Patents by Inventor Jianzhe Ye

Jianzhe Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10181368
    Abstract: A circuit protection device including a PTC device and a diode. A first insulation layer is formed between first electrode surfaces of the diode and the PTC device. Vias for thermally and electrically connecting the first electrode surfaces of the diode and the PTC device are formed in the first insulation layer. First, second, and third external electrode pads are provided on a second insulation layer formed on the second electrode surface of the PTC device. The second electrode surface of the PTC device is electrically connected to the first external electrode pad. The first electrode surface of the diode and the first electrode surface of the PTC device are electrically connected to the second external electrode pad. A second electrode surface of the diode is electrically connected to the third external electrode pad.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: January 15, 2019
    Assignee: Littelfuse Electronics (Shanghai) Co., Ltd.
    Inventors: Jianzhe Ye, Bin Wang, Hui Hu, Tao Guo, Jianyong Liu
  • Patent number: 9484337
    Abstract: A circuit protection device is provided and includes a first insulation layer, a second insulation layer, a thermal fuse, a diode, a first exterior electrode pad, a second exterior electrode pad, and a third exterior electrode pad. The second insulation layer is positioned above a top surface of the first insulation layer. The thermal fuse is packaged in the first insulation layer and having a first electrode end and a second electrode end positioned opposite to the first electrode end. The diode is packaged in the second insulation layer and having a first electrode surface and a second electrode surface positioned opposite to the first electrode surface. The first exterior electrode pad is positioned on a bottom surface of the first insulation layer and electrically connected to the first electrode surface and the first electrode end.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: November 1, 2016
    Assignee: TYCO ELECTRONICS (SHANGHAI) CO. LTD.
    Inventors: Yan Fang, Bin Wang, Jianzhe Ye, Tao Guo, Jianyong Liu
  • Publication number: 20160056139
    Abstract: A circuit protection device is provided and includes a first insulation layer, a second insulation layer, a thermal fuse, a diode, a first exterior electrode pad, a second exterior electrode pad, and a third exterior electrode pad. The second insulation layer is positioned above a top surface of the first insulation layer. The thermal fuse is packaged in the first insulation layer and having a first electrode end and a second electrode end positioned opposite to the first electrode end. The diode is packaged in the second insulation layer and having a first electrode surface and a second electrode surface positioned opposite to the first electrode surface. The first exterior electrode pad is positioned on a bottom surface of the first insulation layer and electrically connected to the first electrode surface and the first electrode end.
    Type: Application
    Filed: August 25, 2015
    Publication date: February 25, 2016
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Yan Fang, Bin Wang, Jianzhe Ye, Tao Guo, Jianyong Liu
  • Publication number: 20160049784
    Abstract: A circuit protection device that includes a PTC device and a diode is disclosed. A first insulation layer is formed between the first electrode surfaces of the diode and the PTC device. Vias for thermally and electrically connecting the first electrode surface of the diode and the first electrode surface of the PTC device are formed in the first insulation layer. First, second, and third external electrode pads are provided on the second insulation layer formed on the second electrode surface of the PTC device. The second electrode surface of the PTC device is electrically connected to the first external electrode pad. The first electrode surface of the diode and the first electrode surface of the PTC device are electrically connected to the second external electrode pad. The second electrode surface of the diode is electrically connected to the third external electrode pad.
    Type: Application
    Filed: August 12, 2015
    Publication date: February 18, 2016
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Jianzhe Ye, Bin Wang, Hui Hu, Tao Guo, Jianyong Liu