Patents by Inventor Jicun Lu

Jicun Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic packages with dice landed on wire bonds
    Patent number: 7166924
    Abstract: A stacked dice electronic package without spacers between the dice and where an overlying die is landed on wire bonds of the underlying die is disclosed.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: January 23, 2007
    Assignee: Intel Corporation
    Inventors: Jicun Lu, Charles A. Gealer
  • Electronic packages with dice landed on wire bonds
    Publication number: 20060038273
    Abstract: A stacked dice electronic package without spacers between the dice and where an overlying die is landed on wire bonds of the underlying die is disclosed.
    Type: Application
    Filed: August 17, 2004
    Publication date: February 23, 2006
    Inventors: Jicun Lu, Charles Gealer