Patents by Inventor Jianqqi He

Jianqqi He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated micro-channels for 3D through silicon architectures
    Patent number: 8012808
    Abstract: Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: September 6, 2011
    Assignee: Intel Corporation
    Inventors: Wei Shi, Daoqiang Lu, Yiqun Bai, Qing A. Zhou, Jianqqi He
  • INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES
    Publication number: 20090201643
    Abstract: Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.
    Type: Application
    Filed: February 8, 2008
    Publication date: August 13, 2009
    Inventors: Wei Shi, Daoqiang Lu, Yiqun Bai, Qing A. Zhou, Jianqqi He