Abstract: A memory unit with time domain edge delay accumulation for computing-in-memory applications is controlled by a first word line and a second word line. The memory unit includes at least one memory cell, at least one edge-delay cell multiplexor and at least one edge-delay cell. The at least one edge-delay cell includes a weight reader and a driver. The weight reader is configured to receive a weight and a multi-bit analog input voltage and generate a multi-bit voltage according to the weight and the multi-bit analog input voltage. The driver is connected to the weight reader and configured to receive an edge-input signal. The driver is configured to generate an edge-output signal having a delay time according to the edge-input signal and the multi-bit voltage. The delay time of the edge-output signal is positively correlated with the multi-bit analog input voltage multiplied by the weight.

Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.

Abstract: A fastener is adapted for assembling a first housing to a second housing. The first housing is provided with a protruding portion and a buckling portion, and the second housing has a first surface, a second surface, and a through hole. The fastener includes a first portion, at least one connecting portion, at least two elastic portions, and a second portion. The first portion movably abuts against the first surface and has a first opening. The connecting portion is accommodated in the through hole. One end of the connecting portion is connected to the first portion. The connecting portion is spaced apart from an inner edge of the second housing by a gap. The two elastic portions inclinedly extend into the first opening. The second portion movably abuts against the second surface and is disposed at the another end of the connecting portion.

Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: This invention provides methods of beam-indexed spatial modulation (BISM) for multiple-input and multiple-output (MIMO) technology. It does not only enhance the efficiency of MIMO using, but also address the compatibility problems in Spatial Modulation (SM-MIMO) and Orthogonal Frequency Division Multiplexing Index Modulation (OFDM-IM). Furthermore, the BISM improves the speed limitation problem and spectral efficiency issue in the current spatial modulation architectures.

Abstract: This invention provides methods of beam-indexed spatial modulation (BISM) for multiple-input and multiple-output (MIMO) technology. It does not only enhance the efficiency of MIMO using, but also address the compatibility problems in Spatial Modulation (SM-MIMO) and Orthogonal Frequency Division Multiplexing Index Modulation (OFDM-IM). Furthermore, the BISM improves the speed limitation problem and spectral efficiency issue in the current spatial modulation architectures.

Abstract: An exemplary projector includes a main body, a lens at a front of the main body and a lens barrier module positioned at the front of the main body for covering the lens when the projector is not in use or exposing the lens when the projector is in use. The lens barrier module includes a front bezel defining an opening aligned with the lens, a lens frame secured to a rear side of the front bezel and separated from the front bezel, and a lens cover slidably received between the front bezel and the lens frame. The lens frame defines an aperture aligned with the opening. The lens cover is positioned in a manner to selectively cover or uncover the lens.

Abstract: A height adjustment apparatus for a projector includes a lifting member and an engaging member. The projector includes a front wall and a bottom wall substantially perpendicular to the front wall. The front wall defines a sliding slot extending along a direction substantially perpendicular to the bottom wall and an opening extending through the bottom wall of the sliding slot. The lifting member includes a lifting portion slidable along the sliding slot, the lifting portion includes two side walls, each side wall includes a toothed surface The engaging member is corresponding to the opening, the engaging member includes a main body and two deformable arms extending into the sliding slot. Each deformable arm includes an engaging portion for engaging with one of the toothed surfaces.

Abstract: An exemplary projector includes a main body, a lens at a front of the main body and a lens barrier module positioned at the front of the main body for covering the lens when the projector is not in use or exposing the lens when the projector is in use. The lens barrier module includes a front bezel defining an opening aligned with the lens, a lens frame secured to a rear side of the front bezel and separated from the front bezel, and a lens cover slidably received between the front bezel and the lens frame. The lens frame defines an aperture aligned with the opening. The lens cover is positioned in a manner to selectively cover or uncover the lens.