Patents by Inventor Jiaying Ke

Jiaying Ke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ingot puller apparatus having heat shields with voids therein
    Patent number: 11873575
    Abstract: Ingot puller apparatus for preparing a single crystal silicon ingot by the Czochralski method are disclosed. The ingot puller apparatus includes a heat shield. The heat shield has a leg segment that includes a void (i.e., an open space without insulation) disposed in the leg segment. The heat shield may also include insulation partially within the heat shield.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: January 16, 2024
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Jiaying Ke, Sumeet S. Bhagavat, Jaewoo Ryu, Benjamin Meyer, William Luter, Carissima Marie Hudson
  • INGOT PULLER APPARATUS HAVING HEAT SHIELDS WITH FEET HAVING AN APEX
    Publication number: 20230083235
    Abstract: Ingot puller apparatus for preparing a single crystal silicon ingot by the Czochralski method are disclosed. The ingot puller apparatus includes a heat shield. The heat shield has a leg segment that includes a void (i.e., an open space without insulation) disposed in the leg segment. The heat shield may also include insulation partially within the heat shield.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 16, 2023
    Inventors: Jiaying Ke, Sumeet S. Bhagavat, Jaewoo Ryu, Benjamin Meyer, William Luter, Carissima Marie Hudson
  • INGOT PULLER APPARATUS HAVING HEAT SHIELDS WITH VOIDS THEREIN
    Publication number: 20220170176
    Abstract: Ingot puller apparatus for preparing a single crystal silicon ingot by the Czochralski method are disclosed. The ingot puller apparatus includes a heat shield. The heat shield has a leg segment that includes a void (i.e., an open space without insulation) disposed in the leg segment. The heat shield may also include insulation partially within the heat shield.
    Type: Application
    Filed: October 7, 2021
    Publication date: June 2, 2022
    Inventors: Jiaying Ke, Sumeet S. Bhagavat, Jaewoo Ryu, Benjamin Meyer, William Luter, Carissima Marie Hudson