Abstract: The invention provides a bread with D-allulose instead of sucrose and a preparation method therefor, and relates to the technical field of food processing. The starting materials include, in parts by weight: 40-60 parts of flour, 3-5 parts of gluten powder, 5-10 parts of D-allulose, 5-10 parts of eggs, 5-10 parts of milk, 3-5 parts of yeast, 4-6 parts of butter, 0.4-0.6 parts of composite bacterial powder, and 15-25 parts of water. The yeast is fresh yeast. The composite bacterial powder includes one or more of Lactobacillus acidophilus, Lactobacillus casei, Lactobacillus rhamnosus, Bifidobacterium longum and Bifidobacterium lactis. Replacing sucrose with D-allulose in bread does not affect the normal proofing of bread dough, and the baked bread is fluffy and soft, sweet, and delicious, has good color, aroma, and taste. Because D-allulose has the advantages of low calorie and low blood sugar response, consumers' pursuit of “healthy eating” is met.

Abstract: A method of making an object on a bottom-up stereolithography apparatus is provided. The apparatus includes a light source, a drive assembly, and a controller operatively associated with the light source and the drive assembly, with the light source and/or the drive assembly having at least one adjustable parameter that is adjustable by the controller. The method includes installing a removable window cassette on the apparatus in a configuration through which the light source projects, the window cassette comprising an optically transparent member having a build surface on which an object can be produced, and with the optically transparent member having and at least one variable property therein; and then modifying the at least one adjustable parameter by the controller based on the at least one variable optical property of the window; and then producing the object on the build surface from a light-polymerizable liquid by bottom-up stereolithography.

Abstract: A method of making an object on a bottom-up stereolithography apparatus is provided. The apparatus includes a light source (11), a drive assembly (14), and a controller (15) operatively associated with the light source and the drive assembly, with the light source and/or the drive assembly having at least one adjustable parameter that is adjustable by the controller. The method includes installing a removable window cassette (12) on the apparatus in a configuration through which the light source projects, the window cassette comprising an optically transparent member, provided as a window (12a), having a build surface on which an object can be produced, and with the optically transparent member having and at least one variable property therein; and then modifying the at least one adjustable parameter by the controller based on the at least one variable optical property of the window; and then producing the object on the build surface from a light-polymerizable liquid by bottom-up stereolithography.

Abstract: A method of making an object on a bottom-up stereolithography apparatus is provided. The apparatus includes a light source (11), a drive assembly (14), and a controller (15) operatively associated with the light source and the drive assembly, with the light source and/or the drive assembly having at least one adjustable parameter that is adjustable by the controller. The method includes installing a removable window cassette (12) on the apparatus in a configuration through which the light source projects, the window cassette comprising an optically transparent member, provided as a window (12a), having a build surface on which an object can be produced, and with the optically transparent member having and at least one variable property therein; and then modifying the at least one adjustable parameter by the controller based on the at least one variable optical property of the window; and then producing the object on the build surface from a light-polymerizable liquid by bottom-up stereolithography.

Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.

Abstract: A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third and fourth beams have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. These slopes can be used to determine wafer shape or any localized topography feature.

Abstract: The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle.

Abstract: The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle.