Patents by Inventor Jie-Feng Zhang

Jie-Feng Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080176438
    Abstract: A socket connector (1) for connecting an IC package to a printed circuit board includes a base (10) mounting a plurality of conductive terminals therein. A cover (13) assembled on the base (10) and sliding along a first direction relative to the base defines a pair of sidewalls (132, 133) extending downwardly therefrom. An actuating lever (14) drives the cover (13) sliding on the base (10). The sidewalls (132, 133) of the cover (13) are fitly engaging with corresponding sides (111, 112) of the base (10) except a releasing slot (1110, 1120) defined between part portion of the sidewall and the side.
    Type: Application
    Filed: January 22, 2008
    Publication date: July 24, 2008
    Inventors: Jie-Feng Zhang, Wen He, Qi-Jin Yi, Yao-Chi Huang
  • Patent number: 7396248
    Abstract: An LGA connector (1) includes an housing (2), a stiffener (3) surrounding the housing, a clip (5) pivotably engaged the stiffener, and a lever (4) engaged with the stiffener for pressing the clip. The housing has a supporting portion (21) and a mounting portion (22) having four mating faces surrounding the supporting portion. Each mating face includes at least one spring latch (24) extending outwardly therefrom and a cavity (241) defined on the spring latch for engaging with the stiffener.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: July 8, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Jie-Feng Zhang
  • Publication number: 20080113545
    Abstract: A land grid array connector (100) has a stiffener defining a window (305) thereon, a metal clip (40) pivotably coupling with stiffener, a lever (50) engaging on the stiffener, a housing (10) received in the window of the stiffener and a number of contacts mounted to the housing. The lever includes a pair of locating portions (501) and an offset actuating portion (503) disposed between the locating portions. The clip includes a projecting portion (400) having a depress portion (405) for receiving the offset actuating portion of the lever, a protruding portion (406) bending upwardly and inwardly from an end of the depress portion and a pair of guiding portions (4060) extending outwardly from the protruding portion for resisting against opposite ends of the offset actuating portion.
    Type: Application
    Filed: November 13, 2007
    Publication date: May 15, 2008
    Inventors: Jie-Feng Zhang, Wen He
  • Publication number: 20080102682
    Abstract: An electrical socket comprises an insulative housing including a base with a cover moveably assembled thereon. An actuator is arranged between the base and the cover, and has a lever and a cam device to move the cover from a first position to a second position, wherein an interengaging arrangement is arranged between the lever and the housing, and has guiding means for properly positioning the lever and the cover in the second position easily.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 1, 2008
    Inventors: Qi-Jin Yi, Jie-Feng Zhang
  • Publication number: 20080064230
    Abstract: An LGA connector (1) includes an housing (2), a stiffener (3) surrounding the housing, a clip (5) pivotably engaged the stiffener, and a lever (4) engaged with the stiffener for pressing the clip. The housing has a supporting portion (21) and a mounting portion (22) having four mating faces surrounding the supporting portion. Each mating face includes at least one spring latch (24) extending outwardly therefrom and a cavity (241) defined on the spring latch for engaging with the stiffener.
    Type: Application
    Filed: September 13, 2007
    Publication date: March 13, 2008
    Inventor: Jie-Feng Zhang
  • Publication number: 20080057751
    Abstract: An electrical connector (1) for electrically connecting an electrical chip to a printed circuit board includes a base (3), a number of contacts, a stiffener (4) partially surrounding the base, a metal clip (5) pivotally assembled to one end of the stiffener, and a lever (6) pivotally assembled to opposite the other end of the stiffener. The base has a number of contact receiving passageways, and includes a mounting surface (314) for arranging the electrical chip and opposite connecting surface (315) for positioning to the printed circuit board. The contacts are received in the contact receiving passageways of the main body. The base defines a plurality of through slots (310) extending from mounting surface to the connecting surface thereof for transferring heat produced by the electrical chip outwardly.
    Type: Application
    Filed: September 4, 2007
    Publication date: March 6, 2008
    Inventor: Jie-Feng Zhang
  • Publication number: 20080050959
    Abstract: A ZIF socket connector comprises a base defining a plurality of passageway therein and each received therein a contact terminal therein. The base defines a first and second end. A cover is moveably attached to the base in a direction from the first end to the second end of the base, and defines a plurality of guiding holes each aligned with the passageway. An actuating lever with a cam portion is disposed in the first end of the housing, and is interengaged with the cover so as to move the cover on the base along the direction. The cover includes a top surface. A pick up cap is disposed on the top surface of the cover, and includes a first end disposed on the top surface of the cover, and a second end interlocked to a sidewall of the base at the second end. The first end of the pickup cap is released when the cover is moved away from the second end of the base.
    Type: Application
    Filed: August 22, 2007
    Publication date: February 28, 2008
    Inventors: Jie-Feng Zhang, Qi-Jin Yi
  • Publication number: 20080026629
    Abstract: An electrical connector (10) includes a base (101), and a cover (102) locatable above the base. The base has a major surface (1011) with a plurality of terminal receiving passageways (1010) extending therefrom. The cover has a major face (1025) opposite the major surface and spaced apart from the major surface of the base. A plurality of discrete protrusions (1012) is arranged extending longitudinally from one of said major face and said major surface towards the other, and positionable adjacent the passageways. Thus, a plurality of voids is located laterally adjacent the discrete protrusions and between the major surface of the base and the major face of the cover, thereby allowing the heat from pin-like conductive elements (21) of a CPU chip (20) to be dissipated through the plurality of laterally voids around the pin-like conductive elements.
    Type: Application
    Filed: July 30, 2007
    Publication date: January 31, 2008
    Inventors: Lu Zhao, Yao-Chi Huang, Wen He, Qi-Jin Yi, Jie-Feng Zhang