Patents by Inventor Jianqun Fu

Jianqun Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enlarged Press-Fit Hole
    Publication number: 20150173181
    Abstract: An apparatus may be provided. The apparatus may comprise a circuit board and a bore. The circuit board may have a component side surface and a bottom side surface. The bore may be disposed in the circuit board. The bore may extent from the component side surface to the bottom side surface. The bore may comprise a first portion and a second portion. The first portion may have a first diameter. The second portion may be disposed between the first portion and the component side surface. The second portion may have a second diameter greater than the first diameter.
    Type: Application
    Filed: December 16, 2013
    Publication date: June 18, 2015
    Applicant: Cisco Technology, Inc.
    Inventors: Dewen Xu, Jingping Wang, Jianqun Fu, Jiang Wang, Jing An