Patents by Inventor Jiansheng Wu

Jiansheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240082846
    Abstract: A gene sequencing reaction device, a gene sequencing system and a gene sequencing reaction method. The gene sequencing reaction device includes: a supporting platform; a dipping container disposed on the supporting platform, wherein the dipping container has a dipping reaction area, and the dipping reaction area is configured to hold a chemical reagent for gene sequencing reaction, so as to dip a sequencing chip having a DNA sample loading structure on the surface and having a DNA sample loaded thereon in the chemical reagent to perform a gene sequencing reaction; a temperature control apparatus, configured to control the temperature of the chemical reagent in the dipping reaction area; and a transfer apparatus, configured to insert the sequencing chip into the dipping reaction area or pull out the sequencing chip from the dipping reaction area.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: MGI Tech Co., LTD.
    Inventors: Wei Ma, Xun Xu, Jiabo Wu, Ming Ni, Dong Wei, Jiansheng Tang
  • Publication number: 20220021180
    Abstract: The present disclosure describes a diode laser array module that includes a plurality of diode lasers, a cooling module, and a pin connector module. The cooling module includes a heat sink that has structural features configured to allow pins of the diode lasers to be connected to a first conductive portion of the pin connector module within a recessed area in the bottom surface of the cooling module, where a second conductive portion of the pin connector module moves beyond the recessed area and is configured to be connected to a driving circuit module at a location outside of the recessed area in the bottom surface of the cooling module. Similarly principles are u to construct a diode laser array module comprising bank packaged diode laser modules, pin connector modules for the bank packaged diode laser modules, and a cooling module.
    Type: Application
    Filed: June 24, 2021
    Publication date: January 20, 2022
    Inventors: Siyang CHENG, Jiansheng WU, Peijin WANG, Zirong ZENG
  • Publication number: 20210284725
    Abstract: The invention provides interleukin-33 (IL-33) antibodies and methods of making and using the same, e.g., for treatment of IL-33 mediated disorders (e.g., ocular disorders such as AMD (e.g., geographic atrophy (GA)).
    Type: Application
    Filed: March 12, 2021
    Publication date: September 16, 2021
    Inventors: Gerald R. NAKAMURA, Dhaya SESHASAYEE, Menno VAN LOOKEREN CAMPAGNE, Tiffany WONG, Jiansheng WU, Hongkang XI, Jack BEVERS, III, Joyce CHAN, Laetitia COMPS-AGRAR, Racquel CORPUZ
  • Publication number: 20200250567
    Abstract: Provided are a method for coupling any two qubits from among multiple superconducting qubits and a system thereof, which are applied to an occasion provided with a multi-superconducting-qubit array and a magnetic film material capable of implementing spin waves. The method includes: disposing a magnetic film material below a multi-superconducting-qubit array; forming, through a combination of magnetization directions of magnetic domains in the magnetic film material, multiple channels through which the spin waves pass; disposing multiple qubits of the multi-superconducting-qubit array above the multiple channels through which the spin waves pass correspondingly to implement a coupling between each qubit and the spin waves; and disposing at least two qubits above one spin wave channel and implementing a coupling between the at least two qubits through the coupling between each qubit and the spin waves.
    Type: Application
    Filed: March 5, 2019
    Publication date: August 6, 2020
    Inventors: Dapeng Yu, Jiansheng Wu, Jiang Xiao, Song Liu, Shaojie Yuan
  • Patent number: 9688758
    Abstract: The invention provides engineered heteromultimeric protein complexes constructed using one, two, or three tethers and methods for making, using, and purifying such complexes, such as antibodies with different binding properties.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: June 27, 2017
    Assignee: GENENTECH, INC.
    Inventors: Bernd Wranik, Dan L. Eaton, Erin H. Christensen, Jiansheng Wu
  • Publication number: 20150133638
    Abstract: The invention provides engineered heteromultimeric protein complexes constructed using one, two, or three tethers and methods for making, using, and purifying such complexes, such as antibodies with different binding properties.
    Type: Application
    Filed: August 8, 2014
    Publication date: May 14, 2015
    Applicant: GENENTECH, INC.
    Inventors: BERND WRANIK, DAN L. EATON, ERIN H. CHRISTENSEN, JIANSHENG WU
  • Patent number: 5503798
    Abstract: A multiphase, high-temperature material contains an intermetallic base alloy of the Ti.sub.3 Al type, which is intended especially for use in heat engines such as internal combustion engines, gas turbines and aircraft engines. The material contains from 44 to 73 atom % titanium, from 19 to 35 atom % aluminum, from 2 to 6 atom % silicon, and from 5 to 15 atom % niobium. The desired microstructure is attained by heat treating the alloy at between 800.degree. and 1100.degree. C.
    Type: Grant
    Filed: April 18, 1994
    Date of Patent: April 2, 1996
    Assignees: ABB Patent GmbH, GKSS-Forschungszentrum Geesthacht GmbH
    Inventors: Lorenz Singheiser, Richard Wagner, Peter Beaven, Heinrich Mecking, Jiansheng Wu