Abstract: An array substrate, a display panel including the array substrate, and a fabrication method of the array substrate are provided. The array substrate includes a base substrate, a light-shielding portion, a thin-film transistor and a capacitor. The light-shielding portion is formed on a first surface of the base substrate. The thin-film transistor is formed on a side of the light-shielding portion away from the base substrate, and includes an active layer. The capacitor is formed on the first surface of the base substrate, and includes a first capacitive electrode and a second capacitive electrode. The first capacitive electrode and the second capacitive electrode are at least partially arranged opposite to each other in a direction perpendicular to the first surface of the base substrate. The first capacitive electrode is provided in a same layer as the light-shielding portion.

Abstract: The present disclosure provides a top-gate thin film transistor, a manufacturing method thereof, and an array substrate and a display panel each comprising the top-gate thin film transistor. The top-gate thin film transistor comprises a light-shielding layer formed between the base substrate and the active layer and made of a non-metallic material. The non-metallic material may be a silicone material, such as a polyhedral oligomeric silsesquioxane or a linear silicone resin.

Abstract: A method for manufacturing an organic light-emitting diode substrate is provided and includes: on a base substrate with a black matrix pattern, forming a conductive layer covering the black matrix pattern and a photoresist pattern that partially stacks on the conductive layer, through one patterning process by taking the black matrix pattern as a mask plate; and removing the photoresist pattern and portions of the conductive layer that stack on the photoresist pattern, thereby forming a patterned conductive layer.

Abstract: The present disclosure provides an OLED array substrate comprising a plurality of pixel units each including a plurality of sub-pixel units, each of the sub-pixel units comprising a light-emitting portion, each light-emitting portion having a first electrode, a second electrode and an organic light-emitting layer sandwiched between the first electrode and the second electrode, wherein the sub-pixel unit further comprises an organic film layer and a semi-reflecting mirror layer disposed successively on a light exit side of the second electrode, the first electrode comprises a reflective layer, the second electrode is a transparent electrode, a structure between the first electrode and the semi-reflecting mirror layer constitutes a microcavity structure, and organic film layers of the sub-pixel units of different colors of each pixel unit have different thicknesses. The present disclosure further provides an OLED display panel, an OLED display device, and a method of manufacturing the array substrate.

Abstract: The present disclosure provides a positive photoresist composition including a major adhesive material and a photosensitizer, wherein the photoresist composition further includes a photoisomerizable compound which would be converted into an ionic structure with an increased degree of molecular polarity after ultraviolet irradiation. The formation of the ionic structure with increased polarity of the molecule reduces the adhesion between the positive photoresist and the organic film layer, facilitates stripping after formation of the via, and improves the product rate of pass. Further, the present disclosure provides a via-forming method using the positive resist composition, a display substrate including the via formed by the via-forming method, and a display device including the display substrate.

Abstract: The present disclosure relates to the field of display technologies, and provides an array substrate. The array substrate includes a plurality of pixel units distributed in an array, each of the pixel units includes a plurality of sub-pixels, and each of the sub-pixels includes at least one metal layer and a light emitting layer. At least one of the sub-pixels further includes a reflective anode layer formed in the same layer as one of the at least one metal layer, where the reflective anode layer has a transparent conductive layer at a side of the reflective anode layer adjacent to the light emitting layer, and transparent conductive layers of at least two different sub-pixels have different thicknesses.

Abstract: A method of treating an ocular disorder in a subject in need thereof includes administering to the subject a therapeutically effective amount of a retinal sequestering compound of formula (I).

Abstract: A method for fabricating a TFT-containing backplate is disclosed. The method includes forming a top-gate TFT on a substrate. The top-gate TFT includes a gate insulating layer which includes a negative silicone light shielding material. A TFT-containing backplate is also disclosed.

Abstract: The present disclosure provides a positive photoresist composition including a major adhesive material and a photosensitizer, wherein the photoresist composition further includes a photoisomerizable compound which would be converted into an ionic structure with an increased degree of molecular polarity after ultraviolet irradiation. The formation of the ionic structure with increased polarity of the molecule reduces the adhesion between the positive photoresist and the organic film layer, facilitates stripping after formation of the via, and improves the product rate of pass. Further, the present disclosure provides a via-forming method using the positive resist composition, a display substrate including the via formed by the via-forming method, and a display device including the display substrate.

Abstract: A method for manufacturing an organic light-emitting diode substrate is provided and includes: on a base substrate with a black matrix pattern, forming a conductive layer covering the black matrix pattern and a photoresist pattern that partially stacks on the conductive layer, through one patterning process by taking the black matrix pattern as a mask plate; and removing the photoresist pattern and portions of the conductive layer that stack on the photoresist pattern, thereby forming a patterned conductive layer.

