Abstract: The present disclosure discloses a method for manufacturing a color Micro LED display chip module, comprising preparing a Micro LED chip on a substrate, grinding and cutting the chip and then flip-bonding same on a driving basal plate, and peeling the substrate from the chip. Through fabricating a quantum dot hole site corresponding to a sub-pixel unit position of a chip on a transparent basal plate and filling a quantum dot light-color converter in the quantum dot hole site and depositing a quantum dot protective layer, a conversion device is fabricated independently on the transparent basal plate. Compared with processing a conversion layer on a substrate layer in the prior art, inverting a full-color quantum dot conversion device and then aligning and bonding same with the integrated monochrome Micro LED module base can improve the fabrication efficiency, eliminate the crosstalk between light and color in full-color Micro LED display.

Abstract: Disclosed are a backlight-type Mini LED chip and a fabrication method therefor. According to a preset arrangement of Mini LED chips, a grating in a shape corresponding to the preset arrangement is etched on a backlight reflective layer of each chip, such that the light shape of the Mini LED chips is controlled, the chips can be divided into more regions, which is equivalent to increasing the arrangement density of the chips, the visual resolution experience is improved, and the resolution perceived by human eyes is increased, thus improving the display effect of the chips; and the width of the grating can be adjusted to change the ratio of vertical emergent light and lateral emergent light of the chip, so as to adjust the angle and intensity of emergent light of the chip, such that the control effect and display effect of the Mini LED chips are further improved.