Abstract: An inductor, a circuit board and a method for forming an inductor are provided. The inductor comprises: a first pad arranged on a first metal wiring layer of a circuit board; a second pad arranged on a second metal wiring layer of the circuit board; and a first hole with conducting medium filled therein, one end of the first hole being located in the first pad and the other end thereof being located in the second pad. The inductor can effectively reduce the area of the circuit occupied by the inductor.

Abstract: A printed circuit board (PCB) is provided. From top to bottom, the PCB sequentially includes: a top layer; an upper solder resist layer; a wiring layer; a lower solder resist layer; a bottom layer; and a hole installation part disposed on the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer. Wherein, the hole installation part includes a screw hole and a copper exposing region; a copper foil is disposed on the copper exposing region of the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer; an area of the copper foil is not less than an area of the copper exposing region.

Abstract: A print circuit board is disclosed, which comprises: a board body; and two pad sets being disposed relatively on the board body along a first direction, wherein each of the pad set comprises a first pad and a second pad being disposed relatively along a second direction being vertical to the first direction, wherein specifications of the first pad and the second pad are different. The print circuit board can suit for the electronic components with the different sizes, and the area of the print circuit board can be reduced, and the utilization of the print board circuit material is enhanced. At the same time, the situation can be avoided which is that the excessive paste will be used to move the component when playing piece and then result in many mounting issues.

Abstract: An inductor, a circuit board and a method for forming an inductor are provided. The inductor comprises: a first pad arranged on a first metal wiring layer of a circuit board; a second pad arranged on a second metal wiring layer of the circuit board; and a first hole with conducting medium filled therein, one end of the first hole being located in the first pad and the other end thereof being located in the second pad. The inductor can effectively reduce the area of the circuit occupied by the inductor.

Abstract: The present invention provides a chip structure and a circuit structure, chip structure is disposed on a printed circuit board provided with an element layer and a copper grounding layer, and comprises: a chip body disposed on the element layer and having a plurality of power pins; a power line disposed on the element layer for supplying electric power to the chip body; a plurality of power input lines, each of which has a body disposed on the copper grounding layer and two ends disposed on the element layer and connected with the body through corresponding through holes of the printed circuit board; and a plurality of bypass capacitors having one end connected with the power pins of the chip body through the element layer and the other end of the bypass capacitors connected with the power line through the power input line. The present invention further provides a chip structure.

Abstract: A printed circuit board and a display device are provided. The printed circuit board comprises a substrate, a package chip, and a metal heat dissipation layer. The package chip is disposed on a first surface of the substrate and comprises a chip body. The metal heat dissipation layer is disposed on a second surface of the substrate. A projection of the metal heat dissipation layer on the first surface of the substrate covers the chip body. The metal heat dissipation layer of the present invention is disposed on the reverse side of the printed circuit board to reduce the temperature of the package chip.

Abstract: A design method for a PCB having multiple screw holes includes steps of: (A) sequentially disposing a top layer, an upper solder resist layer, a wiring layer, a lower solder resist layer, a bottom layer, and a hole installation part on the above layers, wherein, the hole installation part includes a screw hole and a copper exposing region; disposing a hoard-geometry-outline layer and a route keepout layer; (B) disposing a first circle on the route keepout layer, wherein, the first circle is larger than a cross section of the screw hole; (C) disposing a second circle on the geometry outline layer, wherein, the second circle is equal to the cross section of the screw hole; and (D) respectively disposing a copper foil on the copper exposing region of the top layer, the upper solder resist layer, the wiring layer, the lower solder resist layer, and the bottom layer.

Abstract: A display device capable of reducing electromagnetic interference includes a display panel which has a source driver and a gate driver; a connector; a DC-DC converter; a first trace for connecting the connector and the DC-DC converter; and a second trace for connecting the DC-DC converter and the source driver, wherein the DC-DC converter is disposed near the gate d river, and a length of the first trace is longer than a length of the second trace, so that it minimizes the path of the DC-DC converter outputting current, and reduces the generation of electromagnetic interference.

Abstract: The present invention provides a chip structure and a circuit structure, chip structure is disposed on a printed circuit board provided with an element layer and a copper grounding layer, and comprises: a chip body disposed on the element layer and having a plurality of power pins; a power line disposed on the element layer for supplying electric power to the chip body; a plurality of power input lines, each of which has a body disposed on the copper grounding layer and two ends disposed on the element layer and connected with the body through corresponding through holes of the printed circuit board; and a plurality of bypass capacitors having one end connected with the power pins of the chip body through the element layer and the other end of the bypass capacitors connected with the power line through the power input line. The present invention further provides a chip structure.

Abstract: A printed circuit board (PCB) and a display device having the PCB include a substrate including a first surface that packages electronic components and a second surface opposite to the first surface, and a conductive foil that attaches to the second surface of the substrate. The conductive foil is divided into a plurality of blocks, and spacer regions are arranged between the blocks, where the spacer regions are configured with wires for electrical connection.

Abstract: A printed circuit board (PCB) is disclosed. The PCB includes a main body. A first surface of the main body is a connecting surface for electrical components. A second surface of the main body is a conductive cooper foil layer operating as ground wires. A plurality of grooves is arranged on the conductive cooper foil layer. The grooves pass through the conductive cooper foil layer to connect to the main body of the PCB. The thermal stress generated in the PCB welding process can be effectively released via the grooves. The inflation of the conductive cooper coil is relieved such that the PCB is prevented from being wrapped or cooper bubbling. In this way, the operation efficiency is enhanced and the manufacturing cost is reduced.

Abstract: A tangent angle circuit is connected to a plurality of scan line driving circuits and comprises: a charging module integrated on a control board to receive input of a direct current (DC) driving voltage and output a cut-in voltage to charge the scan line driving circuits; and a plurality of discharging modules integrated on the scan line driving circuits respectively to control the corresponding scan line driving circuits to discharge. In the present invention, by distributing the discharging modules on each of the scan line driving circuits respectively, the burden of load discharged charges on the discharging modules is reduced to avoid occurrence of an overhigh temperature; and the discharging modules are spatially separated, which is further favorable for reducing the temperature, releasing the space of the control board and reducing the area of the control board.

Abstract: A tangent angle circuit is connected to a plurality of scan line driving circuits and comprises: a charging module integrated on a control board to receive input of a direct current (DC) driving voltage and output a cut-in voltage to charge the scan line driving circuits; and a plurality of discharging modules integrated on the scan line driving circuits respectively to control the corresponding scan line driving circuits to discharge. In the present invention, by distributing the discharging modules on each of the scan line driving circuits respectively, the burden of load discharged charges on the discharging modules is reduced to avoid occurrence of an overhigh temperature; and the discharging modules are spatially separated, which is further favorable for reducing the temperature, releasing the space of the control board and reducing the area of the control board.