Abstract: The present application discloses a double-sided SiP packaging structure and a manufacturing method thereof, wherein the double-sided SiP packaging structure comprises a substrate, a first packaging structure arranged on the substrate, and a second packaging structure arranged below the substrate; the second packaging structure comprises a chip, interposer and a molding material; a conductive structure array is arranged on an upper surface of the interposer; the interposer is arranged below the substrate through the conductive structure array; a space region among a lower surface of the substrate, the chip and the interposer is filled with the molding material; a conductive bonding pad array is arranged on the lower surface of the interposer; and a groove is formed in a part of region between the conductive bonding pad and an edge contour of the interposer.

Abstract: A method and apparatus used for extracting a feature point of an environmental target, which relate to the field of vehicles. The method comprises: acquiring the position of each corner point of an environmental target; and determining a feature point of the environmental target according to the position of each corner point of the environmental target. Thus, the problem wherein target identification is not precise may be solved, which is particularly suitable for the identification of a large target.