Patents by Inventor Jie Chen

Jie Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240223676
    Abstract: Provided is an Ethernet frame framing method and device. The method includes: a receiving end receiving a data stream with a fine granularity-basic unit (Fg-BU); and the receiving end judging whether an Fg-BU frame is locked or unlocked according to whether the Fg-BU frame in the data stream is normal. In the present disclosure, the receiving end may judge whether the Fg-BU frame is locked or unlocked according to whether the received Fg-BU frame is normal.
    Type: Application
    Filed: January 28, 2022
    Publication date: July 4, 2024
    Inventors: Jian YANG, Jie CHEN, Feng LIU
  • Publication number: 20240223813
    Abstract: A method of decoding a bitstream to output one or more pictures for a video stream, includes: receiving a bitstream; and decoding, using coded information of the bitstream, one or more pictures. The decoding includes: determining, based on an identifying number, whether a face video generative compression scheme is used; in response to a determination that the face video generative compression scheme is used, decoding a supplemental enhancement information (SEI) message, the SEI message comprising facial information; and reconstructing a face picture based on the facial information and a base picture associated with the SEI message.
    Type: Application
    Filed: December 21, 2023
    Publication date: July 4, 2024
    Inventors: Bolin CHEN, Jie CHEN, Shurun WANG, Yan YE, Shiqi WANG
  • Publication number: 20240212399
    Abstract: An automobile diagnosis system and method, and a cloud server. The system includes a cloud server, an end-side device, and at least one edge node; wherein, the cloud server is in communication connection with each edge node, and is used for acquiring diagnosis instructions to generate diagnosis data and vehicle communication logics, and sending the diagnosis data and the vehicle communication logics to an edge node having the minimum communication delay with the end-side device; the edge node is used for performing data interaction with the end-side device to acquire diagnosis results and send the diagnosis results to the cloud server; and the end-side device is in communication connection with the edge node and a vehicle, and is used for sending vehicle data of the vehicle and the diagnosis results to the edge node.
    Type: Application
    Filed: March 18, 2022
    Publication date: June 27, 2024
    Applicant: Xi'an Autel Intelligent Technology Co., Ltd.
    Inventors: Jie CHEN, Liang TANG
  • Publication number: 20240213783
    Abstract: This application provides an inverter, a power grid power supply system, and a method for controlling an excitation inrush current. The controller adjusts the output voltage of the conversion circuit based on a first phase that is of the output voltage of the conversion circuit and that is during reduction of the output voltage, the magnetic flux of the iron core in the transformer, an output voltage that is of the conversion circuit and that is after the output voltage is reduced, and the target voltage value, so as to increase the output voltage of the conversion circuit and keep the magnetic flux of the iron core less than the saturation magnetic flux.
    Type: Application
    Filed: December 21, 2023
    Publication date: June 27, 2024
    Inventors: Mingxuan Dong, Shuo Wang, Jie Chen, Wenchao Li, Mingquan Zhao, Kai Xin
  • Publication number: 20240210633
    Abstract: A semiconductor package includes a semiconductor die, a device layer over the semiconductor die and including an optical device, an insulator layer over the device layer, a buffer layer over the insulator layer, an etch stop layer between the device layer and the insulator layer, a connective terminal, and a bonding via passing through the device layer and electrically connecting the semiconductor die to the connective terminal. The conductive terminal passes through the etch stop layer, the insulator layer, and the buffer layer. The conductive terminal is in direct contact with the etch stop layer.
    Type: Application
    Filed: March 11, 2024
    Publication date: June 27, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Jie Chen, Ming-Fa Chen
  • Publication number: 20240212235
    Abstract: An electronic device includes: a memory storing at least one instruction; and at least one processor configured to execute the at least one instruction to: change a plurality of non-straight lines in a handwritten image to a plurality of straight lines, identify, based on the plurality of straight lines, a first corner in the handwritten image, identify, based on the first corner, a plurality of spaces in the handwritten image, and obtain a floor map image including the plurality of spaces.
