Abstract: An edge exposure apparatus and method are disclosed. The edge exposure apparatus includes: a base frame (1); an edge exposure unit (2) mounted on the base frame and configured to perform an edge exposure process on a wafer; a pre-alignment unit (3) for centering and orienting the wafer and cooperating with the edge exposure unit (2) in the edge exposure process; a cassette unit (4) for storing and detecting the wafer; a robotic arm (5) for transferring the wafer; and a master control unit (6) for controlling the above components of the edge exposure apparatus. The edge exposure unit (2) and the pre-alignment unit (3) share a common worktable, resulting in structural compactness. Alternatively, two pre-alignment units (3) and two edge exposure units (2) may be included in order to increase processing efficiency.

Abstract: An edge exposure apparatus and method are disclosed. The edge exposure apparatus includes: a base frame (1); an edge exposure unit (2) mounted on the base frame and configured to perform an edge exposure process on a wafer; a pre-alignment unit (3) for centering and orienting the wafer and cooperating with the edge exposure unit (2) in the edge exposure process; a cassette unit (4) for storing and detecting the wafer; a robotic arm (5) for transferring the wafer; and a master control unit (6) for controlling the above components of the edge exposure apparatus. The edge exposure unit (2) and the pre-alignment unit (3) share a common worktable, resulting in structural compactness. Alternatively, two pre-alignment units (3) and two edge exposure units (2) may be included in order to increase processing efficiency.

Abstract: A method for pre-aligning a substrate includes the steps of: 1) providing a substrate having a plurality of marks are arranged circumferentially on a surface thereof, wherein each of the plurality of marks consists of at least one first stripe extending in a first direction and at least one second stripe extending in a first direction; 2) aligning a center of the substrate with a given point on a substrate carrier stage; 3) illuminating a mark selected from the plurality of marks on the surface of the substrate with light and obtaining an image of the selected mark; 4) processing the image to obtain first projection data corresponding to the first direction and second projection data corresponding to the second direction; 5) identifying a set of first peak values corresponding to the at least one first stripe of the selected mark from the first projection data and a set of second peak values corresponding to the at least one second stripe of the selected mark from the second projection data; 6) selecting firs

Abstract: An apparatus for pre-aligning a wafer comprises: a wafer stage for carrying the wafer, wherein a first alignment mark (W1) and a second alignment mark (W2) are arranged on the wafer such that they are substantially symmetrical to each other with respect to a center of the wafer; a peripheral vision acquisition system (1), configured to perform a first positional compensation for the wafer based on a relative positional relationship of an edge or a notch of the wafer with respect to the wafer stage; and a mark detection system (4), configured to capture images of the first and second alignment marks (W1, W2) and perform a second positional compensation for the wafer by determining a relative positional relationship of the center of the wafer with respect to a center of the wafer stage based on the positions of the first and second alignment marks (W1, W2) in a coordinate system of the mark detection system, wherein the coordinate system of the mark detection system (4) has a horizontal axis (X) defined by a li

Abstract: An apparatus for pre-aligning a wafer comprises: a wafer stage for carrying the wafer, wherein a first alignment mark (W1) and a second alignment mark (W2) are arranged on the wafer such that they are substantially symmetrical to each other with respect to a center of the wafer; a peripheral vision acquisition system (1), configured to perform a first positional compensation for the wafer based on a relative positional relationship of an edge or a notch of the wafer with respect to the wafer stage; and a mark detection system (4), configured to capture images of the first and second alignment marks (W1, W2) and perform a second positional compensation for the wafer by determining a relative positional relationship of the center of the wafer with respect to a center of the wafer stage based on the positions of the first and second alignment marks (W1, W2) in a coordinate system of the mark detection system, wherein the coordinate system of the mark detection system (4) has a horizontal axis (X) defined by a li

Abstract: A method for pre-aligning a substrate includes the steps of: 1) providing a substrate having a plurality of marks are arranged circumferentially on a surface thereof, wherein each of the plurality of marks consists of at least one first stripe extending in a first direction and at least one second stripe extending in a first direction; 2) aligning a center of the substrate with a given point on a substrate carrier stage; 3) illuminating a mark selected from the plurality of marks on the surface of the substrate with light and obtaining an image of the selected mark; 4) processing the image to obtain first projection data corresponding to the first direction and second projection data corresponding to the second direction; 5) identifying a set of first peak values corresponding to the at least one first stripe of the selected mark from the first projection data and a set of second peak values corresponding to the at least one second stripe of the selected mark from the second projection data; 6) selecting firs