Abstract: A heat dissipation structure of a cooling plate for a power semiconductor module includes a power chip, a first solder layer, a copper-clad ceramic substrate, a second solder layer and a cooling plate body. The power chip, the first solder layer, the copper-clad ceramic substrate, the second solder layer and the cooling plate body arranged sequentially from top to bottom. The heat dissipation structure further includes a straight rib mechanism arranged on a bottom surface of the cooling plate body, and a pin rib mechanism arranged on a surface of the straight rib mechanism.

Abstract: Provided is a method for constructing microRNA adenovirus expression plasmids comprising severe hepatitis related genes of hfgl2 (Human Fibrinogen-like protein 2) prothrombinase, Fas and TNFR1 (tumor necrosis factor receptor 1), and the specificity and effectivity of microRNA interference plasmids are detected at cellular level so that a combined use of three microRNA adenovirus expression plasmids for the treatment of severe hepatitis can be achieved. According to the present invention, pAd/CMV/V5-DEST vectors and pcDNA expression plasmid of hfgl2, hFas and hTNFR1 are used to construct pAd-hfgl2, pAd-hFas and pAd-hTNFR1 by means of Gateway technology.