Abstract: A communication module package assembly includes a main board having grounding pads, a communication module package electrically bonded on the main board and having notches corresponding in location to the grounding pads respectively, and a metal cover covering the communication module package and having mounting legs passing through the notches and electrically connected to the grounding pads respectively. The communication module package is of stacked structure including a carrier with an opening in which a thermal conductive layer in contact with a substrate stacked on the carrier is filled. The communication module package further includes a chip electrically bonded to the substrate, received in the opening and encapsulated by the thermal conductive layer, and a metal layer sandwiched between and in contact with the thermal conductive layer and the main board.

Abstract: A wireless communication module assembly includes a main board having a top surface on which a plurality of grounding pads are provided, a circuit board unit, and a metal cap. The circuit board unit has a bottom surface electrically mounted on the top surface of the main board, a top surface with a plurality of grounding pads, and a plurality of notches corresponding to the grounding pads of the main board. The metal cap covers the circuit board unit and has first mounting legs respectively and electrically connected with the grounding pads of the circuit board unit, and second mounting legs respectively passing through the notches of the circuit board unit and electrically connected with the grounding pads of the main board.

Abstract: A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and an interposer mounted on one surface of the substrate. The interposer cooperates with the substrate to confine a receiving space for receiving the integrated circuit chips on the surface of the substrate to which the interposer is attached, and is provided with conductors that are connected electrically to the substrate. Therefore, when the interposer is mounted on a circuit board, the conductors serve as external electrical connections for the integrated circuit chips. A method for manufacturing the miniaturized multi-chip module is also disclosed.

Abstract: A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and an interposer mounted on one surface of the substrate. The interposer cooperates with the substrate to confine a receiving space for receiving the integrated circuit chips on the surface of the substrate to which the interposer is attached, and is provided with conductors that are connected electrically to the substrate. Therefore, when the interposer is mounted on a circuit board, the conductors serve as external electrical connections for the integrated circuit chips. A method for manufacturing the miniaturized multi-chip module is also disclosed.