Patents by Inventor Jiaoping Huang

Jiaoping Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250007385
    Abstract: The application discloses an ANPC power module. at least one power module, wherein the power module comprises six switch assemblies, a DC end, a GND end and an SW end, the six switch assemblies comprise two outer switches, two inner switches and two clamping switches, wherein an additional capacitor lead-out terminal is arranged at an electrical connection of each of the two inner switches and the two switch bridge arms, the capacitor lead-out terminal is used for setting a high-frequency filter capacitor, and two ends of the high-frequency filter capacitor are electrically connected with the capacitor lead-out terminals corresponding to the two switch bridge arms respectively. The application can effectively improve the instantaneous dynamic voltage spike of the high-frequency switching action, improve the oscillation frequency, increase the working voltage range of the device, and prevent the EMI noise from interference the devices outside of the ANPC power module.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 2, 2025
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Shouyu Hong, Xiaoni Xin, Jiaoping Huang, Dong Xu, Hong Jiang
  • Publication number: 20240136119
    Abstract: A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 25, 2024
    Inventors: Shouyu Hong, Qingdong Chen, Xin Zou, Mingzhun Zhang, Jiaoping Huang, Jinping Zhou
  • Patent number: 11901114
    Abstract: A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: February 13, 2024
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Shouyu Hong, Qingdong Chen, Xin Zou, Mingzhun Zhang, Jiaoping Huang, Jinping Zhou
  • Publication number: 20220077772
    Abstract: A power module includes a substrate, at least one power unit, a first carrier plate and at least one input capacitor. The power unit is disposed on the substrate and includes at least one half-bridge circuit including a first power switch and a second power switch connected in series. A second terminal of the first power switch and a first terminal of the second power switch are connected to a node. The first carrier plate and the input capacitor are arranged between the power unit and the substrate. A first electrode of the substrate is connected with the node through the first carrier plate. A top surface of a first terminal of the input capacitor is connected with a first terminal of the first power switch, and a top surface of a second terminal of the input capacitor is connected with a second terminal of the second power switch.
    Type: Application
    Filed: November 16, 2021
    Publication date: March 10, 2022
    Inventors: Shouyu Hong, Qingdong Chen, Xin Zou, Mingzhun Zhang, Jiaoping Huang, Jinping Zhou
  • Publication number: 20210193376
    Abstract: A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.
    Type: Application
    Filed: September 9, 2020
    Publication date: June 24, 2021
    Inventors: Shouyu Hong, Qingdong Chen, Xin Zou, Mingzhun Zhang, Jiaoping Huang, Jinping Zhou