Abstract: An LED lamp includes a heat sink including a first surface with a first receiving portion thereof, and at least one LED plate installed at a bottom portion of the first receiving portion; a second receiving portion arranged on a top portion of the first receiving portion to receive a transparent element therein that covers a light-emitting surface of the LED plate; an insertion port arranged on the second receiving portion and located on a first plane of a first end of the heat sink; a first moving member arranged on the first plane of the first end and corresponding to the insertion port, a second moving member arranged on a second plane of the first end and movably connected to the heat sink, both the first and second moving members movably connected to each other and moving relative to the heat sink to open or close the insertion port.

Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.

Abstract: Technologies for expanded beam optical connectors are disclosed. In an illustrative embodiment, a lens array attached to a substrate includes several lenses aligned to optical fibers positioned in grooves in the substrate. The lens array also includes optical fiducials, such as opaque optical fiducials. Auxiliary optical fibers are aligned to the optical fiducials. Light can be sent through the auxiliary optical fibers and onto the optical fiducials, and a pattern of light can be detected after the optical fiducials. The pattern of light can be used to determine a position and/or orientation error of the lens array. The error can be used as feedback in several possible ways, such as repositioning the lens array, positioning a guide pin to match the position and direction of beams through the lenses, or adjusting a parameter of a manufacturing process.

Abstract: An optical inspection tool may include at least a first image capture unit and a second image capture unit for inspecting specimens having a substantially V-shaped grooves. The first image capture unit may be arranged in a first orientation so as to be directable towards a first angular surface of the V-shaped groove of each specimen. The second image capture unit may be arranged in a second orientation so as to be directable towards a second angular surface of the V-shaped groove of each specimen. The first image capture unit may be configured to capture images of defects and/or contamination on the first angular surface and the second image capture unit may be configured to capture images of defects and/or contamination on the second angular surface.

Abstract: An apparatus includes a light source configured to emit light to a translucent material and an embedded feature disposed in the translucent material, a first linear polarizer configured to linearly polarize the emitted light, based on a first orientation of an optical axis of the first linear polarizer, and a second linear polarizer configured to filter the light that is reflected from the translucent material, from the light that is reflected from the embedded feature and the translucent material, based on a second orientation of an optical axis of the second linear polarizer. The apparatus further includes a sensor configured to receive the light reflected from the embedded feature, from which the light reflected from the translucent material is filtered, and capture an image of the embedded feature and the translucent material, based on the received light.

Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.

Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

Abstract: Embodiments of the present disclosure provide techniques and configurations for an apparatus for package inspection. In some embodiments, the apparatus may include a light source to selectively project a first light defined by a first wavelength range to a surface of a package under inspection; an optical filter to selectively transmit, within a second wavelength range, a second light emitted by the surface of the package in response to the projection of the first light to the surface; a camera to generate one or more images of the surface, defined by the second light; and a controller coupled with the light source, optical filter, and camera, to process the one or more images, to detect a presence of a material of interest on the surface of the package, based at least in part on the first and second wavelength ranges. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure provide techniques and configurations for an apparatus for package inspection. In some embodiments, the apparatus may include a light source to selectively project a first light defined by a first wavelength range to a surface of a package under inspection; an optical filter to selectively transmit, within a second wavelength range, a second light emitted by the surface of the package in response to the projection of the first light to the surface; a camera to generate one or more images of the surface, defined by the second light; and a controller coupled with the light source, optical filter, and camera, to process the one or more images, to detect a presence of a material of interest on the surface of the package, based at least in part on the first and second wavelength ranges. Other embodiments may be described and/or claimed.

Abstract: Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.

Abstract: Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.