Abstract: A method for manufacturing a component including a bi-metallic sheet includes performing a manufacturing process that heats the bi-metallic sheet and physically constraining the bi-metallic sheet from deformation during the cooling of the bi-metallic sheet. Optionally, the method additionally includes physically constraining the bi-metallic sheet from deformation during the manufacturing process that heats the bi-metallic sheet. A constraining apparatus is also disclosed and includes a first constraining component having a first thermally conductive contact surface adapted to abut a first surface of a metal sheet, a second constraining component having a second contact surface adapted to abut a second surface of the metal sheet, and an engaging device operative to fix the first constraining component and the second constraining component in position relative to one another. The metal sheet is constrained between the first contact surface and the second contact surface during heating and/or cooling.

Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.

Abstract: A plastic-metal hybrid part includes an anodized metal substrate having plastic structures formed on the metal substrate. In a particular embodiment, the metal hybrid part is an electronic device enclosure and plastic structures are mounting features formed on the enclosure. Methods for manufacturing the plastic-metal hybrid part are also disclosed. In a particular embodiment, the metal substrate undergoes a pretreatment, is anodized after the pretreatment, and the plastic structures are molded directly on the anodized exterior surface of the metal substrate. In another embodiment, the anodized metal substrate is primed with a coupling agent before the plastic features are formed thereon.

Abstract: A method for manufacturing a component including a bi-metallic sheet includes performing a manufacturing process that heats the bi-metallic sheet and physically constraining the bi-metallic sheet from deformation during the cooling of the bi-metallic sheet. Optionally, the method additionally includes physically constraining the bi-metallic sheet from deformation during the manufacturing process that heats the bi-metallic sheet. A constraining apparatus is also disclosed and includes a first constraining component having a first thermally conductive contact surface adapted to abut a first surface of a metal sheet, a second constraining component having a second contact surface adapted to abut a second surface of the metal sheet, and an engaging device operative to fix the first constraining component and the second constraining component in position relative to one another. The metal sheet is constrained between the first contact surface and the second contact surface during heating and/or cooling.

Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.

Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.