Patents by Inventor Jianwen Zou

Jianwen Zou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12350699
    Abstract: A pump body structure includes: an air inlet cylinder, an air inlet cavity being arranged inside the air inlet cylinder, and an air return hole being arranged in a bottom portion of the air inlet cylinder; a liquid inlet cylinder connected to the bottom portion of the air inlet cylinder; a lower cover connected to the bottom portion of the air inlet cylinder, a cavity being defined by the lower cover, an outer side wall of the liquid inlet cylinder and a bottom wall of the air inlet cylinder, and an air return channel being reserved between the lower cover and the liquid inlet cylinder; and an elastic stop valve arranged in the cavity, the elastic stop valve being configured for elastically covering a bottom portion of the air return hole.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: July 8, 2025
    Assignee: Foshan Changtuo Packaging Technology Co., Ltd.
    Inventors: Jianwen Zou, Wenqiang Yang
  • Publication number: 20250041883
    Abstract: A pump body structure includes: an air inlet cylinder, an air inlet cavity being arranged inside the air inlet cylinder, and an air return hole being arranged in a bottom portion of the air inlet cylinder; a liquid inlet cylinder connected to the bottom portion of the air inlet cylinder; a lower cover connected to the bottom portion of the air inlet cylinder, a cavity being defined by the lower cover, an outer side wall of the liquid inlet cylinder and a bottom wall of the air inlet cylinder, and an air return channel being reserved between the lower cover and the liquid inlet cylinder; and an elastic stop valve arranged in the cavity, the elastic stop valve being configured for elastically covering a bottom portion of the air return hole.
    Type: Application
    Filed: November 26, 2021
    Publication date: February 6, 2025
    Inventors: Jianwen Zou, Wenqiang Yang