Patents by Inventor Jianxiang Wu

Jianxiang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11324116
    Abstract: Systems, apparatus, methods for manufacturing and techniques for interconnecting integrated circuit devices are disclosed. A flexible printed circuit (FPC) provides EMI shielding with reduced insertion loss. The FPC includes a first signal layer fabricated from a planar conductive material and having traces configured to carry signals between a circuit boards. The FPC may include a first non-conductive layer disposed in a plane above the first signal layer, a second non-conductive layer disposed in a plane below the first signal layer, a first copper ground plane disposed in a plane above the first non-conductive layer, a second copper ground plane disposed in a plane below the second non-conductive layer, and a second signal layer provided in a plane above the first copper ground plane or below the second copper ground plane. Signals carried in the first signal layer may have a higher frequency than signals carried in the second signal layer.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: May 3, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Guobing Han, Jianxiang Wu, Cooper Xie, Wei Yan
  • Publication number: 20200084887
    Abstract: Systems, apparatus, methods for manufacturing and techniques for interconnecting integrated circuit devices are disclosed. A flexible printed circuit (FPC) provides EMI shielding with reduced insertion loss. The FPC includes a first signal layer fabricated from a planar conductive material and having traces configured to carry signals between a circuit boards. The FPC may include a first non-conductive layer disposed in a plane above the first signal layer, a second non-conductive layer disposed in a plane below the first signal layer, a first copper ground plane disposed in a plane above the first non-conductive layer, a second copper ground plane disposed in a plane below the second non-conductive layer, and a second signal layer provided in a plane above the first copper ground plane or below the second copper ground plane. Signals carried in the first signal layer may have a higher frequency than signals carried in the second signal layer.
    Type: Application
    Filed: June 12, 2017
    Publication date: March 12, 2020
    Inventors: Guobing HAN, Jianxiang WU, Cooper XIE, Wei YAN
  • Patent number: 9436646
    Abstract: Combined sockets for selectively removable cards in computing devices are disclosed. In one embodiment, a socket is provided that can accommodate both a subscriber identification module (SIM) card and a secure digital (SD) card. The cards are held in place within the socket in a back to back configuration by springs which further help insure that contacts on the cards are electrically coupled to conductive pins in the socket. While it is contemplated that the socket will be used in mobile terminals such as smart phones and tablets, the socket may be used in other computing devices that use such cards.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: September 6, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Jianming Cheng, Jianxiang Wu, Wei Yan
  • Publication number: 20150248365
    Abstract: Combined sockets for selectively removable cards in computing devices are disclosed. In one embodiment, a socket is provided that can accommodate both a subscriber identification module (SIM) card and a secure digital (SD) card. The cards are held in place within the socket in a back to back configuration by springs which further help insure that contacts on the cards are electrically coupled to conductive pins in the socket. While it is contemplated that the socket will be used in mobile terminals such as smart phones and tablets, the socket may be used in other computing devices that use such cards.
    Type: Application
    Filed: February 28, 2014
    Publication date: September 3, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Jianming Cheng, Jianxiang Wu, Wei Yan