Patents by Inventor Jiaping Wang

Jiaping Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080143719
    Abstract: A method, device and system is provided for providing global illumination of a scene. For example, global illumination may be provided in a rendered 3-dimensional image that may contain objects and/or light sources. Radiance functions or visibility functions may further be represented by scaling of spherical harmonics functions in the spherical harmonics domain. For example, scaling of spherical harmonics coefficients corresponding to a spherical function may be performed based on a spherical harmonics scaling transformation matrix based on an angular scaling function.
    Type: Application
    Filed: December 18, 2006
    Publication date: June 19, 2008
    Applicant: Microsoft Corporation
    Inventors: Kun Zhou, Jiaping Wang, Stephen Lin, Baining Guo
  • Patent number: 7361412
    Abstract: Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure.
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: April 22, 2008
    Assignee: Johns Hopkins University
    Inventors: Jiaping Wang, Etienne Besnoin, Omar Knio, Timothy P. Weihs
  • Publication number: 20080000949
    Abstract: In accordance with the invention, bodies of materials are joined by disposing between them a reactive multilayer foil and one or more layers of meltable joining material such as braze or solder. The bodies are pressed together against the foil and joining material, and the foil is ignited to melt the joining material. The pressing is near the critical pressure and typically produces a joint having a strength of at least 70-85% the maximum strength producible at practical maximum pressures. Thus for example, reactively formed stainless steel soldered joints that were heretofore made at an applied pressure of about 100 MPa can be made with substantially the same strength at a critical applied pressure of about 10 kPa. Advantages of the process include minimization of braze or solder extrusion and reduced equipment and processing costs, especially in the joining of large bodies.
    Type: Application
    Filed: August 8, 2007
    Publication date: January 3, 2008
    Inventors: Jiaping Wang, Omar Knio, Timothy Weihs, Etienne Besnoin
  • Patent number: 7312797
    Abstract: Representing quasi-homogenous materials is described. In one aspect, quasi-homogenous materials are modeled to generate a material model of a physical sample. The material model identifies how light is scattered by the quasi-homogenous materials. The material model, independent of an object model of the physical sample, provides information that is useful to texture surfaces of arbitrary types and sizes of mesh models (e.g., representing the physical sample or other objects) with the quasi-homogenous materials.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: December 25, 2007
    Assignee: Microsoft Corporation
    Inventors: Xin Tong, Jiaping Wang, Stephen S. Lin, Baining Guo, Heung-Yeung Shum
  • Publication number: 20070247472
    Abstract: A method and system for implementing capturing and rendering geometric details for mesostructure surfaces is described herein. A mesostructure distance function is defined as a function of a given reference point and a given viewing direction. A distance from a reference point to a mesostructure surface point along a viewing direction is measured using the mesostructure distance function. This distance is used to determine the visibility of mesostructure surface for rendering silhouettes. The lighting visibility of the mesostructure surface point may also be determined and used for determining whether the mesostructure surface point is in shadow. This determination may then be used for rendering shadow silhouettes.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 25, 2007
    Applicant: Microsoft Corporation
    Inventors: Xin Tong, Yanyun Chen, Baining Guo, Heung-Yeung Shum, Jiaping Wang, John Snyder
  • Publication number: 20060290719
    Abstract: Representing quasi-homogenous materials is described. In one aspect, quasi-homogenous materials are modeled to generate a material model of a physical sample. The material model identifies how light is scattered by the quasi-homogenous materials. The material model, independent of an object model of the physical sample, provides information that is useful to texture surfaces of arbitrary types and sizes of mesh models (e.g., representing the physical sample or other objects) with the quasi-homogenous materials.
    Type: Application
    Filed: June 24, 2005
    Publication date: December 28, 2006
    Applicant: Microsoft Corporation
    Inventors: Xin Tong, Jiaping Wang, Stephen Lin, Baining Guo, Heung-Yeung Shum
  • Publication number: 20050136270
    Abstract: An embodiment of the invention includes a method of simulating a behavior of an energy distribution within a soldered or brazed assembly to predict various physical parameters of the assembly. The assembly typically includes a reactive multilayer material. The method comprises the steps of providing an energy evolution equation having an energy source term associated with a self-propagating reaction that originates within the reactive multilayer material. The method also includes the steps of discretizing the energy evolution equation, and determining the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using other parameters associated with the assembly.
    Type: Application
    Filed: May 12, 2004
    Publication date: June 23, 2005
    Inventors: Etienne Besnoin, Jiaping Wang, Alan Duckham, Stephen Spey, David Heerden, Timothy Weihs, Omar Knio
  • Publication number: 20050082343
    Abstract: In accordance with the invention, bodies of materials are joined by disposing between them a reactive multilayer foil and one or more layers of meltable joining material such as braze or solder. The bodies are pressed together against the foil and joining material, and the foil is ignited to melt the joining material. The pressing is near the critical pressure and typically produces a joint having a strength of at least 70-85% the maximum strength producible at practical maximum pressures. Thus for example, reactively formed stainless steel soldered joints that were heretofore made at an applied pressure of about 100 MPa can be made with substantially the same strength at a critical applied pressure of about 10 kPa. Advantages of the process include minimization of braze or solder extrusion and reduced equipment and processing costs, especially in the joining of large bodies.
    Type: Application
    Filed: July 23, 2004
    Publication date: April 21, 2005
    Inventors: Jiaping Wang, Omar Knio, Timothy Weihs
  • Publication number: 20050051607
    Abstract: Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure.
    Type: Application
    Filed: May 13, 2004
    Publication date: March 10, 2005
    Inventors: Jiaping Wang, Etienne Besnoin, Omar Knio, Timothy Weihs