Patents by Inventor Jianqiang Yin
Jianqiang Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12163566Abstract: One example vibration damping bracket provided in some embodiments of this application includes a fastening bracket, a first bracket body, a second bracket body, a first vibration damping component, and a second vibration damping component. The first bracket body is elastically connected to the fastening bracket by using the first vibration damping component. The second bracket body is elastically connected to the first bracket body by using the second vibration damping component. The first vibration damping component includes a metal elastic part configured to absorb vibration, and the second vibration damping component includes a rubber elastic part configured to absorb vibration.Type: GrantFiled: April 8, 2022Date of Patent: December 10, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Zhenming Hu, Jianqiang Yin, Xiaofei Li, Rucheng Zhu
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Patent number: 12036581Abstract: Tandem methods and devices for separating coal and gangue based on visible light and an X-ray are provided. The method comprises: determining, based on a visible light image, an image feature set and a target region of coal gangue; recognizing the coal gangue and removing large gangue in the coal gangue; performing imaging on the coal gangue after the large gangue is removed; extracting a target image and determining a gray scale value of the target image; obtaining samples of coal and gangue of different granularity levels by performing sampling; establishing a database and obtaining a separation threshold of coal and gangue of each granularity level of the current mining area; forming a mapping set and storing the database in a storage space; and obtaining a gray scale value of subsequent coal gangue, importing the gray scale value of the subsequent coal gangue into the mapping set to subsequently separate coal and gangue.Type: GrantFiled: January 17, 2024Date of Patent: July 16, 2024Assignee: ANHUI UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Xing Li, Jianqiang Yin, Hongzheng Zhu, Jinbo Zhu, Yong Zhang, Zhonglin Gao
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Publication number: 20240149637Abstract: A device cooling system includes a vehicle-mounted device, a main controller, and a valve set. A liquid inlet pipe and a liquid outlet pipe are disposed on the vehicle-mounted device, the liquid inlet pipe is connected to the valve set, the valve set is connected to an electric drive liquid-cooling loop to form a first path, the valve set is connected to a battery liquid-cooling loop to form a second path, and the valve set is configured to switch a switch status to control to connect the first path or the second path. A temperature and humidity detection apparatus is disposed in the vehicle-mounted device. The main controller is configured to: obtain a dew point temperature based on a temperature and humidity that are detected by the temperature and humidity detection apparatus, and control, based on the dew point temperature, the valve set to switch the switch status.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Jianqiang Yin
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Publication number: 20240057300Abstract: This application discloses a vehicle-mountable device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.Type: ApplicationFiled: October 26, 2023Publication date: February 15, 2024Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yonghai Mao, Zhenming Hu, Jianqiang Yin, Xiaofei Li
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Patent number: 11839065Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.Type: GrantFiled: January 13, 2022Date of Patent: December 5, 2023Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yonghai Mao, Zhenming Hu, Jianqiang Yin, Xiaofei Li
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Publication number: 20230301028Abstract: A heat dissipation apparatus includes a liquid storage tank, a liquid pump, a first heat exchanger, a second heat exchanger and a heat dissipation fan. The liquid storage tank stores liquid coolant. The liquid pump extracts the liquid coolant from the liquid storage tank, and pressurizes the liquid coolant to enable the liquid coolant to circulate sequentially along the liquid storage tank, the first heat exchanger, and the second heat exchanger. The first heat exchanger is in contact with a heat source, absorbs heat from the heat source, and transfers the heat to the liquid coolant. The heat dissipation fan generates cooling air for the second heat exchanger to accelerate air flow around the second heat exchanger. The second heat exchanger absorbs heat from the liquid coolant, and volatilizes the heat into air.Type: ApplicationFiled: May 23, 2023Publication date: September 21, 2023Inventor: Jianqiang Yin
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Patent number: 11726534Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.Type: GrantFiled: July 16, 2021Date of Patent: August 15, 2023Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Jianqiang Yin, Zhenming Hu, Yonghai Mao, Xiaofei Li
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Publication number: 20230200028Abstract: An in-vehicle computing apparatus comprises a mainboard, a heat dissipation component, and a target printed circuit board (PCB). A system on chip (SOC) and a connection component are disposed on the target PCB. A side of the mainboard is attached to the heat dissipation component. The target PCB is located on a side of the heat dissipation component that faces away from the mainboard, and is detachably connected to the heat dissipation component by using the connection component.Type: ApplicationFiled: February 16, 2023Publication date: June 22, 2023Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Nengwu Xiang, Xiaolin Jia, Shuncheng Pan, Pinqiang Liu, Jianqiang Yin
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Publication number: 20220235846Abstract: One example vibration damping bracket provided in some embodiments of this application includes a fastening bracket, a first bracket body, a second bracket body, a first vibration damping component, and a second vibration damping component. The first bracket body is elastically connected to the fastening bracket by using the first vibration damping component. The second bracket body is elastically connected to the first bracket body by using the second vibration damping component. The first vibration damping component includes a metal elastic part configured to absorb vibration, and the second vibration damping component includes a rubber elastic part configured to absorb vibration.Type: ApplicationFiled: April 8, 2022Publication date: July 28, 2022Inventors: Zhenming HU, Jianqiang YIN, Xiaofei LI, Rucheng ZHU
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Publication number: 20220183192Abstract: A heat radiator comprising a heat dissipation plate, where a plurality of circumferentially disposed heat dissipation regions are disposed on the heat radiator, a plurality of first heat dissipation fins disposed in parallel with each other are disposed at intervals in each heat dissipation region, a heat dissipation channel is formed between adjacent first heat dissipation fins, one end that is of the heat dissipation channel and that is away from a center of the heat dissipation plate is an air inlet, and a direction that is above the heat dissipation channel and that is towards a hollow region is an air outlet.Type: ApplicationFiled: February 28, 2022Publication date: June 9, 2022Inventors: Yaofeng Peng, Jianqiang Yin
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Publication number: 20220142010Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.Type: ApplicationFiled: January 13, 2022Publication date: May 5, 2022Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yonghai Mao, Zhenming Hu, Jianqiang Yin, Xiaofei Li
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Publication number: 20210341977Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.Type: ApplicationFiled: July 16, 2021Publication date: November 4, 2021Inventors: Jianqiang Yin, Zhenming Hu, Yonghai Mao, Xiaofei Li
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Patent number: 11073877Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.Type: GrantFiled: August 10, 2020Date of Patent: July 27, 2021Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Jianqiang Yin, Zhenming Hu, Yonghai Mao, Xiaofei Li
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Publication number: 20210011534Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.Type: ApplicationFiled: August 10, 2020Publication date: January 14, 2021Inventors: Jianqiang Yin, Zhenming Hu, Yonghai Mao, Xiaofei Li
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Patent number: D1069975Type: GrantFiled: December 23, 2024Date of Patent: April 8, 2025Inventor: Jianqiang Yin