Patents by Inventor Jie-Bo Peng

Jie-Bo Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7779894
    Abstract: A heat dissipation device includes a heat sink (10) and a blower (50) for generating an airflow to the heat sink. The blower includes a housing (60) and at least one plate (63a, 63b) extending outwardly from the housing. The housing forms a contacting surface (610, 620) abutting a side of the heat sink. The plate includes an inner surface (630) abutting another side of the heat sink. A groove (69) is defined in a junction of the housing and the plate, and thus the contacting surface of the housing and the inner surface of the plate are planar-shaped to avoid interference between the housing of the blower and the heat sink. The groove has chamfer angles R therein. The housing is made by plastic injection molding or die casting.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: August 24, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jie-Bo Peng, Jin-Gong Meng, Ching-Bai Hwang, Jui-Wen Hung
  • Publication number: 20080023176
    Abstract: A heat dissipation device includes a heat sink (10) and a blower (50) for generating an airflow to the heat sink. The blower includes a housing (60) and at least one plate (63a, 63b) extending outwardly from the housing. The housing forms a contacting surface (610, 620) abutting a side of the heat sink. The plate includes an inner surface (630) abutting another side of the heat sink. A groove (69) is defined in a junction of the housing and the plate, and thus the contacting surface of the housing and the inner surface of the plate are planar-shaped to avoid interference between the housing of the blower and the heat sink. The groove has chamfer angles R therein. The housing is made by plastic injection molding or die casting.
    Type: Application
    Filed: July 31, 2006
    Publication date: January 31, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Jie-Bo Peng, Jin-Gong Meng, Ching-Bai Hwang, Jui-Wen Hung
  • Publication number: 20070251675
    Abstract: A thermal module (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12), and a heat pipe (14) including an evaporator section (141) and a curve shaped condenser section (142). The evaporator section of the heat pipe thermally contacts with the heat-generating electronic component, and the condenser section of the heat pipe is disposed on the fin assembly along a longitudinal axis of the fin assembly. The condenser section has a serpentine configuration.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 1, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, JIN-GONG MENG, JIE-BO PENG
  • Publication number: 20070253769
    Abstract: A fastening device (10) for mounting a first member (12) to a second member, the fastening device includes base member (14) and a resilient spring member (15). The base member includes a contacting plate (141) contacting with the second member, and a receiving channel for (147) receiving a portion of the first member therein. The resilient spring member includes two ends for being attached to a board with the second member mounted thereon, and a middle portion contacted with the first member to sandwich the first member between the second member and the spring member.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 1, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHING-BAI HWANG, JIE-BO PENG, JIN-GONG MENG