Patents by Inventor Jiawei ZHAO

Jiawei ZHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12271434
    Abstract: Various embodiments are generally directed to techniques for crowdsourcing metadata, such as to create, maintain, utilize, and/or communicate metadata in a datastore. Some embodiments are particularly directed to collecting, managing, and/or distributing metadata via a user interface application (UIA), or an extension thereof. Many embodiments may facilitate collaborative creation of a repository for metadata, such as notes, characteristics, and/or statistics corresponding to data viewed with the user interface application. For example, the comments regarding websites may be collected from a first user via a first instantiation of the web browser extension and distributed to a second user via a second instantiation of the web browser extension. In several embodiments, the metadata may be collected and managed with instantiations of the web browser extension (herein after “WBE instants”) and a data manager may create, maintain, utilize, and/or communicate metadata in a datastore.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 8, 2025
    Assignee: Capital One Services, LLC
    Inventors: Daniel Jarvis, Jiawei Zhao, Robert Chen
  • Patent number: 12261259
    Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: March 25, 2025
    Assignees: BOE MLED Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Linxia Qi, Junjie Ma, Yuanda Lu, Shanwei Yang, Jiawei Zhao, Zhijun Xiong, Haiwei Sun, Lingyun Shi, Jinpeng Li
  • Patent number: 12222846
    Abstract: According to certain aspects of the disclosure, non-transitory computer readable media, systems and methods are disclosed for creating and executing test scenarios for automated testing of web pages. A computer system, for example, may perform operations including: recording one or more actions performed by a user on a web page, the one or more actions resulting in a web page element being displayed in the web browser application, recording an identifier of the web page element, in response to detecting a user input indicating a selection of the web page element, and recording a characteristic of the web page element; and generating, by the testing extension, a test scenario specifying a testable outcome resulting from the one or more actions, the testable outcome being an occurrence of an element having the identifier and the characteristic.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: February 11, 2025
    Assignee: Capital One Services, LLC
    Inventors: Jiawei Zhao, Carine Todmia
  • Patent number: 12186887
    Abstract: A robot system for servicing a semiconductor tool includes a cart frame. An arm support frame is fixed to the cart frame and is coupled to a robot arm. An arm frame is connected by hinges to the arm support frame at a first end and to a fixture connect interface at a second end. The fixture connect interface connects to a docking fixture of the semiconductor tool. An arm locking mechanism is attached to the arm support frame for locking the arm frame, when rotated, to an extended position or a folded position. The fixture connect interface connects the cart frame to the semiconductor tool, when the arm frame is locked in the extended position.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: January 7, 2025
    Assignee: Lam Research Corporation
    Inventors: Vitali Brand, Kamesh Venkata Gadepally, Jiawei Zhao, Dan Marohl, Niraj Vaghela, Heng Liu, Alexander James Walker, Zachary Jake Blum, Matthew Christopher Clark, Jessica Jeana Kim
  • Publication number: 20240390382
    Abstract: Described herein are methods and compositions for treating cancer. Aspects of the invention relate to administering to a subject having cancer an inhibitor of the super elongation complex (SEC). In various embodiments, the cancer is a blood cancer. Wherein the blood cancer is selected from the group consisting of leukemia, lymphoma, myeloma, and myeloproliferative neoplasms (MPNs).
    Type: Application
    Filed: September 22, 2022
    Publication date: November 28, 2024
    Applicant: THE CHILDREN'S MEDICAL CENTER CORPORATION
    Inventors: Vijay G. Sankaran, Jiawei Zhao, Liam D. Cato
  • Publication number: 20240363799
    Abstract: Provided are a light-emitting device, a light-emitting substrate and a display device. The light-emitting device includes: a substrate; a first semiconductor layer, the first semiconductor layer being located on one side of the substrate; a light-emitting layer, the light-emitting layer being located on the side of the first semiconductor layer facing away from the substrate; and a second semiconductor layer, the second semiconductor layer being located on the side of the light-emitting layer facing away from the first semiconductor layer.
    Type: Application
    Filed: September 29, 2021
    Publication date: October 31, 2024
    Inventors: Yuanda LU, Shanwei YANG, Jiawei ZHAO, Zhijun XIONG, Yuanhao SUN, Xueqiao LI, Junjie MA
  • Publication number: 20240339575
    Abstract: A light emitting diode chip, including at least two light emitting structures spaced apart and sequentially connected in series on a base substrate. At least one of the light emitting structures includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first insulation layer, a current spreading layer and a first electrode stacked in sequence. The at least one light emitting structure includes a first via hole in the first insulation layer, the first electrode is electrically connected to the current spreading layer, and the current spreading layer is electrically connected to the second semiconductor layer through the first via hole. An orthographic projection of the first via hole on the base substrate falls within that of the current spreading layer, and the orthographic projection of the current spreading layer on the base substrate falls within that of the second semiconductor layer.
    Type: Application
    Filed: November 30, 2022
    Publication date: October 10, 2024
    Inventors: Yuanda Lu, Junjie Ma, Yuanhao Sun, Jiawei Zhao, Zhijun Xiong, Xueqiao Li, Shanwei Yang, Yutian Chu, Linxia Qi
  • Publication number: 20240322082
    Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
    Type: Application
    Filed: June 4, 2024
    Publication date: September 26, 2024
    Applicants: BOE MLED Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Junjie Ma, Haiwei Sun, Yuanda Lu, Shanwei Yang, Linxia Qi, Zhijun Xiong, Jiawei Zhao
  • Patent number: 12083745
    Abstract: A 3D printing device and method for integrated manufacturing of functionally gradient materials and three-dimensional structures. The device includes an active and passive mixing and printing module and a constraining and sacrificial layer printing module. An input end of the active mixing module connects to multiple anti-settling feeding modules, and an output end of the active mixing module connects to the passive mixing and printing module. The passive mixing and printing module and the constraining and sacrificial layer printing module are mounted on one side of an XYZ three-axis module. The constraining and sacrificial layer printing module connects to a constraining and sacrificial layer feeding module and prints and forms a functionally gradient three-dimensional structure.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: September 10, 2024
    Assignees: QINGDAO UNIVERSITY OF TECHNOLOGY, QINGDAO 5D INTELLIGENT ADDITIVE MANUFACTURING TECHNOLOGY CO., LTD.
    Inventors: Hongbo Lan, Pengfei Guo, Xin Lin, Guangming Zhang, Xiaoyang Zhu, Jiawei Zhao, Quan Xu, Jianjun Yang
  • Publication number: 20240297283
    Abstract: Provided is a light emitting diode chip, including: a base substrate; at least two light emitting units disposed on the base substrate, wherein the at least two light emitting units include adjacent first light emitting unit and second light emitting unit, and each of the first light emitting unit and the second light emitting unit includes: a first semiconductor layer disposed on the base substrate; a light emitting layer disposed on the first semiconductor layer away from the base substrate; and a second semiconductor layer disposed on the light emitting layer away from the base substrate, wherein the light emitting diode chip further includes a bridging part for conducting, and the bridging part is configured to electrically connect the second semiconductor layer of the first light emitting unit with the first semiconductor layer of the second light emitting unit.
    Type: Application
    Filed: March 31, 2022
    Publication date: September 5, 2024
    Applicants: BOE MLED Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yuanda Lu, Jiawei Zhao, Zhijun Xiong, Shanwei Yang, Xueqiao Li, Yuanhao Sun, Junjie Ma
  • Publication number: 20240266470
    Abstract: The present disclosure provides a light-emitting device, a light-emitting module and a preparation method thereof. The light-emitting device includes: a light-emitting structure; an electrode structure provided on the light-emitting structure; and a die-bonding structure, at least a portion of which covers a surface of the electrode structure facing away from the light-emitting structure, where the die-bonding structure includes a doping material for inhibiting generation of an intermetallic compound. The present disclosure is capable of improving the die-bonding rework yield and reducing the risk of failure of a display module.
