Abstract: Embodiments disclosed herein include a capacitor apparatus. In an embodiment, the apparatus comprises a first metal layer and a first plate above the first metal layer, where the first plate is electrically conductive. In an embodiment, a second plate is above the first plate, where the second plate is electrically conductive, and a third plate is above the second plate, where the third plate is electrically conductive. In an embodiment, a second metal layer is above the third plate, and a first via is between the first metal layer and the second metal layer, where the first via contacts the first plate and the third plate. In an embodiment, a second via is between the first metal layer and the second metal layer, where the second via contacts the second plate, and a third via is between the first metal layer and the first plate.

Abstract: Embodiments disclosed herein include an apparatus for bump translation. In an embodiment, the apparatus includes a substrate with a first bump field with a first height and a first depth on the substrate, where the first depth is orthogonal to the first height, and where the first bump field further comprises a first pitch in a direction of the first height. In an embodiment, the apparatus includes a second bump field with a second height and a second depth on the substrate, where the second depth is orthogonal to the second height, and where the second bump field comprises a second pitch in a direction of the second height, where the second pitch is smaller than the first pitch. Embodiments include a third bump field with a third height and the second depth, where a sum of the second height and the third height is equal to the first height.

Abstract: An interposer layer includes an integral waveguide to facilitate high speed (e.g., greater than 80 GHz) communication between semiconductor dies in a semiconductor package. An interposer layer may include a waveguide member and a dielectric layer disposed adjacent at least a portion of an exterior perimeter of the waveguide member. The waveguide member includes a material having a first relative permittivity. The dielectric member includes a material having a second relative permittivity that is less than the first relative permittivity. The waveguide member and the dielectric member form an interposer layer having an upper surface and a lower surface. A first conductive sheet may be disposed proximate the upper surface of the interposer layer and a second conductive sheet may be disposed proximate the lower surface of the interposer layer.

Abstract: An instant gazebo is provided which is movable between an open and closed position quickly and which is side supported to allow maximum flexibility for placement of furniture in the gazebo. The gazebo includes an openable and closable canopy to which is connected a screen enclosure which extends completely around the periphery of the canopy. The screen enclosure may remain attached to the canopy in both the open and closed positions of the gazebo. The preferred actuation mechanism for the gazebo includes an elongated curved support arm which slides through a hollow sleeve carried at the top of a supporting mast. The support arm slides through the hollow sleeve as the gazebo is opened or closed. After the support arm is raised by the user, a hand crank is actuated to open the canopy. A rotatable mast support allows the gazebo to be easily rotated about the axis of the mast.