Abstract: A method for interaction between devices based on a pointing operation and an electronic device. The electronic device may be a mobile phone or the like. In the method, a pointing operation performed by a user from a handheld device to a target device is detected via an acceleration sensor, a gyroscope, an IMU, a camera, or the like of the handheld device, and a wireless positioning function of the handheld device is triggered. When it is identified that an axis of the handheld device intersects or approximately intersects with the target device, at least one type of feedback such as visual feedback, sound feedback, and vibration may be provided on the handheld device and/or the target device, login account information and device information of the target device are transmitted to the handheld device, and a target device control window is displayed on the handheld device.

Abstract: Method of forming a radio frequency integrated circuit (RFIC) is provided. The RFIC comprises one or more electronic devices formed in a semiconductor substrate and one or more passive devices on a dielectric substrate, arranged in a stacking manner. Electrical shield structure is formed in between to shield electronic devices in the semiconductor substrate from the passive devices in the dielectric substrate. Vertical through-silicon-vias (TSVs) are formed to provide electrical connections between the passive devices in the dielectric substrate and the electronic devices in the semiconductor substrate.

Abstract: Method of forming a radio frequency integrated circuit (RFIC) is provided. The RFIC comprises one or more electronic devices formed in a semiconductor substrate and one or more passive devices on a dielectric substrate, arranged in a stacking manner. Electrical shield structure is formed in between to shield electronic devices in the semiconductor substrate from the passive devices in the dielectric substrate. Vertical through-silicon-vias (TSVs) are formed to provide electrical connections between the passive devices in the dielectric substrate and the electronic devices in the semiconductor substrate.