    Type: Application
    Filed: October 29, 2021
    Publication date: August 8, 2024
    Inventors: Zhijun XIONG, Junjie MA, Yuanda LU, Jiawei ZHAO, Shanwei YANG, Yuanhao SUN, Xueqiao LI
  • Patent number: 12027648
    Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 2, 2024
    Assignees: BOE MLED Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Junjie Ma, Haiwei Sun, Yuanda Lu, Shanwei Yang, Linxia Qi, Zhijun Xiong, Jiawei Zhao
  • Publication number: 20240213422
    Abstract: A light emitting device and a preparation method therefor, and a light emitting substrate and a preparation method therefor are provided. The light emitting device includes an underlay substrate, a light emitting functional layer disposed on the underlay substrate, and a reflective layer disposed on the underlay substrate and covering at least part of the light emitting functional layer, the reflective layer includes a first material layer and a second material layer, the first material layer and the second material layer are stacked along a thickness direction of the underlay substrate, the first material layer includes an atomic crystal material, the first material layer is at one side of the second material layer away from the underlay substrate, and a surface of the first material layer away from the second material layer is formed as a surface of the reflective layer away from the underlay substrate.
    Type: Application
    Filed: October 28, 2021
    Publication date: June 27, 2024
    Inventors: Jiawei ZHAO, Junjie MA, Zhijun XIONG, Shanwei YANG, Yuanhao SUN, Yuanda LU, Xueqiao LI
  • Publication number: 20240211612
    Abstract: A data storage method includes receiving to-be-stored first data; encrypting a first data part in the to-be-stored first data; writing an encrypted first data part into a non-volatile memory; and then writing a second data part into a hard disk or a magnetic disk.
    Type: Application
    Filed: March 5, 2024
    Publication date: June 27, 2024
    Inventors: Han Xu, Tao Huang, Di Chen, Jiawei Zhao
  • Publication number: 20240213432
    Abstract: The present disclosure provides a light emitting chip and a producing method thereof, and a light emitting apparatus. The light emitting chip includes a patterned substrate; a light emitting unit, wherein the light emitting unit includes an electron injection layer, a luminescent layer and a hole injection layer; a first electrode, wherein the first electrode is connected to the electron injection layer; a second electrode, wherein the second electrode is connected to the hole injection layer; a first passivation layer, wherein the first passivation layer partially covers the light emitting unit, the first electrode and the second electrode, the first passivation layer includes a first opening, and the light emitting unit partially exposes from the first opening; and a heat dissipating layer, wherein the heat dissipating layer covers the first passivation layer, and a part of the light emitting unit exposing from the first passivation layer.
    Type: Application
    Filed: October 29, 2021
    Publication date: June 27, 2024
    Inventors: Shanwei YANG, Junjie MA, Yuanda LU, Zhijun XIONG, Linxia QI, Jiawei ZHAO, Yuanhao SUN
  • Patent number: D1028020
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: May 21, 2024
    Assignee: NINGBO TALLER INTELLIGENT TECHNOLOGY CO., LTD
    Inventors: Xiang Zhang, Liang Wang, Jiawei Zhao
  • Patent number: D1034703
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: July 9, 2024
    Assignee: NINGBO TALLER INTELLIGENT TECHNOLOGY CO., LTD
    Inventors: Xiang Zhang, Liang Wang, Jiawei Zhao
  • Patent number: D1048339
    Type: Grant
    Filed: July 19, 2024
    Date of Patent: October 22, 2024
    Inventor: Jiawei Zhao
  • Patent number: D1050378
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: November 5, 2024
    Inventor: Jiawei Zhao
  • Patent number: D1050379
    Type: Grant
    Filed: July 19, 2024
    Date of Patent: November 5, 2024
    Inventor: Jiawei Zhao