Patents by Inventor Jianyong Mo
Jianyong Mo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250112136Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Bohan SHAN, Jesse JONES, Zhixin XIE, Bai NIE, Shaojiang CHEN, Joshua STACEY, Mitchell PAGE, Brandon C. MARIN, Jeremy D. ECTON, Nicholas S. HAEHN, Astitva TRIPATHI, Yuqin LI, Edvin CETEGEN, Jason M. GAMBA, Jacob VEHONSKY, Jianyong MO, Makoyi WATSON, Shripad GOKHALE, Mine KAYA, Kartik SRINIVASAN, Haobo CHEN, Ziyin LIN, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Hiroki TANAKA, Ashay DANI, Praveen SREERAMAGIRI, Yi LI, Ibrahim EL KHATIB, Aaron GARELICK, Robin MCREE, Hassan AJAMI, Yekan WANG, Andrew JIMENEZ, Jung Kyu HAN, Hanyu SONG, Yonggang Yong LI, Mahdi MOHAMMADIGHALENI, Whitney BRYKS, Shuqi LAI, Jieying KONG, Thomas HEATON, Dilan SENEVIRATNE, Yiqun BAI, Bin MU, Mohit GUPTA, Xiaoying GUO
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Patent number: 12216301Abstract: An apparatus includes a light source configured to emit light to a translucent material and an embedded feature disposed in the translucent material, a first linear polarizer configured to linearly polarize the emitted light, based on a first orientation of an optical axis of the first linear polarizer, and a second linear polarizer configured to filter the light that is reflected from the translucent material, from the light that is reflected from the embedded feature and the translucent material, based on a second orientation of an optical axis of the second linear polarizer. The apparatus further includes a sensor configured to receive the light reflected from the embedded feature, from which the light reflected from the translucent material is filtered, and capture an image of the embedded feature and the translucent material, based on the received light.Type: GrantFiled: March 29, 2022Date of Patent: February 4, 2025Assignee: Intel CorporationInventors: Jacob Chesna, Liang Zhang, Jianyong Mo, Fan Fan
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Publication number: 20250004203Abstract: Technologies for beam expansion in monolithic glass substrates are disclosed. In an illustrative embodiment, lenses in a glass substrate may be formed using a laser, either by changing the index of refraction or as part of a two-step etching process. A seam may be prepared and etched, separating the glass substrate into two components, one of which will be part of an optical plug and one of which will be part of an optical receptacle. The optical plug has a cavity into which an optical fiber can be placed. In use, the lens in the glass substrate of the optical plug collimates light from the optical fiber into a beam. When the optical plug is mated with the optical receptacle, the beam is aligned to the lens and a waveguide in the optical receptacle. The large size of the beam relaxes the alignment tolerance for the optical plug and receptacle.Type: ApplicationFiled: June 27, 2023Publication date: January 2, 2025Applicant: Intel CorporationInventors: Jianyong Mo, Fan Fan, Liang Zhang
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Publication number: 20240332155Abstract: Substrates with a glass core and glass buildup layers, and methods of forming the same, are described herein. In one example, a substrate includes a glass core, glass layers above and below the glass core, conductive traces in the glass core and at least some of the glass layers, and conductive contacts on a surface of the substrate.Type: ApplicationFiled: March 31, 2023Publication date: October 3, 2024Applicant: Intel CorporationInventors: Jianyong Mo, Jason Michael Gamba, Liang Zhang
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Patent number: 11913772Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.Type: GrantFiled: March 17, 2022Date of Patent: February 27, 2024Assignee: Intel CorporationInventors: Jianyong Mo, V Wade Singleton, Yiren Wu, Liang Zhang, David Wasinger
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Publication number: 20230417987Abstract: Technologies for expanded beam optical connectors are disclosed. In an illustrative embodiment, a lens array attached to a substrate includes several lenses aligned to optical fibers positioned in grooves in the substrate. The lens array also includes optical fiducials, such as opaque optical fiducials. Auxiliary optical fibers are aligned to the optical fiducials. Light can be sent through the auxiliary optical fibers and onto the optical fiducials, and a pattern of light can be detected after the optical fiducials. The pattern of light can be used to determine a position and/or orientation error of the lens array. The error can be used as feedback in several possible ways, such as repositioning the lens array, positioning a guide pin to match the position and direction of beams through the lenses, or adjusting a parameter of a manufacturing process.Type: ApplicationFiled: June 24, 2022Publication date: December 28, 2023Inventors: Wesley B. Morgan, Stephen A. Smith, Stephanie J. Arouh, Fan Fan, Jianyong Mo, Henry V. Wladkowski
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Publication number: 20230358690Abstract: An optical inspection tool may include at least a first image capture unit and a second image capture unit for inspecting specimens having a substantially V-shaped grooves. The first image capture unit may be arranged in a first orientation so as to be directable towards a first angular surface of the V-shaped groove of each specimen. The second image capture unit may be arranged in a second orientation so as to be directable towards a second angular surface of the V-shaped groove of each specimen. The first image capture unit may be configured to capture images of defects and/or contamination on the first angular surface and the second image capture unit may be configured to capture images of defects and/or contamination on the second angular surface.Type: ApplicationFiled: May 5, 2022Publication date: November 9, 2023Inventors: Jianyong MO, Fan FAN, Liang ZHANG
