Patents by Inventor Jia-Wei Li

Jia-Wei Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7334327
    Abstract: A method of manufacturing a RF connector includes the following steps. First, a first workpiece with first assembly units is provided. Each first assembly unit includes a first joint piece with a first joint portion, a metal shell with a ring and soldering tags extending therefrom, and a first connection portion connecting the first joint piece and the ring. Next, a second workpiece with second assembly units is provided. Each second assembly unit includes a second joint piece with a second joint portion, a center contact with a base and a center pin disposed thereon, and a second connection portion connecting the second joint piece and the base. Then, the first and second joint portions are positioned to contact with each other and then riveted together. Then, dielectric bodies are formed to at least correspondingly cover part of each ring and each base. Thereafter, a singularizing process is performed.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: February 26, 2008
    Assignee: Speed Tech Corp.
    Inventors: Li-Sen Chen, Wen-Hsing Zhang, Jia-Wei Li
  • Publication number: 20080034583
    Abstract: A method of manufacturing a RF connector includes the following steps. First, a first workpiece with first assembly units is provided. Each first assembly unit includes a first joint piece with a first joint portion, a metal shell with a ring and soldering tags extending therefrom, and a first connection portion connecting the first joint piece and the ring. Next, a second workpiece with second assembly units is provided. Each second assembly unit includes a second joint piece with a second joint portion, a center contact with a base and a center pin disposed thereon, and a second connection portion connecting the second joint piece and the base. Then, the first and second joint portions are positioned to contact with each other and then riveted together. Then, dielectric bodies are formed to at least correspondingly cover part of each ring and each base. Thereafter, a singularizing process is performed.
    Type: Application
    Filed: August 14, 2006
    Publication date: February 14, 2008
    Inventors: Li-Sen Chen, Wen-Hsing Zhang, Jia-Wei Li