Abstract: An array substrate (100) and a display device. The array substrate (100) includes a bonding area (102). The array substrate (100) includes a substrate (10), a first conductive layer (20) on the substrate (10), a first insulating layer (30) on one side of the first conductive layer (20) away from the substrate (10), and a second conductive layer (40) on one side of the first insulating layer (30) away from the substrate (10). The bonding area (102) is provided with bonding pins (201), and the bonding pin (201) includes a first conductive portion (21) and a second conductive portion (41) located on the side of the first conductive portion (21) away from the substrate (10), the first conductive portion (21) is located in the first conductive layer (20), the second conductive portion (41) is located in the second conductive layer (40), and the first conductive portion (21) is in direct contact with the second conductive portion (41).

Abstract: A wiring substrate includes: a base substrate; and a plurality of control areas on one side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas including: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which being electrically connected with the corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, orthographic projections of the first connection lines on the base substrate not overlapping with orthographic projections of the signal lines on the base substrate.

Abstract: A display substrate and a display apparatus are provided. The display substrate includes a base substrate, a first conductive layer, a second conductive layer and an insulation layer. The first conductive layer is on a side of the base substrate and includes a first conductive part extending in a first direction, the second conductive layer is on a side of the first conductive layer facing away from the base substrate, and the insulation layer is located between the first conductive layer and the second conductive layer. At least one first conductive part includes a first hollowed-out portion including a plurality of groove structures distributed in a second direction and extending in the first direction. The first direction and the second direction produce angles.

Abstract: The present disclosure provides a light-emitting substrate, a backlight and a display device. The light-emitting substrate includes a light-emitting region and a peripheral region surrounding the light-emitting region. The peripheral region includes a first area, the first area is located between a first side of the light-emitting substrate and the light-emitting region, the light-emitting substrate further includes a first signal line, the first signal line includes at least one selected from a group consisting of a first portion and a second portion, the first portion of the first signal line extends along a first direction in the first area, the second portion of the first signal line extends into the light-emitting region, the first portion and the second portion of the first signal line are connected when the first signal line includes the first portion and the second portion.

Abstract: The present application relates to processes for the preparation of quinolone compounds and intermediates thereof, particularly to processes for the preparation of quinolones and pharmaceutical intermediates of the quinolones. In particular, the present application provides a process for the preparation of a compound of Formula I, and a process for the synthesis of quinolone compounds using the compound of Formula I as an intermediate.

Abstract: A backplane, a backlight source, an illumination device and a displaying device. The backplane comprises a substrate; a first metal trace layer disposed on one surface of the substrate; an insulating layer disposed on a side, away from the substrate, of the first metal trace layer; a second metal trace layer disposed on a side, away from the substrate, of the insulating layer, an overlapping area existing between an orthographic projection of the second metal trace layer on the substrate and an orthographic projection of the first metal trace layer on the substrate; and a barrier layer disposed between the first metal trace layer and the second metal trace layer, an orthographic projection of the barrier layer on the substrate covering the overlapping area, and the barrier layer being used for preventing metals in the first metal trace layer and the second metal trace layer from growing towards each other.

Abstract: A light-emitting substrate includes a base, a first conductive pattern layer disposed on the base and a second conductive pattern layer disposed on a side of the first conductive pattern layer away from the base. The first conductive pattern layer includes first signal lines. The second conductive pattern layer includes lamp bead pads. The lamp bead pads include first lamp bead pads and at least one second lamp bead pad. A vertical projection of each first lamp bead pad on the base at least partially overlaps with a vertical projection of a first signal line on the base. A vertical projection of each second lamp bead pad on the base is outside vertical projections of the first signal lines on the base. A distance between a first lamp bead pad and the base is substantially the same as a distance between a second lamp bead pad and the base.

Abstract: A display substrate, a manufacturing method therefor and a display device are provided. The display substrate includes a substrate structure layer, the substrate structure layer includes a substrate material layer, a sacrificial layer and an optical film layer between the substrate material layer and the sacrificial layer which are stacked; a reflectivity of the optical film layer is greater than a transmittance of the optical film layer.

