Patents by Inventor Jiazhen LIU

Jiazhen LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088631
    Abstract: Provided are an overhead line detection method and system based on a cable inspection robot. The cable inspection robot is suspended on the overhead line. An imaging unit and a laser emission unit are disposed at the front end of the cable inspection robot. The imaging unit is at a first angle to the overhead line. The laser emission unit is at a second angle to the overhead line.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 14, 2024
    Inventors: Jiazhen DUAN, Zheng LU, Hongtao LIU, Ruxin SHI, Wei ZHANG, Yuqin SHU, Zhiwei KAN, Yannan CHEN, Xiaoqiang CHEN, Xianming REN
  • Patent number: 10823996
    Abstract: A display panel includes a cover plate, an array substrate, and an opposite substrate. The array substrate is disposed between the cover plate and the opposite substrate. An edge of a surface of the array substrate away from the cover plate includes a bonding region for bonding at least one circuit, and a portion of a surface of the array substrate close to the cover plate corresponding to the bonding region is fixedly connected to the cover plate. The opposite substrate is assembled face to face with the array substrate.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: November 3, 2020
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jianguo Zhu, Fangyi Liu, Yangli Zheng, Xiaoping Zhang, Xingpan Sun, Le Zhang, Yaodong Wang, Yang Zhang, Luo Zhang, Jiazhen Liu, Yizhe Li, Hui Yin, Qi Jing
  • Publication number: 20190346712
    Abstract: A display panel includes a cover plate, an array substrate, and an opposite substrate. The array substrate is disposed between the cover plate and the opposite substrate. An edge of a surface of the array substrate away from the cover plate includes a bonding region for bonding at least one circuit, and a portion of a surface of the array substrate close to the cover plate corresponding to the bonding region is fixedly connected to the cover plate. The opposite substrate is assembled face to face with the array substrate.
    Type: Application
    Filed: May 3, 2019
    Publication date: November 14, 2019
    Inventors: Jianguo ZHU, Fangyi LIU, Yangli ZHENG, Xiaoping ZHANG, Xingpan SUN, Le ZHANG, Yaodong WANG, Yang ZHANG, Luo ZHANG, Jiazhen LIU, Yizhe LI, Hui YIN, Qi JING