Patents by Inventor Jianzhong Pan

Jianzhong Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10898409
    Abstract: A massage mechanism and its massager. The massage mechanism includes a base, motor, drive assembly, first drive shaft, first bearing, first massage drive assembly, first massage head assembly, inter-shaft drive assembly, second transmission shaft, second bearing, second massage drive assembly and second massage head. There is also provided a massager including the foregoing massage mechanism. The mechanism could optimize those unstable and noisy features for an ideal massage experience, and solve the problem that multiple massage actions cannot be driven by a single motor.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: January 26, 2021
    Assignee: SHENZHEN FORREST HEALTH TECHNOLOGY CO., LTD.
    Inventors: Jianzhong Pan, Hailin Liu
  • Publication number: 20190053971
    Abstract: A massage mechanism and its massager. The massage mechanism includes a base, motor, drive assembly, first drive shaft, first bearing, first massage drive assembly, first massage head assembly, inter-shaft drive assembly, second transmission shaft, second bearing, second massage drive assembly and second massage head. There is also provided a massager including the foregoing massage mechanism. The mechanism could optimize those unstable and noisy features for an ideal massage experience, and solve the problem that multiple massage actions cannot be driven by a single motor.
    Type: Application
    Filed: October 18, 2017
    Publication date: February 21, 2019
    Applicant: SHENZHEN FORREST HEALTH EQUIPMENTS CO., LTD
    Inventors: Jianzhong PAN, Hailin LIU
  • Patent number: 10168015
    Abstract: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: January 1, 2019
    Assignee: Koninklijke Philips N.V.
    Inventors: Hui Ling Pan, Hiu Tung Chu, Paul Scott Martin, Jianzhong Pan, Hua Sin Daniel Yew
  • Patent number: 9941640
    Abstract: A connector is provided and includes a housing with an electronic module receiving passageway positioned therein. The housing includes a first housing and a second housing. The first housing includes a pair of first sidewalls positioned opposite from each other and a pair of partitions forming a slot extending along each of the pair of first sidewalls. The second housing includes a pair of second sidewalls positioned opposite one another, an extension disposed on each the pair of second sidewalls and corresponding with the slot, and a plurality of ribs extending outward from the extension and corresponding with inner surface of the pair of partitions.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: April 10, 2018
    Assignees: TE Connectivity Corporation, Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Youwei Pan, Hongqiang Han, Wenyu Liu, Jianzhong Pan, Steven David Dunwoody, Richard James Long, Matthew Ryan Schmitt, Alex Michael Sharf, Kevin Edward Weidner
  • Publication number: 20170241611
    Abstract: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.
    Type: Application
    Filed: May 18, 2015
    Publication date: August 24, 2017
    Inventors: Hui Ling Pan, Hiu Tung Chu, Paul Scott Martin, Jianzhong Pan, Hua Sin Daniel Yew
  • Publication number: 20160170162
    Abstract: A connector is provided and includes a housing with an electronic module receiving passageway positioned therein. The housing includes a first housing and a second housing. The first housing includes a pair of first sidewalls positioned opposite from each other and a pair of partitions forming a slot extending along each of the pair of first sidewalls. The second housing includes a pair of second sidewalls positioned opposite one another, an extension disposed on each the pair of second sidewalls and corresponding with the slot, and a plurality of ribs extending outward from the extension and corresponding with inner surface of the pair of partitions.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 16, 2016
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics Corporation
    Inventors: Youwei Pan, Hongqiang Han, Wenyu Liu, Jianzhong Pan, Steven David Dunwoody, Richard James Long, Matthew Ryan Schmitt, Alex Michael Sharf, Kevin Edward Weidner
  • Patent number: D803429
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: November 21, 2017
    Assignee: Koninklijke Philips N.V.
    Inventors: Paul Scott Martin, Jin Cherl Kwon, Leifang Shi, Xiaofang Mo, Jianzhong Pan, Hiu Tung Chu
  • Patent number: D806441
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: January 2, 2018
    Assignee: Shenzhen Forrest Health Equipments Co., Ltd.
    Inventor: Jianzhong Pan