Abstract: An array substrate is provided. The array substrate is provided with an avoidance opening at an edging thereof, an orthographic projection of the avoidance opening on a first reference plane having a first edge. The array substrate includes a substrate and at least one positioning structure. The at least one positioning structure is provided on a side of the substrate. A positioning structure includes a main portion, the main portion being substantially parallel to the first edge. The first reference plane is a plane where a surface, away from the positioning structure, of the substrate is located.

Abstract: An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.

Abstract: The present disclosure provides a drive base plate, a light-emitting base plate, a display device, and a manufacturing method for the drive base plate. The drive base plate includes: a substrate; and a first conductive layer and a first block layer disposed on the substrate, the first conductive layer includes multiple first conductive portions arranged at intervals, and each of the first conductive portions includes a first contact pad; the first block layer includes first hollowed-out regions, each of the first hollowed-out regions corresponds to a respective first contact pads, an orthographic projection of the first contact pad on the substrate is within the orthographic projection of the first hollowed-out region on the substrate, and the material of the first block layer includes an oxidation-resistant material.

Abstract: The present application relates to processes for the preparation of quinolone compounds and intermediates thereof, particularly to processes for the preparation of quinolones and pharmaceutical intermediates of the quinolones. In particular, the present application provides a process for the preparation of a compound of Formula I, and a process for the synthesis of quinolone compounds using the compound of Formula I as an intermediate.

Abstract: The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.

Abstract: Provided is a wiring substrate. The wiring substrate includes: a base, including a functional region, a bonding region, and a connecting region; a first conductive layer, disposed on a side of the base and in the functional region and the connecting region; a first insulative layer, disposed on a side of the first conductive layer and in the functional region, the connecting region, and the bonding region, wherein a first via is defined in a portion of the first insulative layer and is configured to expose the first conductive layer; a second conductive layer, disposed on a side of the first insulative layer and in the connecting region and the bonding region, and electrically connected to the first conductive layer; and a second insulative layer, disposed on a side of the second conductive layer and in the connecting region and the functional region.

Abstract: The present disclosure provides a driving backplane, a light emitting substrate, a backlight module, and a display apparatus, which belongs to the field of display technology. The driving backplane includes a base substrate, a driving layer and an encapsulation layer sequentially laminated. The driving layer has a pad for binding an electronic element and a raised block corresponding to the pad, the pad is located on a side of the corresponding raised block away from the base substrate (BP), and an orthographic projection of the pad on the base substrate is located within an orthographic projection of the corresponding raised block on the corresponding base substrate. The encapsulation layer has a binding opening. The pad and the raised block are located in the binding opening.

Abstract: A touch panel includes a substrate, a touch driving electrode disposed on the substrate, and a touch sensing electrode disposed on the substrate, at least one of the touch driving electrode and the touch sensing electrode has a metal mesh-like structure including nodes, each node includes a first protruding structure and a second protruding structure distributed on both sides of a mesh bar, and the first protruding structure and the second protruding structure are arranged in a staggered manner along an extension direction of the mesh bar. The mesh-like structure includes a first mesh bar and a second mesh bar directly connected to both ends of the node respectively, and a center line of the first mesh bar does not coincide with a center line of the second mesh bar.

Abstract: The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.

Abstract: A light-emitting substrate comprises a plurality of signal channels arranged in sequence along a row direction. Each signal channel comprises a plurality of control areas arranged along a column direction, and each control area comprises at least one light area controlled by a same chip. In each signal channel, the light-emitting substrate is provided with a first driving line, a second driving line, and a plurality of reference power lines. The first driving line and the second driving line are respectively used for providing different driving signals to the chip. The reference power line is used for providing a reference power supply voltage to the chip. The reference power lines in a same signal channel are electrically connected, and at least one reference power line is provided between the first driving line and the second driving line.

Abstract: An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.

Abstract: A touch panel includes: a substrate; a bridging layer; an insulating layer; and a touch layer, including a first touch area and a border area surrounding the first touch area; the border area includes at least one second touch area, and the second touch area includes a plurality of button portions; a second shielding body is disposed between the second touch area and the first touch area; the border area further includes a bonding area for bonding with a driving circuit board; the second shielding body is provided with at least one wire groove, and at least one touch wire is coupled to the bonding area by passing through the wire groove; and the touch layer is disposed on a surface of the insulating layer away from the substrate, and at least two adjacent shielding units are coupled by the bridging layer.