    Type: Application
    Filed: January 5, 2024
    Publication date: June 27, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sukun YOON, Jie CHEN, Longhai WU, Juan LIU, Minji KIM, Jinho KIM, Hyungsuk LEE
  • Patent number: 12021632
    Abstract: Systems, methods, apparatuses, and computer program products for inconsistency free pipelined hybrid automatic repeat request scheme for non-terrestrial network channels. A method may include reserving or receiving reservation of physical layer resources exclusively for redundant transmission; allocating the physical layer resources and a predetermined number of transmit blocks, wherein the predetermined number of transmit blocks are associated with a downlink control information (DCI); checking a number of hybrid automatic repeat request process identifiers that are eligible for redundant transmission; and splitting the physical layer resources based on the number of hybrid automatic repeat request process identifiers that are eligible for redundant transmission.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: June 25, 2024
    Assignee: Nokia Technologies Oy
    Inventors: Fanny Jardel, Rafhael Amorim, Jie Chen
  • Publication number: 20240205447
    Abstract: A method for performing motion compensation includes: receiving a first wrap-around motion compensation flag associated with one or more pictures, and a second wrap-around motion compensation flag associated with a sequence of pictures; and determining whether the first wrap-around motion compensation flag is equal to a first value or a second value based on the second wrap-around motion compensation flag or a luma coding tree block size: when the second wrap-around motion compensation flag is equal to the second value, determining the first wrap-around motion compensation flag equal to the second value, or when the luma coding tree block size in unit of minimum coding block plus 1 is greater than a picture width in unit of minimum coding block minus 1, determining the first wrap-around motion compensation flag is equal to the second value.
    Type: Application
    Filed: February 28, 2024
    Publication date: June 20, 2024
    Inventors: Jie CHEN, Yan YE, Ru-Ling LIAO, Jiancong LUO
  • Publication number: 20240200159
    Abstract: Disclosed is a method for a compound strengthening treatment of a gear surface, belonging to the technical field of gear surface treatment, including following steps: firstly, performing a compound shot peening treatment on the gear surface, and then performing molybdenum disulfide micro-particle thermal spraying on the obtained gear surface to complete the compound strengthening treatment on the gear surface.
    Type: Application
    Filed: December 14, 2022
    Publication date: June 20, 2024
    Inventors: Yong CHEN, Hui YOU, Xiaoze LIN, Guangxin LI, Jie CHEN, Yanjun TAN, Li LUO
  • Publication number: 20240203947
    Abstract: A package includes a first die, a second die, and an encapsulant. The first die includes a first capacitor. The second die includes a second capacitor. The second die is stacked on the first die. The first capacitor is spatially separated from the second capacitor. The first capacitor is electrically connected to the second capacitor. The encapsulant laterally encapsulates the second die.
    Type: Application
    Filed: February 26, 2024
    Publication date: June 20, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Jie Chen, Ming-Fa Chen
  • Publication number: 20240202084
    Abstract: Systems, apparatus and methods are provided for performing cache program operations in a non-volatile storage system. A method may comprise issuing a first cache program operation from a storage controller to a non-volatile storage device to write data to a first regular block, writing the data to the first regular block and a copy of the data to a backup block, determining that a program error has occurred while writing the data to the first regular block, asserting the program error to the storage controller, retrieving a mapping between the first regular block and the backup block, issuing a read operation to read the copy of the data from the backup block, reading the copy of the data from the backup block and issuing a second cache program operation to write the data to a second regular block and marking the first regular block as defective.
    Type: Application
    Filed: February 26, 2024
    Publication date: June 20, 2024
    Inventors: Gang Zhao, Lin Chen, Jie Chen, Qun ZHAO
  • Patent number: 12015788
    Abstract: The present disclosure provides systems and methods for signaling and using a palette mode in video processing. According to certain disclosed embodiments, an exemplary video processing method includes: receiving a first palette entry for palette coding a target coding unit (CU); determining whether the target CU is part of a single-tree slice; determining whether the target CU is coded with separate luma and chroma trees; and in response to the target CU being determined to be part of a single-tree slice and be coded with separate luma and chroma trees, decoding a first component of the target CU based on the first palette entry, and decoding a second component of the target CU based on a default palette entry.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: June 18, 2024
    Assignee: Alibaba Group Holding Limited
    Inventors: Mohammed Golam Sarwer, Ru-Ling Liao, Yan Ye, Jiancong Luo, Jie Chen
  • Patent number: 12013265
    Abstract: An infrared sensing module includes a reflecting portion, a driving portion, an infrared light emitter and an infrared light receiver. The driving portion is connected to the reflecting portion, and the driving portion drives the reflecting portion to rotate, and an infrared reflecting layer of the reflecting portion faces the infrared light emitter and the infrared light receiver when the reflecting portion rotates to a preset position.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: June 18, 2024
