Patents by Inventor Jianwen Han

Jianwen Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050241948
    Abstract: The present invention relates in general to real-time analysis of electrochemical deposition (ECD) metal plating solutions, for the purpose of reducing plating defects and achieving high quality metal deposition. The present invention provides various new electrochemical analytical cell designs for reducing cross-contamination and increasing analytical signal strength. The present invention also provides improved plating protocols for increasing potential signal strength and reducing the time required for each measurement cycle. Further, the present invention provides new methods and algorithms for simultaneously determining concentrations of suppressor, accelerator, and leveler in a sample ECD solution within three experimental runs.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 3, 2005
    Inventors: Jianwen Han, MacKenzie King, Weihua Wang, Glenn Tom, Jay Jung
  • Publication number: 20050236280
    Abstract: Cyclic electric potential is employed for measuring copper and sulfuric acid concentration in an electrochemical copper-plating solution. Such cyclic electric potential is further employed for cleaning electrode surface in an electrochemical analytical cell.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 27, 2005
    Inventors: Jianwen Han, Mackenzie King, Weihua Wang
  • Publication number: 20050236273
    Abstract: The present invention relates to a method for mathematically re-calibrating and adjusting an initial concentration analysis model that suffers from electrochemical measurement errors caused by surface state changes in the working/counter/reference electrode after extended usage. Specifically, such recalibration method reimburses long-term drift in the electrochemical measurements based on a single point testing.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 27, 2005
    Inventors: Jianwen Han, Mackenzie King, Glenn Tom, Steven Lurcott
  • Publication number: 20050236274
    Abstract: The present invention relates to a method and apparatus for determining organic additive concentrations in a sample electrolytic solution, preferably a copper electroplating solution, by measuring the double layer capacitance of a measuring electrode in such sample solution. Specifically, the present invention utilizes the correlation between double layer capacitance and the organic additive concentration for concentration mapping, based on the double layer capacitance measured for the sample electrolytic solution.
    Type: Application
    Filed: April 27, 2004
    Publication date: October 27, 2005
    Inventors: Jianwen Han, Mackenzie King
  • Publication number: 20050109624
    Abstract: Electrochemical deposition (ECD) processes and systems used in the fabrication of products such as semiconductor devices, and more specifically an on-wafer process and apparatus of such type, in which the workpiece being plated is utilized as an electrode element in the monitoring operation, thereby substantially simplying the analytical monitoring metrology of ECD operation. The invention is usefully employed in copper electrodeposition involving control of organic additives concentrations in the copper plating bath, to achieve highly efficient copper metalizing of wafer substrates.
    Type: Application
    Filed: November 25, 2003
    Publication date: May 26, 2005
    Inventors: MacKenzie King, Jianwen Han
  • Publication number: 20050067304
    Abstract: The present invention relates to an electrode assembly useful for analyzing metal electroplating solutions. Such electrode assembly comprises a measuring electrode, preferably a rotating disc electrode or a microelectrode, and at least one of an in situ cleaning mechanism, a nucleation and metal growth optimization mechanism, and a voltage limiting mechanism. The present invention also relates to usage of such electrode assembly for in situ cleaning of the measuring electrode, nucleation and metal growth optimization, or voltage limitation.
    Type: Application
    Filed: September 26, 2003
    Publication date: March 31, 2005
    Inventors: MacKenzie King, Weihua Wang, Jianwen Han, Jeffrey Roeder, Steven Lurcott, Michele Stawasz
  • Patent number: 6709568
    Abstract: The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, and optionally, the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, provided that the first rotation speed is lower than the second rotation speed, and that the first electroplating duration is shorter than the second electroplating duration.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: March 23, 2004
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Jianwen Han, Ronni M. Etterman, Peter M. Robertson, Richard Bhella, David Price
  • Publication number: 20030230485
    Abstract: The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, which minimizes the interference between the effects of the brightener and the effects of the leveler, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on either (1) the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, or (2) the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, that the rotation speed of the first set of measurement conditions is lower than the rotation speed of the second set of measurement conditions, and that the electroplating
    Type: Application
    Filed: June 13, 2002
    Publication date: December 18, 2003
    Inventors: Jianwen Han, Ronni M. Etterman, Peter M. Robertson, Richard Bhella, David Price