Abstract: The present disclosure provides an OLED array substrate comprising a plurality of pixel units each including a plurality of sub-pixel units, each of the sub-pixel units comprising a light-emitting portion, each light-emitting portion having a first electrode, a second electrode and an organic light-emitting layer sandwiched between the first electrode and the second electrode, wherein the sub-pixel unit further comprises an organic film layer and a semi-reflecting mirror layer disposed successively on a light exit side of the second electrode, the first electrode comprises a reflective layer, the second electrode is a transparent electrode, a structure between the first electrode and the semi-reflecting mirror layer constitutes a microcavity structure, and organic film layers of the sub-pixel units of different colors of each pixel unit have different thicknesses. The present disclosure further provides an OLED display panel, an OLED display device, and a method of manufacturing the array substrate.

Abstract: A method for fabricating a TFT-containing backplate is disclosed. The method includes forming a top-gate TFT on a substrate. The top-gate TFT includes a gate insulating layer which includes a positive silicone light shielding material. A TFT-containing backplate is also disclosed.

Abstract: The present disclosure provides a top-gate thin film transistor, a manufacturing method thereof, and an array substrate and a display panel each comprising the top-gate thin film transistor. The top-gate thin film transistor comprises a light-shielding layer formed between the base substrate and the active layer and made of a non-metallic material. The non-metallic material may be a silicone material, such as a polyhedral oligomeric silsesquioxane or a linear silicone resin.

Abstract: Disclosed is a method for testing the self-drying effect of a cement-based material, capable of testing the change in humidity of the cement-based material after the final setting until the Id stage of adding water, so as to reflect the water consumption therein and the self-drying course. In the time period after the final setting of the cement-based material until the 1 d stage of adding water and forming, the dew-point temperature inside the cement-based material is tested, and then the relative humidity inside the cement-based material is calculated using a formula. The present invention can test the change in humidity of the cement-based material after the final setting until the Id stage of adding water, so as to reflect the internal water consumption therein and the self-drying course.

Abstract: Disclosed is a method for testing the setting time of a cement-based material: testing the capillary negative pressure of a non-bleeding cement-based material, with the time at which the capillary negative pressure reaches a threshold value A as the initial setting time, and/or the time at which the capillary negative pressure reaches a threshold value B as the final setting time, wherein threshold value A is 8-10 kPa, and threshold value B is 54-56 kPa.

Abstract: A power distribution connection apparatus comprises a busbar that includes a first frame body and a second frame body, where one end of the first frame body is connected to one end of the second frame body; a fastener that includes a fastening part and a first connecting part, where the fastening part is fitted outside the first frame body or the second frame body, and slides along the first frame body or the second frame body, there is a tooth needle mounting hole on the first connecting part, and the first connecting part and the fastening part are connected on one side of the first frame body or the second frame body; and a tooth needle, where one end of the tooth needle is plugged inside the tooth needle mounting hole, and the plugging depth is adjustable.

Abstract: A power distribution connection apparatus comprises a busbar that includes a first frame body and a second frame body, where one end of the first frame body is connected to one end of the second frame body; a fastener that includes a fastening part and a first connecting part, where the fastening part is fitted outside the first frame body or the second frame body, and slides along the first frame body or the second frame body, there is a tooth needle mounting hole on the first connecting part, and the first connecting part and the fastening part are connected on one side of the first frame body or the second frame body; and a tooth needle, where one end of the tooth needle is plugged inside the tooth needle mounting hole, and the plugging depth is adjustable.

Abstract: Disclosed is a method for testing the self-drying effect of a cement-based material, capable of testing the change in humidity of the cement-based material after the final setting until the Id stage of adding water, so as to reflect the water consumption therein and the self-drying course. In the time period after the final setting of the cement-based material until the 1 d stage of adding water and forming, the dew-point temperature inside the cement-based material is tested, and then the relative humidity inside the cement-based material is calculated using a formula. The present invention can test the change in humidity of the cement-based material after the final setting until the Id stage of adding water, so as to reflect the internal water consumption therein and the self-drying course.

Abstract: Disclosed is a method for testing the setting time of a cement-based material: testing the capillary negative pressure of a non-bleeding cement-based material, with the time at which the capillary negative pressure reaches a threshold value A as the initial setting time, and/or the time at which the capillary negative pressure reaches a threshold value B as the final setting time, wherein threshold value A is 8-10 kPa, and threshold value B is 54-56 kPa.