Patents by Inventor Jida ZHANG

Jida ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE THEREBY
    Publication number: 20220295646
    Abstract: A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.
    Type: Application
    Filed: May 31, 2022
    Publication date: September 15, 2022
    Inventors: Xianming CHEN, Jian PENG, Jida ZHANG, Benxia HUANG, Lei FENG, Bingsen XIE, Jun GAO
  • Method for manufacturing coreless substrate
    Patent number: 11399440
    Abstract: A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: July 26, 2022
    Assignee: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD
    Inventors: Xianming Chen, Jian Peng, Jida Zhang, Benxia Huang, Lei Feng, Bingsen Xie, Jun Gao
  • TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE THEREBY
    Publication number: 20210410297
    Abstract: A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.
    Type: Application
    Filed: September 30, 2020
    Publication date: December 30, 2021
    Inventors: Xianming CHEN, Jian PENG, Jida ZHANG, Benxia HUANG, Lei FENG, Bingsen XIE, Jun GAO