Abstract: A structural color coating based on Mie scattering of high-refractive index microspheres has the following components in parts by mass: 5 to 20 parts of nano microspheres having a highly uniform particle size and a theoretical refractive index greater than 1.7, 75 to 90 parts of dispersion liquid, 0.1 to 5 parts of a surfactant, and 1 to 5 parts of an adhesive. The structural color coating forms a local microcosmic ordered, macroscopic long-range disordered structural film by means of spraying coating, blade coating, brushing coating, roll coating or dip-coating; the matrix is glass, metal, textile, ceramic, plastic or paper; the surfactant is sodium dodecyl benzene sulfonate, cetyl sodium sulfate, stearic acid, or sodium stearate; the nano microsphere is at least one of ZnS, ZnO, CdS, Cu2O, CaS, CuS, Cu2S, TiO2, ZrO2 or CeO2; the particle size of the nano microspheres ranges from 200 to 500 nm.

Abstract: Methods and systems for depositing rare earth metal carbide containing layers on a surface of a substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process such as an atomic layer deposition process for depositing a rare earth metal carbide containing layer onto a surface of the substrate.

Abstract: In one general aspect, an apparatus can include a semiconductor component, a substrate including a recess, and a conductive-bonding component. The conductive-bonding component is disposed between the semiconductor component and the substrate. The conductive-bonding component has a first thickness between a bottom of the recess and a bottom surface of the semiconductor component greater than a second thickness between the top of the substrate and the bottom surface of the semiconductor component.

Abstract: Methods and systems for depositing threshold voltage shifting layers onto a surface of a substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process, depositing a threshold voltage shifting layer onto a surface of the substrate.

Abstract: Devices and methods for selectively etching a metal nitride layer are disclosed. The methods comprise an oxidation step and an etching step which are optionally separated by a purge, and which can be repeated in a cyclical etching process.

Abstract: The current disclosure relates to methods of forming a vanadium nitride-containing layer. The method comprises providing a substrate within a reaction chamber of a reactor and depositing a vanadium nitride-containing layer onto a surface of the substrate, wherein the deposition process comprises providing a vanadium precursor to the reaction chamber and providing a nitrogen precursor to the reaction chamber. The disclosure further relates to structures and devices comprising the vanadium nitride-containing layer.

Abstract: In one general aspect, a package can include a first submodule including a first semiconductor die coupled to a first substrate and a first spacer, and disposed between the first spacer and the first substrate. The first submodule includes a second spacer disposed lateral to the first semiconductor die. The package includes a second submodule including a second semiconductor die coupled to a second substrate and a third spacer, and disposed between the third spacer and the second substrate. The second submodule includes a fourth spacer disposed lateral to the second semiconductor die. The package includes an inter-module layer disposed between the first submodule and the second submodule. The first spacer of the first submodule is electrically coupled to the fourth spacer of the second-submodule via the inter-module layer. The second spacer of the first submodule is electrically coupled to the third spacer of the second-submodule via the inter-module layer.

Abstract: A method for preparing a large-area structural chromogenic pattern by ink-jet printing, a structural chromogenic pattern obtained by the method, and an anti-counterfeiting method based on a structural color change. A dispersion liquid containing mono-disperse colloidal microspheres with high index of refraction is printed onto a piece of paper by using an ink-jet printer, and nano-microspheres are arranged and assembled on the paper to obtain a micro-structure having the features of being ordered from a short distance and disordered from a long distance. A pretty structural color can be observed by means of the interaction of the structure with light, thus displaying a pattern, changing the angle of observation, changing the brightness of the structural color, and hiding and displaying the pattern. The method is simple and convenient, is widely applicable, and can achieve the preparation and anti-counterfeiting of a large-area structural color without external stimulation.

