Abstract: An adjustment device, an air duct structure, an exhaust system, a dishwasher, and a method for controlling the dishwasher are provided. The adjustment device is applied in an exhaust system. The exhaust system has an exhaust channel with a second air inlet and a first air inlet. The adjustment device includes an adjustment mechanism and a controller. The adjustment mechanism is configured to, under control of the controller, respectively adjust a flow rate of a first gas entering the exhaust channel through the first air inlet and a flow rate of a second gas entering the exhaust channel through the second air inlet, to control a ratio of the first gas entering the exhaust channel to the second gas entering the exhaust channel. Humidity of the second gas is lower than humidity of the first gas.

Abstract: A voice interaction method and a related apparatus are provided. When a voice assistant is not woken up, an electronic device may recognize whether a detected voice matches a preset intention. If the voice matches the intention, the electronic device may perform an operation corresponding to the intention that matches the voice, and wake up the voice assistant. After waking up the voice assistant, the electronic device can more accurately respond to a subsequent request of a user. If there is no voice interaction in a preset time period after the voice assistant is woken up, the electronic device may switch the voice assistant from a wake-up state to a sleep state.

Abstract: The present application provides an apparatus and a method for preparing an electrode assembly. The apparatus includes: a heating apparatus configured to heat a separator to be wound; and a winding apparatus configured to wind an anode plate, a cathode plate and the heated separator to form an electrode assembly. The apparatus can realize effective heating of the separator, improving the quality of the electrode assembly.

Abstract: A coating apparatus and substrate processing equipment are provided, including: a coating die head, where the coating die head has a first coating port, and the first coating port is disposed corresponding to the substrate and is used for the slurry to flow out and applying the slurry onto the substrate to form a first coating area; and an air blowing module disposed downstream of the coating die head in a movement direction of the substrate, where the air blowing module is disposed on a side of the substrate coated with the slurry, the air blowing module includes an air outlet, the air outlet is disposed corresponding to an edge of the first coating area, the air outlet is used for blowing air along a first direction to the edge of the first coating area to reduce thickness of the slurry at the edge of the first coating area.

Abstract: An adjustment device, an air duct structure, an exhaust system, a dishwasher, and a method for controlling the dishwasher are provided. The adjustment device is applied in an exhaust system. The exhaust system has an exhaust channel with a second air inlet and a first air inlet. The adjustment device includes an adjustment mechanism and a controller. The adjustment mechanism is configured to, under control of the controller, respectively adjust a flow rate of a first gas entering the exhaust channel through the first air inlet and a flow rate of a second gas entering the exhaust channel through the second air inlet, to control a ratio of the first gas entering the exhaust channel to the second gas entering the exhaust channel. Humidity of the second gas is lower than humidity of the first gas.

Abstract: High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.

Abstract: Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.

Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Abstract: An artificial intelligence (AI)-based speech recognition method includes steps for obtaining a target speech signal, determining a target language type of the target speech signal, and outputting text information of the target speech signal using a real-time speech recognition model corresponding to the target language type. The real-time speech recognition model is obtained by training a training set including an original speech signal and an extended speech signal, and the extended speech signal is obtained by converting an existing text of a basic language type.

Abstract: Some implementations of the disclosure describe a solder paste consisting essentially of: 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of a Sn—Sb alloy, a Sn—Ag—Cu—Sb alloy, a Sn—Ag—Cu—Sb—In alloy, a Sn—Ag—Cu—Sb—Bi alloy, or Sn—Ag—Cu—Sb—Bi—In alloy; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn—Ag—Cu alloy or Sn—Ag—Cu—Bi alloy, and the second solder alloy powder having a lower solidus temperature than the first solder alloy powder; and flux.

Abstract: Provided are a bubble generation apparatus and a washing device, the bubble generation apparatus includes a gas dissolution chamber, a bypass member, and a bubbler. The gas dissolution chamber has a vent opening, a liquid inlet, and a liquid outlet, the bypass member has a gradually contracting section, a throat part, and a gradually expanding section which are connected in sequence from a bypass inlet to a bypass outlet; the bubbler is connected to the liquid outlet, the bypass inlet or bypass outlet of the bypass member is connected to the liquid inlet to supply liquid into the gas dissolution chamber, and the throat part is connected to the vent opening or a gas storage space in the gas dissolution chamber.

Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Abstract: Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.

Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Abstract: High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.