Patents by Inventor Jiaqi Hu

Jiaqi Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117125
    Abstract: A regenerated polymer alloy material is provided. The regenerated polymer alloy material is mainly prepared from the following raw materials in parts by mass: a waste HIPS: 55-70, a PP: 30-45, an alkylation reaction catalyst: 0.1-0.4, a co-catalyst: 0.1-0.3, and a HIPS-based macromolecular chain extender: 2-8. The regenerated polymer alloy material uses the waste HIPS and the PP new materials as raw materials, to obtain a waste HIPS based regenerated polymer alloy material with excellent comprehensive properties by using two types of chemical modifiers in combination in segments. The waste HIPS based regenerated polymer alloy material has environmental protection and high value. Further, a method for preparing the regenerated polymer alloy material is also provided.
    Type: Application
    Filed: November 22, 2022
    Publication date: April 11, 2024
    Applicant: CHINA NATIONAL ELECTRIC APPARATUS RESEARCH INSTITUTE CO., LTD.
    Inventors: Nuo CAO, Jiaqi HU, Yonggao FU, Ling WANG, Chao WAN
  • Publication number: 20230271942
    Abstract: Provided are a compound of formula (I) or a tautomer, a mesomer, a raceme, an enantiomer, a diastereoisomer, or a pharmaceutically acceptable salt thereof, and the use thereof in the preparation of drugs for diseases mediated by CDK9.
    Type: Application
    Filed: August 6, 2021
    Publication date: August 31, 2023
    Applicant: PHARMABLOCK SCIENCES (NANJING), INC.
    Inventors: Zuozhong PENG, Jilin JIA, Jiaqi HU, Qian CUI, Yizhou WU, Yunfei YI, Qiuhong CHEN, Jie WANG
  • Publication number: 20230078328
    Abstract: The present invention discloses a regenerated HIPS/PPO alloy material based on chemical and physical co-modification, which is mainly composed of the following components in parts by mass: waste HIPS 60-70, PPO 30-40, HIPS-based macromolecular chain extender 2-8, elastomer toughening agent 2-10, oxazoline chain extender 0.2-1, and chain-extension catalyst 0.1-0.4. The alloy material uses chemical modification of in-situ chain extension and compatibilization of the macromolecular chain extender to restore a molecular chain structure, improve a phase interface and increase compatibility of the alloy. Through physical modification introduced by adding the elastomer toughening agent, a combined effect of chemical modification and physical modification is exploited, with target properties improved, a regenerated plastic alloy material with an excellent comprehensive property prepared, and the waste fully utilized to achieve energy saving and emission reduction.
    Type: Application
    Filed: July 28, 2021
    Publication date: March 16, 2023
    Applicant: CHINA NATIONAL ELECTRIC APPARATUS RESEARCH INSTITUTE CO., LTD.
    Inventors: Nuo CAO, Yonggao FU, Jiaqi HU, Ling WANG, Chao WAN
  • Publication number: 20210197277
    Abstract: The present invention belongs to the technical field of metal materials for additive manufacturing, and relates to a Mn—Cu-based damping alloy powder for use in a selective laser melting (SLM) process and a preparation method thereof. The powder has chemical components in percent by weight as follows: C: ?0.15%, Ni: 4.9-5.2%, Si: ?0.15%, Fe: 1.8-5.0%, Cu: 20-23%, P: ?0.03%, S: ?0.06%, and the balance being Mn and inevitable impurities. The preparation method includes: preparation of master alloy, powdering by vacuum induction melting gas atomization (VIGA), mechanical vibrating and air classification screening under protection of an inert gas and collecting. Compared with the prior art, the powder of the present invention has a high sphericity, a high apparent density, a small angle of repose, a desired fluidity and a relatively high yield of fine powders having a size of 15-53 ?m.
    Type: Application
    Filed: December 29, 2020
    Publication date: July 1, 2021
    Inventors: Changjun Wang, Yongqing Sun, Zhenbao Liu, Jianxiong Liang, Zhiyong Yang, Jie Su, Chunxu Wang, Wenhui LI, Conghui Ma, Jiaqi Hu, Yong Li, Shun Han, Jing Ning, Qi Gao
  • Patent number: D964423
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: September 20, 2022
    Assignee: KWAI GAMES PTE. LTD.
    Inventors: Yifan Wang, Ge Song, Jiaqi Hu, Hui Li