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Publication number: 20230314682Abstract: An apparatus includes a light source configured to emit light to a translucent material and an embedded feature disposed in the translucent material, a first linear polarizer configured to linearly polarize the emitted light, based on a first orientation of an optical axis of the first linear polarizer, and a second linear polarizer configured to filter the light that is reflected from the translucent material, from the light that is reflected from the embedded feature and the translucent material, based on a second orientation of an optical axis of the second linear polarizer. The apparatus further includes a sensor configured to receive the light reflected from the embedded feature, from which the light reflected from the translucent material is filtered, and capture an image of the embedded feature and the translucent material, based on the received light.Type: ApplicationFiled: March 29, 2022Publication date: October 5, 2023Inventors: Jacob CHESNA, Liang ZHANG, Jianyong MO, Fan FAN
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Publication number: 20230296371Abstract: The present disclosure is directed to a metrology system having 3-dimensional sensors for thickness measurements of semiconductor elements, and methods for taking the thickness measurements. In an aspect, the 3-dimensional sensor may be a single or dual 3-dimensional profiler that may scan across the top and bottom surfaces of an element to obtain a thickness measurement. In another aspect, the method may be used to measure a gap between elements that have assembled together.Type: ApplicationFiled: March 17, 2022Publication date: September 21, 2023Inventors: Jianyong MO, V Wade SINGLETON, Yiren WU, Liang ZHANG, David WASINGER
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Publication number: 20230236517Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.Type: ApplicationFiled: April 3, 2023Publication date: July 27, 2023Inventors: Changhua LIU, Jianyong MO, Liang ZHANG
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Patent number: 11644757Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.Type: GrantFiled: December 19, 2019Date of Patent: May 9, 2023Assignee: Intel CorporationInventors: Changhua Liu, Jianyong Mo, Liang Zhang
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Publication number: 20210191282Abstract: Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.Type: ApplicationFiled: December 19, 2019Publication date: June 24, 2021Inventors: Changhua LIU, Jianyong MO, Liang ZHANG
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Patent number: 10794840Abstract: Embodiments of the present disclosure provide techniques and configurations for an apparatus for package inspection. In some embodiments, the apparatus may include a light source to selectively project a first light defined by a first wavelength range to a surface of a package under inspection; an optical filter to selectively transmit, within a second wavelength range, a second light emitted by the surface of the package in response to the projection of the first light to the surface; a camera to generate one or more images of the surface, defined by the second light; and a controller coupled with the light source, optical filter, and camera, to process the one or more images, to detect a presence of a material of interest on the surface of the package, based at least in part on the first and second wavelength ranges. Other embodiments may be described and/or claimed.Type: GrantFiled: March 17, 2017Date of Patent: October 6, 2020Assignee: Intel CorporationInventors: Liang Zhang, Jianyong Mo, Darren A. Vance, Di Xu, Gregory S. Clemons, Robert F. Wiedmaier
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Publication number: 20190339212Abstract: Embodiments of the present disclosure provide techniques and configurations for an apparatus for package inspection. In some embodiments, the apparatus may include a light source to selectively project a first light defined by a first wavelength range to a surface of a package under inspection; an optical filter to selectively transmit, within a second wavelength range, a second light emitted by the surface of the package in response to the projection of the first light to the surface; a camera to generate one or more images of the surface, defined by the second light; and a controller coupled with the light source, optical filter, and camera, to process the one or more images, to detect a presence of a material of interest on the surface of the package, based at least in part on the first and second wavelength ranges. Other embodiments may be described and/or claimed.Type: ApplicationFiled: March 17, 2017Publication date: November 7, 2019Inventors: Liang ZHANG, Jianyong MO, Darren A. VANCE, Di XU, Gregory S. CLEMONS, Robert F. WIEDMAIER
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Publication number: 20190293558Abstract: Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.Type: ApplicationFiled: March 23, 2018Publication date: September 26, 2019Inventors: Jianyong MO, Darren VANCE, Di XU, Liang ZHANG
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Patent number: 10401286Abstract: Embodiments herein relate to identifying whether a threshold amount of material is on a surface. In particular, an apparatus may have an inspection module to receive an image of a surface captured by a camera, where the surface is illuminated by a light source positioned at an angle to the surface. The apparatus may then analyze the received image to identify a measurement of light intensity of one or more portions of the surface; and determine, based on the analysis, whether each of the one or more portions of the surface includes a threshold amount of a material on the surface.Type: GrantFiled: March 23, 2018Date of Patent: September 3, 2019Assignee: Intel CorporationInventors: Jianyong Mo, Darren Vance, Di Xu, Liang Zhang
