Abstract: The present disclosure provides a light-emitting substrate and a manufacturing method thereof, a backlight and a display device. The light-emitting substrate includes a substrate including a plurality of light-emitting regions arranged in an array, each of the plurality of light-emitting regions including a driving circuit and at least one light-emitting unit connected to the driving circuit, a first electrically conductive portion on the substrate and connected to the driving circuit and the at least one light-emitting unit in each light-emitting region, and a second electrically conductive portion on the substrate and including a plurality of pads. The first electrically conductive portion and the second electrically conductive portion are on a same layer.

Abstract: A touch substrate manufacturing method, for manufacturing a target touch substrate to be assembled with a display substrate, is provided. A size of an active display region of the display substrate is a first preset size. The method includes: providing a touch substrate to be processed having a second preset size, the second preset size being greater than the first preset size; and cutting, in at least one cutting direction, the touch substrate to be processed to obtain the target touch substrate, the cutting direction being parallel to an extending direction of a touch channel on the touch substrate to be processed. A manufacturing method for touch module, a touch substrate and a touch module are also provided.

Abstract: A method for determining a compensation value for a local display region, a screen display method, and a terminal device are disclosed. The method for determining a compensation value includes turning on the screen to be compensated, wherein the screen to be compensated includes an aperture region and a non-aperture region; obtaining a first display data of the aperture region and a second display data of the non-aperture region when the screen to be compensated is turned on; determining display ratio between the aperture region and the non-aperture region, based on the first display data and the second display data; and calculating a compensation value for performing display compensation on the aperture region based on the display ratio.

Abstract: An array substrate (100) and a display device. The array substrate (100) includes a bonding area (102). The array substrate (100) includes a substrate (10), a first conductive layer (20) on the substrate (10), a first insulating layer (30) on one side of the first conductive layer (20) away from the substrate (10), and a second conductive layer (40) on one side of the first insulating layer (30) away from the substrate (10). The bonding area (102) is provided with bonding pins (201), and the bonding pin (201) includes a first conductive portion (21) and a second conductive portion (41) located on the side of the first conductive portion (21) away from the substrate (10), the first conductive portion (21) is located in the first conductive layer (20), the second conductive portion (41) is located in the second conductive layer (40), and the first conductive portion (21) is in direct contact with the second conductive portion (41).

Abstract: A display substrate and a display apparatus are provided. The display substrate includes a base substrate, a first conductive layer, a second conductive layer and an insulation layer. The first conductive layer is on a side of the base substrate and includes a first conductive part extending in a first direction, the second conductive layer is on a side of the first conductive layer facing away from the base substrate, and the insulation layer is located between the first conductive layer and the second conductive layer. At least one first conductive part includes a first hollowed-out portion including a plurality of groove structures distributed in a second direction and extending in the first direction. The first direction and the second direction produce angles.

Abstract: The present technology relates generally to compositions that specifically recognize and bind to a NDC80 peptide complexed with a major histocompatibility antigen (e.g., HLA-A*02). The compositions of the present technology are useful in methods for treating NDC80-associated diseases (e.g., cancers) in a subject in need thereof.

Abstract: The present application relates to compositions for preventing or treating viral and other microbial infections. In some embodiments, the present application provides chimeric proteins comprising a target-binding moiety that specifically binds to a pathogen that infects through a mucosa, and a positively charged mucoadhesive peptide fragment. Also provided are antibodies and constructs thereof that specifically binds to an S1 subunit of a spike protein of SARS-CoV-2. Compositions comprising the chimeric proteins, antibodies, or constructs described herein are useful for preventing or treating a microbial infection in an individual, such as a coronavirus infection.

Abstract: The present application relates to compositions for preventing or treating viral and other microbial infections. In some embodiments, the present application provides chimeric proteins comprising a target-binding moiety that specifically binds to a pathogen that infects through a mucosa, and a positively charged mucoadhesive peptide fragment. Also provided are antibodies and constructs thereof that specifically binds to an S1 subunit of a spike protein of SARS-CoV-2. Compositions comprising the chimeric proteins, antibodies, or constructs described herein are useful for preventing or treating a microbial infection in an individual, such as a coronavirus infection.

Abstract: The present application relates to compositions for preventing or treating viral and other microbial infections. In some embodiments, the present application provides chimeric proteins comprising a target-binding moiety that specifically binds to a pathogen that infects through a mucosa, and a positively charged mucoadhesive peptide fragment. Also provided are antibodies and constructs thereof that specifically binds to an S1 subunit of a spike protein of SARS-CoV-2. Compositions comprising the chimeric proteins, antibodies, or constructs described herein are useful for preventing or treating a microbial infection in an individual, such as a coronavirus infection.

Abstract: A method for autocatalytic plating of nanoparticles on a carbon nanomaterial, the method including: providing a nanomaterial in a solution including an oxidizing agent, the solution being maintained within a first temperature range and stirring the solution for a first predetermined time period; heating the solution to reach a second temperature range, higher than the first temperature range, and stirring the solution for a second predetermined time period, shorter than the first time period, while maintaining the solution within the second temperature range; filtering and rinsing the nanomaterial; dispersing the nanomaterial in an aqueous solution including a sensitizing agent; immersing the nanomaterial in a mixture including seed particles adhering to the nanomaterial; collecting the nanomaterial; plating the nanomaterial by immersing in a plating solution including an aqueous metal source and a first aqueous reducing agent such that a metallic layer is grown on the nanomaterial from the seed particles.

Abstract: A method for autocatalytic plating of nanoparticles on a carbon nanomaterial, the method including: providing a nanomaterial in a solution including an oxidizing agent, the solution being maintained within a first temperature range and stirring the solution for a first predetermined time period; heating the solution to reach a second temperature range, higher than the first temperature range, and stirring the solution for a second predetermined time period, shorter than the first time period, while maintaining the solution within the second temperature range; filtering and rinsing the nanomaterial; dispersing the nanomaterial in an aqueous solution including a sensitizing agent; immersing the nanomaterial in a mixture including seed particles adhering to the nanomaterial; collecting the nanomaterial; plating the nanomaterial by immersing in a plating solution including an aqueous metal source and a first aqueous reducing agent such that a metallic layer is grown on the nanomaterial from the seed particles.