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventors: Jie Chen, Xujun Mao
  • Patent number: 12009316
    Abstract: A semiconductor structure includes a first die having a first surface and a second surface opposite to the first surface, a conductive bump disposed at the first surface, and an RDL under the conductive bump. The RDL includes an interconnect structure and a dielectric layer, and the interconnect structure is electrically connected to the first die through the conductive bump. The semiconductor structure further includes a molding over the RDL and surrounding the first die and the conductive bump, an adhesive over the molding and the second surface, and a support element over the adhesive. A method includes providing a first die having a first surface and a second surface, a redistribution layer over the first surface, and a molding surrounding the first die; removing a portion of the molding to expose the second surface; and attaching a support element over the molding and the second surface.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsien-Wen Liu, Hsien-Wei Chen, Jie Chen
  • Patent number: 12009386
    Abstract: Methods of forming a super high density metal-insulator-metal (SHDMIM) capacitor and semiconductor device are disclosed herein. A method includes depositing a first insulating layer over a semiconductor substrate and a series of conductive layers separated by a series of dielectric layers over the first insulating layer, the series of conductive layers including device electrodes and dummy metal plates. A first set of contact plugs through the series of conductive layers contacts one or more conductive layers of a first portion of the series of conductive layers. A second set of contact plugs through the series of dielectric layers avoids contact of a second portion of the series of conductive layers, the second portion of the series of conductive layers electrically floating.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsien-Wei Chen, Ying-Ju Chen, Jie Chen, Ming-Fa Chen
  • Patent number: 12009841
    Abstract: Systems and methods are provided for performing error recovery using LLRs generated from multi-read operations. A method may comprise selecting a set of decoding factors for a multi-read operation to read a non-volatile storage device multiple times. The set of decoding factors may include an aggregation mode for aggregating read results of multiple reads. The method may further comprise issuing a command to the non-volatile storage device to read user data according to the set of decoding factors, generating a plurality of Log-Likelihood Ratio (LLR) values using a mapping engine from a pre-selected set of LLR value magnitudes based on the set of decoding factors, obtaining an aggregated read result in accordance with the aggregation mode and obtaining an LLR value from the plurality of LLR values using the aggregated read result as an index.
    Type: Grant
    Filed: November 12, 2022
    Date of Patent: June 11, 2024
    Assignee: Innogrit Technologies Co., Ltd.
    Inventors: Han Zhang, Chenrong Xiong, Jie Chen
  • Publication number: 20240187570
    Abstract: A video processing method includes: determining whether an inter predictor correction is enabled for a coding block; and when the inter predictor correction is enabled for the coding block, performing the inter predictor correction by: obtaining a plurality of predicted samples from a top boundary and a left boundary of a predicted block corresponding to the coding block; obtaining a plurality of reconstructed samples from top neighboring reconstructed samples and left neighboring reconstructed samples of the coding block; and deriving a corrected predicted block based on the plurality of the predicted samples, the plurality of the reconstructed samples and the predicted block.
    Type: Application
    Filed: February 14, 2024
    Publication date: June 6, 2024
    Inventors: Xinwei LI, Jie CHEN, Ru-Ling LIAO, Yan YE
  • Patent number: 12000319
    Abstract: The invention provides a three-way catalytic converter preheating control method and system, a vehicle and a storage medium. The includes when the temperature of an exhaust pipe of the hybrid electric vehicle is lower than a first temperature threshold value, sending a first work instruction; the high-low pressure conversion module outputting a first working voltage according to the first working instruction so as to start preheating of a catalyst in a three-way catalytic converter; when working data of the hybrid electric vehicle meets the switching condition, sending a second working instruction to make the high-low voltage conversion module outputs a second working voltage and stops outputting the first working voltage so as to stop the electric heating. According to the invention, two working modes can be provided, and the power battery can be used for electrically heating the catalyst in advance through the high-low pressure conversion module.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: June 4, 2024
    Assignees: Zhejiang Geely Holding Group Co., Ltd., Ningbo Geely Royal Engine Components Co., Ltd., Aurobay Technology Co., Ltd.
    Inventors: Junqi Liu, Chen Yang, Shubo Li, Rongchun Ma, Jie Chen, Xudong Sun, Yige Xiao, Ruiping Wang
  • Patent number: 12002778
    Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die and a plurality of bumps. The first semiconductor die has a front side and a backside opposite to each other. The second semiconductor die is disposed at the backside of the first semiconductor die and electrically connected to first semiconductor die. The plurality of bumps is disposed at the front side of the first semiconductor die and physically connects first die pads of the first semiconductor die. A total width of the first semiconductor die may be less than a total width of the second semiconductor die.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh, Jie Chen
  • Patent number: D1032896
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: June 25, 2024
    Inventor: Jia Jie Chen