Abstract: The present disclosure is relates to a leather material and a manufacturing method thereof. The leather material includes a substrate, a TPU adhesive layer and at least one TPU surface layer. The substrate includes a first surface and a second surface. The TPU adhesive layer is disposed on the first surface of the substrate. The at least one TPU surface layer is disposed on the TPU adhesive layer. The at least one TPU surface layer includes an exposing surface having a texture of micro suede or micro nubuck. The leather material of the present invention utilizes the TPU material, and has a texture of micro suede or micro nubuck to have an appearance of leather. In addition, the leather material of the present invention has high peeling strength and high wear resistance to obtain the predetermined mechanical strength.

Abstract: Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

Abstract: An anti-tremor device including a tool unit, a carrying portion, and an anti-tremor module is disclosed. The tool unit is coupled or mounted on the carrying portion. The anti-tremor module is disposed on the carrying portion. The anti-tremor module includes a rotary transmission mechanism and a control module. The control module includes a sensing unit and a control unit. The sensing unit is coupled to the control unit, and the control module is coupled to the rotary transmission mechanism. When the sensing unit senses the tremor of the carrying portion, the control unit controls the rotary transmission mechanism to increase the inertia of the anti-tremor module to eliminate or reduce the tremor of the carrying portion.

Abstract: Provided is a block copolymer composition which contains a block copolymer having a specific molecular structure and has a molecular weight distribution within an appropriate range. A polymerizable composition containing a macromonomer (A) which has a group having a radical-reactive unsaturated double bond at one terminal of a poly(meth)acrylate segment, a vinyl monomer (B), and an organic iodine compound (C), or a polymerizable composition containing a macromonomer (A), a vinyl monomer (B), an azo-based radical polymerization initiator (E), and iodine is polymerized to obtain a block copolymer composition containing a block copolymer in which constitutional units of all blocks are derived from vinyl monomers and at least one block has a branched structure.

Abstract: Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

Abstract: A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.

Abstract: Methods, devices and systems for correcting a count loss in a Position Emission Computed Tomography (PET) system are provided. In one aspect, a method includes: constructing a virtual system including a plurality of virtual crystals, determining, for each of virtual Lines of Response (LORs) in the virtual system, a plurality of real LORs corresponding to the virtual LOR in the PET system, each of the real LORs corresponding to a scanning state of the PET system with a continuous incremental scanning mode, determining a count loss correction factor of the corresponding real LOR in each of the scanning states, determining a count loss correction factor of the virtual LOR according to the determined count loss correction factors of the plurality of real LORs corresponding to the virtual LOR, and performing count loss correction for the virtual LOR according to the determined count loss correction factor of the virtual LOR.

Abstract: Methods, devices and apparatus for reconstructing an image are provided. In an aspect, a method includes: obtaining coincidence events detected by crystal pairs in a detector of a PET device by scanning a phantom, reconstructing a phantom image according to the coincidence events, and obtaining a time calibration amount of each of crystals in the detector by determining a crystal based source position deviation and a crystal based source time difference of a crystal pair including the crystal according to the phantom image, determining a time difference of the crystal pair according to respective time differences for the crystal pair detecting a plurality of coincidence events, pre-calibrating the time difference of the crystal pair with the crystal based source time difference, and obtaining the time calibration amount of the crystal according to the pre-calibrated time difference of the crystal pair.

Abstract: In one general aspect, a package can include a first submodule including a first semiconductor die coupled to a first substrate and a first spacer, and disposed between the first spacer and the first substrate. The first submodule includes a second spacer disposed lateral to the first semiconductor die. The package includes a second submodule including a second semiconductor die coupled to a second substrate and a third spacer, and disposed between the third spacer and the second substrate. The second submodule includes a fourth spacer disposed lateral to the second semiconductor die. The package includes an inter-module layer disposed between the first submodule and the second submodule. The first spacer of the first submodule is electrically coupled to the fourth spacer of the second-submodule via the inter-module layer. The second spacer of the first submodule is electrically coupled to the third spacer of the second-submodule via the inter-module layer.

Abstract: Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

Abstract: Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.