two testing pads, the at least two functional pins are electrically connected to the at least two solder pads by using solder balls separately, the solder pads are electrically connected to the testing pads separately, and the at least two testing pads are configured to electrically connect to a detector, so as to detect whether a crack exists between the at least two functional pins and the circuit board.